Extreme ultraviolet mask and method of manufacturing the same
View Patent ↗A method of manufacturing an extreme ultraviolet mask, including forming a multilayer Mo/Si stack including alternating Mo and Si layers over a first major surface of a mask substrate, and forming a capping layer over the multilayer Mo/Si stack. An absorber layer is formed on the capping layer, and a hard mask layer is formed over the absorber layer. The hard mask layer is patterned to form a hard mask layer pattern. The hard mask layer pattern is extended into the absorber layer to expose the capping layer and form a mask pattern. A border pattern is formed around the mask pattern. The border pattern is extended through the multilayer Mo/Si stack to expose the mask substrate and form a trench surrounding the mask pattern. A passivation layer is formed along sidewalls of the trench.
1. A reflective mask, comprising:
a substrate;
a reflective multilayer disposed on the substrate;
a capping layer disposed on the reflective multilayer;
an absorber layer disposed on the capping layer;
a circuit pattern formed in the absorber layer;
a black border pattern comprising a trench formed in the absorber layer, the capping layer and the reflective multilayer reaching a first major surface of the substrate, and surrounding the circuit pattern; and
a passivation layer disposed along sidewalls of the trench of the black border pattern and an upper surface of the capping layer in the circuit pattern.
2. The reflective mask of claim 1 , wherein the passivation layer is in direct contact of the first major surface of the substrate.
3. The reflective mask of claim 1 , further comprising an anti-reflection layer disposed over the absorber layer.
4. The reflective mask of claim 3 , wherein the passivation layer is formed on an upper surface of the anti-reflection layer and sidewalls of the circuit pattern.
5. The reflective mask of claim 1 , wherein the passivation layer has a thickness of less than 10 nm.
6. The reflective mask of claim 1 , wherein the passivation layer is made of a silicon nitride, a silicon oxynitride, a metal doped silicon nitride, or a composite including at least one of metal silicide, metal nitride and metal oxide.
7. The reflective mask of claim 1 , wherein the passivation layer comprises a high-k material.
8. The reflective mask of claim 1 , wherein the passivation layer comprises nickel or cobalt.
9. A reflective mask, comprising:
a substrate;
a reflective multilayer disposed on the substrate;
a capping layer disposed on the reflective multilayer;
an absorber layer disposed on the capping layer;
a circuit pattern formed in the absorber layer, wherein the absorber layer is exposed in the circuit pattern;
a black border pattern formed in the absorber layer, the capping layer and the reflective multilayer and surrounding the circuit pattern; and
a passivation layer disposed along sidewalls of the black border pattern and in direct contact with the substrate.
10. The reflective mask of claim 9 , wherein:
the black border pattern comprises a trench formed in the absorber layer, the capping layer and the reflective multilayer and reaching a first major surface of the substrate, and
the passivation layer is in direct contact with the first major surface of the substrate.
11. The reflective mask of claim 9 , further comprising an anti-reflection layer disposed over the absorber layer,
wherein an upper surface of the anti-reflection layer is exposed.
12. The reflective mask of claim 9 , wherein the passivation layer has a thickness of less than 10 nm.
13. The reflective mask of claim 9 , wherein the passivation layer is made of a silicon nitride, a silicon oxynitride, a metal doped silicon nitride, or a composite including at least one of metal silicide, metal nitride and metal oxide.
14. The reflective mask of claim 9 , wherein the passivation layer comprises a high-k material.
15. The reflective mask of claim 9 , wherein the passivation layer comprises nickel or cobalt.
16. A reflective mask, comprising:
a substrate made of a low thermal expansion glass material;
a reflective multilayer disposed on the substrate;
a capping layer disposed on the reflective multilayer;
an absorber layer disposed on the capping layer;
a circuit pattern formed in the absorber layer;
a black border pattern formed in the absorber layer, the capping layer and the reflective multilayer, and surrounding the circuit pattern; and
a passivation layer disposed along sidewalls of the trench of the black border pattern and in direct contact with the substrate.
17. The reflective mask of claim 16 , further comprising an anti-reflection layer disposed over the absorber layer.
18. The reflective mask of claim 16 , wherein the passivation layer has a thickness of less than 10 nm.
19. The reflective mask of claim 16 , wherein the passivation layer includes a nitride.
20. The reflective mask of claim 16 , wherein passivation layer comprises a Si—N bonding.