IP Library › Granted Patent US 11,594,280
Granted Patent B2
US 11,594,280 · App. 17/390,998 · Granted Feb 28, 2023

Content addressable memory device having electrically floating body transistor

Inventors: Benjamin S. Louie (Fremont, CA); Jin-Woo Han (San Jose, CA); Yuniarto Widjaja (Cupertino, CA)
Assignee: Zeno Semiconductor, Inc.
G11C15/04G11C15/046H01L27/10802G11C11/404G11C16/0458G11C16/0475G11C2211/4013G11C2211/4016
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 11,594,280
App. No.
17/390,998
Granted
Feb 28, 2023
Kind
B2
Abstract

A content addressable memory cell includes a first floating body transistor and a second floating body transistor. The first floating body transistor and the second floating body transistor are electrically connected in series through a common node. The first floating body transistor and the second floating body transistor store complementary data.

Claims (48)

1. An integrated circuit comprising:

a content addressable memory array comprising a plurality of content addressable memory cells arranged in a plurality of rows and columns, wherein each said content addressable memory cell comprises:

a first floating body transistor;

a second floating body transistor; and

a third transistor;

wherein said first floating body transistor and said second floating body transistor are electrically connected in series through a common node;

wherein said third transistor is electrically connected to said common node;

wherein said first floating body transistor and said second floating body transistor store complementary data; and

a control circuit configured to perform write operations to said content addressable memory array.

2. The integrated circuit of claim 1 , wherein said first floating body transistor and said second floating body transistor comprise a buried well region.

3. The integrated circuit of claim 1 , wherein said first floating body transistor and said second floating body transistor comprise a buried insulator region.

4. The integrated circuit of claim 1 , wherein said first floating body transistor comprises a first gate region and said second floating body transistor comprises a second gate region.

5. The integrated circuit of claim 1 , wherein said first floating body transistor comprises a first conductivity type and said third transistor comprises said first conductivity type.

6. The integrated circuit of claim 1 , wherein said first floating body transistor comprises a first conductivity type and said third transistor comprises a second conductivity type different from said first conductivity type.

7. The integrated circuit of claim 1 , wherein said third transistor comprises a third floating body transistor.

8. An integrated circuit comprising:

a content addressable memory array comprising a plurality of content addressable memory cells arranged in a plurality of rows and columns, wherein each said content addressable memory cell comprises:

a first bi-stable floating body transistor; and

a second bi-stable floating body transistor;

wherein said first bi-stable floating body transistor and said second bi-stable floating body transistor are electrically connected in series through a common node;

wherein said first floating body transistor and said second floating body transistor store complementary data; and

a control circuit configured to perform write operations to said content addressable memory array.

9. The integrated circuit of claim 8 , wherein said first bi-stable floating body transistor and said second bi-stable floating body transistor comprise a buried well region.

10. The integrated circuit of claim 8 , wherein said first bi-stable floating body transistor and said second bi-stable floating body transistor comprise a buried insulator region.

11. The integrated circuit of claim 8 , wherein said first bi-stable floating body transistor comprises a first gate region and said second bi-stable floating body transistor comprises a second gate region.

12. The integrated circuit of claim 8 , wherein each said content addressable memory cell further comprises an additional transistor.

13. The integrated circuit of claim 12 , wherein said first bi-stable floating body comprises a first conductivity type and said additional transistor comprises said first conductivity type.

14. The integrated circuit of claim 12 , wherein said first bi-stable floating body transistor comprises a first conductivity type and said additional transistor comprises a second conductivity type different from said first conductivity type.

15. The integrated circuit of claim 8 , wherein each said content addressable memory cell further comprises a third bi-stable floating body transistor.

16. An integrated circuit comprising:

a content addressable memory array comprising a plurality of content addressable memory cells arranged in a plurality of rows and columns, wherein each said content addressable memory cell comprises:

a first transistor having a first floating body;

a second transistor having a second floating body;

a third transistor;

a first drain region contacting said first floating body;

a second drain region contacting said second floating body;

a first source region contacting said first floating body, spaced apart from said first drain region; and

a second source region contacting said second floating body, spaced apart from said second drain region;

wherein said first and second drain regions are electrically connected to each other;

wherein said third transistor is electrically connected to said first and second drain regions; and

wherein said first floating body and said second floating body store complementary charge states; and

a control circuit configured to perform write operations to said content addressable memory array.

17. The integrated circuit of claim 16 , wherein said first transistor and said second transistor comprise a buried well region.

18. The integrated circuit of claim 16 , wherein said first transistor and said second transistor comprise a buried insulator region.

19. The integrated circuit of claim 16 , wherein said first transistor comprises a first gate region and said second transistor comprises a second gate region.

20. The integrated circuit of claim 16 , wherein said first transistor comprises a first conductivity type and said third transistor comprises said first conductivity type.

21. The integrated circuit of claim 16 , wherein said first transistor comprises a first conductivity type and said third transistor comprises a second conductivity type different from said first conductivity type.

22. The integrated circuit of claim 16 , further comprising a fourth transistor, having a third floating body.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2021
From: HAN, JIN-WOO; WIDJAJA, YUNIARTO
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 057706/0873 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2021
From: LOUIE, BENJAMIN S; WIDJAJA, YUNIARTO; HAN, JIN-WOO
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 057770/0747 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2021
From: HAN, JIN-WOO
To: ZENO SEMICONDUCTOR, INC.
Reel/Frame 057785/0947 →
Continuity (9)
Continuation 17077177 · Oct 22, 2020
Continuation 16449820 · Jun 24, 2019
Continuation 16013646 · Jun 20, 2018
Continuation 14867308 · Sep 28, 2015
Continuation 14154138 · Jan 13, 2014
Provisional Application 61800199 · Mar 15, 2013
Provisional Application 61781865 · Mar 14, 2013
Provisional Application 61752096 · Jan 14, 2013
Related Publication 20210358547A1 · Nov 18, 2021
Cited By (1)
US 12,439,611