Semiconductor device
View Patent ↗A semiconductor device includes a semiconductor layer over a substrate; a gate insulating film covering the semiconductor layer; a gate wiring including a gate electrode, which is provided over the gate insulating film and is formed by stacking a first conductive layer and a second conductive layer; an insulating film covering the semiconductor layer and the gate wiring including the gate electrode; and a source wiring including a source electrode, which is provided over the insulating film, is electrically connected to the semiconductor layer, and is formed by stacking a third conductive layer and a fourth conductive layer. The gate electrode is formed using the first conductive layer. The gate wiring is formed using the first conductive layer and the second conductive layer. The source electrode is formed using the third conductive layer. The source wiring is formed using the third conductive layer and the fourth conductive layer.
1. A semiconductor device comprising:
a semiconductor layer comprising a channel formation region;
a first electrode electrically connected to the semiconductor layer;
a first insulating film over the semiconductor layer and the first electrode;
a second electrode overlapping with the channel formation region with the first insulating film interposed therebetween;
a third electrode having a region in contact with a top surface of the first insulating film and a region in contact with a bottom surface of the second electrode;
a second insulating film over the second electrode and the third electrode;
a fourth electrode over and in contact with the second insulating film, the fourth electrode having a region overlapping with the channel formation region with the second electrode interposed therebetween; and
a fifth electrode over and in contact with the second insulating film, the fifth electrode having the same material as the fourth electrode,
wherein the second electrode has a region overlapped with the fifth electrode,
wherein the fourth electrode is in contact with the first electrode through an opening provided in the second insulating film,
wherein the opening does not overlap with the semiconductor layer,
wherein each of the second electrode and the fourth electrode has a light-transmitting property, and
wherein the third electrode has a light-blocking property.
2. A semiconductor device comprising:
a semiconductor layer comprising a channel formation region;
a first electrode electrically connected to the semiconductor layer;
a first insulating film over the semiconductor layer and the first electrode;
a second electrode overlapping with the channel formation region with the first insulating film interposed therebetween;
a third electrode having a region in contact with a top surface of the first insulating film and a region in contact with a bottom surface of the second electrode;
a second insulating film over the second electrode and the third electrode;
a fourth electrode over and in contact with the second insulating film, the fourth electrode having a region overlapping with the channel formation region with the second electrode interposed therebetween; and
a fifth electrode over and in contact with the second insulating film, the fifth electrode having the same material as the fourth electrode,
wherein the second electrode has a region overlapped with the fifth electrode,
wherein the third electrode does not overlap with the semiconductor layer,
wherein the fourth electrode is in contact with the first electrode through an opening provided in the second insulating film,
wherein the opening does not overlap with the semiconductor layer,
wherein each of the second electrode and the fourth electrode has a light-transmitting property, and
wherein the third electrode has a light-blocking property.