PECVD process
A method of processing a substrate according to a PECVD process is described. Temperature profile of the substrate is adjusted to change deposition rate profile across the substrate. Plasma density profile is adjusted to change deposition rate profile across the substrate. Chamber surfaces exposed to the plasma are heated to improve plasma density uniformity and reduce formation of low quality deposits on chamber surfaces. In situ metrology may be used to monitor progress of a deposition process and trigger control actions involving substrate temperature profile, plasma density profile, pressure, temperature, and flow of reactants.
1. A semiconductor processing device, comprising:
a chamber having an internal volume defined by a side wall, a floor, and a lid;
a gas distributor having a plurality of gas flow openings formed therethrough; and
a substrate support disposed in the internal volume of the chamber, the substrate support comprising:
a first heating element disposed in the substrate support;
a second heating element disposed in the substrate support beneath the first heating element and extending radially outward beyond the first heating element; and
a thermocouple disposed in the substrate support beneath the second heating element.
2. The semiconductor processing device of claim 1 , the thermocouple further comprising:
a junction;
a longitudinal piece of a first material, the first material comprising a conductive material;
a longitudinal piece of a second material, the second material comprising a conductive material; and
an insulating material, the insulating material being disposed between the first material and the second material.
3. The semiconductor processing device of claim 2 , wherein the substrate support further comprising:
a lower surface, the lower surface comprising:
a first hole to expose the longitudinal piece of the first material; and
a second hole to expose the longitudinal piece of the second material.
4. The semiconductor processing device of claim 1 , the substrate support further comprising a plurality of electrodes, wherein:
the plurality of electrodes comprises a bias electrode and a tuning electrode;
a first one of the plurality of electrodes is positioned above the first heating element; and
a different one of the plurality of electrodes is positioned above the first one of the plurality of electrodes.
5. The semiconductor processing device of claim 1 , the substrate support further comprising a plurality of electrodes, wherein:
the plurality of electrodes comprises a bias electrode and a tuning electrode;
a first one of the plurality of electrodes is positioned below the thermocouple; and
a different one of the plurality of electrodes is positioned below the first one of the plurality of electrodes.
6. The semiconductor processing device of claim 1 , wherein the substrate support further comprising:
a lower surface, the lower surface comprising a hole; and
a second thermocouple, the second thermocouple being disposed in the hole.
7. The semiconductor processing device of claim 6 , wherein the semiconductor processing device further comprises a controller, the controller comprising a processor and circuitry adapted to receive and record a signal from the thermocouple and the second thermocouple and apply a current to the first heating element and the second heating element.
8. A semiconductor processing device, comprising:
a first chamber having an internal volume defined by a side wall, a floor, and a lid;
a first gas distributor having a plurality of gas flow openings formed therethrough; and
a first substrate support disposed in the internal volume of the chamber, the first substrate support comprising:
a first heating element disposed in the first substrate support;
a second heating element disposed in the first substrate support beneath the first heating element and extending radially outward beyond the first heating element; and
a first thermocouple disposed in the first substrate support beneath the second heating element; and
a second chamber having an internal volume defined by a side wall, a floor, and a lid;
a second gas distributor having a plurality of gas flow openings formed therethrough; and
a second substrate support disposed in the internal volume of the chamber, the second substrate support comprising:
a third heating element disposed in the second substrate support;
a fourth heating element disposed in the second substrate support beneath the third heating element and extending radially outward beyond the third heating element; and
a second thermocouple disposed in the second substrate support beneath the fourth heating element.
9. The semiconductor processing device of claim 8 , wherein:
the first thermocouple further comprises:
a junction;
a longitudinal piece of a first material, the first material comprising a conductive material;
a longitudinal piece of a second material, the second material comprising a conductive material; and
an insulating material, the insulating material being disposed between the longitudinal piece of first material and the longitudinal piece of second material; and
the second thermocouple further comprises:
a junction;
a longitudinal piece of a first material, the first material comprising a conductive material;
a longitudinal piece of a second material, the second material comprising a conductive material; and
an insulating material, the insulating material being disposed between the longitudinal piece of first material and the longitudinal piece of second material.
10. The semiconductor processing device of claim 9 , wherein:
the first substrate support of the first chamber further comprises:
a lower surface, the lower surface comprising:
a first hole to expose the longitudinal piece of first material; and
a second hole to expose the longitudinal piece of second material; and
the second substrate support of the second chamber further comprises:
a lower surface, the lower surface comprising:
a first hole to expose the longitudinal piece of first material; and
a second hole to expose the longitudinal piece of second material.
11. The semiconductor processing device of claim 8 , wherein:
the first substrate support of the first chamber further comprises a first plurality of electrodes, wherein:
the first plurality of electrodes comprises a bias electrode and a tuning electrode;
a first one of the first plurality of electrodes is positioned above the first heating element; and
a different one of the first plurality of electrodes is positioned above the first one of the first plurality of electrodes; and
the second substrate support of the second chamber further comprises a second plurality of electrodes, wherein:
the second plurality of electrodes comprises a bias electrode and a tuning electrode;
a first one of the second plurality of electrodes is positioned above the third heating element; and
a different one of the second plurality of electrodes is positioned above the first one of the second plurality of electrodes.
12. The semiconductor processing device of claim 8 , wherein:
the first substrate support of the first chamber further comprises a first plurality of electrodes, wherein:
the first plurality of electrodes comprises a bias electrode and a tuning electrode;
a first one of the first plurality of electrodes is positioned below the first thermocouple; and
a different one of the first plurality of electrodes is positioned below the first one of the first plurality of electrodes; and
the second substrate support of the second chamber further comprises a second plurality of electrodes, wherein:
the second plurality of electrodes comprises a bias electrode and a tuning electrode;
a first one of the second plurality of electrodes is positioned below the second thermocouple; and
a different one of the second plurality of electrodes is positioned below the first one of the second plurality of electrodes.
13. The semiconductor processing device of claim 8 , wherein:
the first substrate support for the first chamber further comprises:
a lower surface, the lower surface comprising a hole; and
a third thermocouple, the third thermocouple being disposed in the hole; and
the second substrate support for the second chamber further comprises:
a lower surface, the lower surface comprising a hole; and
a fourth thermocouple, the fourth thermocouple being disposed in the hole.
14. The semiconductor processing device of claim 13 , wherein the semiconductor processing device further comprises a controller, the controller comprising a processor and circuitry adapted to:
receive and record a signal from at least one of:
the first thermocouple;
the second thermocouple;
the third thermocouple; and
the fourth thermocouple; and
apply a current to at least one of:
the first heating element;
the second heating element;
the third heating element; and
the fourth heating element.
15. A semiconductor processing device, comprising:
a chamber having an internal volume defined by a side wall, a floor, and a lid;
a gas distributor having a plurality of gas flow openings formed therethrough, the gas flow openings being more densely distributed at a center of the gas distributor and less densely distributed at an edge of the gas distributor;
a substrate support disposed in the internal volume of the chamber; and
an electrode coupled to the substrate support, the electrode coupled to a tuning circuit, wherein the tuning circuit comprises a variable capacitor.
16. The semiconductor processing device of claim 15 , further comprising a second chamber having an internal volume defined by a side wall, a floor, and a lid;
a second gas distributor having a plurality of gas flow openings formed therethrough, the gas flow openings being more densely distributed at a center of the second gas distributor and less densely distributed at an edge of the second gas distributor;
a second substrate support disposed in the internal volume of the chamber; and
a second electrode coupled to the substrate support, the second electrode coupled to a second tuning circuit, wherein the second tuning circuit comprises a variable capacitor.
17. The semiconductor processing device of claim 15 , wherein one or more of the gas flow openings of the gas distributor includes in situ metrology devices.