Semiconductor structure and method for manufacturing thereof
A semiconductor structure and method for manufacturing thereof are provided. The semiconductor structure includes a silicon substrate having a first surface, a III-V layer on the first surface of the silicon substrate and over a first active region, and an isolation region in a portion of the III-V layer extended beyond the first active region. The first active region is in proximal to the first surface. The method includes the following operations. A silicon substrate having a first device region and a second device region is provided, a first active region is defined in the first device region, a III-V layer is formed on the silicon substrate, an isolation region is defined across a material interface in the III-V layer by an implantation operation, and an interconnect penetrating through the isolation region is formed.
1. A method for manufacturing a semiconductor structure, comprising:
providing a silicon substrate having a first device region and a second device region;
defining a first active region in the first device region;
defining a doped region in proximal to a first surface of the silicon substrate, wherein the first active region and the doped region include dopants of different polarities;
forming a III-V layer on the first surface of the silicon substrate after the defining the first active region, wherein the layer is closer to the first surface than to a second surface opposite to the first surface of the silicon substrate; and
defining an isolation region in the layer by an implantation operation.
2. The method of claim 1 , wherein the isolation region is formed to extend across the first device region.
3. The method of claim 1 , wherein the first active region extends from the first surface of the silicon substrate and the doped regions formed in the first device region.
4. The method of claim 1 , further comprising:
forming an interconnect penetrating through the isolation region.
5. The method of claim 4 , wherein the forming the interconnect comprises:
forming a plurality of trenches in the III-V layer and exposing the first device region after defining the isolation region.
6. The method of claim 1 , further comprising forming a patterned conductive layer on the III-V layer after forming the interconnect.
7. The method of claim 6 , wherein the patterned conductive layer is formed over the first device region and the second device region.
8. The method of claim 1 , further comprising:
defining a second active region in the III-V layer over the second device region and partially leveled with the isolation region.
9. A method for manufacturing a semiconductor structure, comprising:
providing a silicon substrate having a first device region and a second device region;
forming a III-V layer on the silicon substrate laterally covering the first device region and the second device region;
forming an ion implanted region in the III-V layer over the first device region, and the ion implanted region includes negatively-charged ions; and
forming an interconnect penetrating the ion implanted region.
10. The method of claim 9 , further comprising:
defining a first active region in the first device region prior to the forming the III-V layer.
11. The method of claim 10 , wherein the ion implanted region overlaps an entirety of the first active region.
12. The method of claim 9 , wherein the forming the III-V layer comprises:
forming a first III-V sub-layer on the silicon substrate; and
forming a second III-V sub-layer on the first III-V sub-layer, wherein a bandgap of the second III-V sub-layer is greater than that of the first III-V sub-layer.
13. The method of claim 12 , wherein a second active region is defined by an interface of the first III-V sub-layer and the second III-V sub-layer over the second device region.
14. The method of claim 13 , wherein an interface between the second active region and the ion implanted region is aligned to an interface between the first device region and the second device region.
15. The method of claim 12 , wherein the ion implanted region extends across an interface between the first III-V sub-layer and the second III-V sub-layer.
16. A method for manufacturing a semiconductor structure, comprising:
providing a silicon substrate having a first surface, a first device region and a second device region;
performing a first implantation on a first surface of e silicon substrate in the first device region;
forming a first bandgap layer on the first surface of the silicon substrate;
forming a second bandgap layer on the first bandgap layer; and
performing a second implantation on the second bandgap layer over the second device region to form an ion implanted region, wherein a lateral side of the ion implanted region defines a border between the first device region and the second device region.
17. The method of claim 16 , further comprising:
performing a third implantation on the first surface of the silicon substrate after the first implantation, wherein a dopant of the third implantation has a polarity different from that of the first implantation.
18. The method of claim 16 , wherein a thickness of the ion implanted region from a top surface of the second bandgap layer is greater than a thickness of the second bandgap layer.
19. The method of claim 16 , further comprising:
forming a trench penetrating the first bandgap layer and the second bandgap layer; and
depositing a conductive material in the trench.
20. The method of claim 16 , further comprising:
forming a plurality of conductive segments in the first device region and the second device region, wherein at least one of the conductive segments in the first device region is electrically connected to an active region formed by the first implantation.