Semiconductor device and method for fabricating the same
A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a contact hole in the first IMD layer; forming a bottom electrode layer in the contact hole; forming a magnetic tunneling junction (MTJ) stack on the bottom electrode layer; and removing the MTJ stack and the bottom electrode layer to form a MTJ on a bottom electrode. Preferably, the bottom electrode protrudes above a top surface of the first IMD layer.
1. A semiconductor device, comprising:
a first inter-metal dielectric (IMD) layer on a substrate;
a bottom electrode in the first IMD layer and protruding above a top surface of the first IMD layer;
a liner directly contacting sidewalls and a bottom surface of the bottom electrode, wherein a bottom surface width in a cross section view of the liner is less than a top surface width in a cross section view of the bottom electrode, the liner comprises a U-shape having a first vertical portion, a second vertical portion, and a horizontal portion connecting the first vertical portion and the second vertical portion, and the first vertical portion and the second vertical portion are not extended to directly contact a top surface of the first IMD layer;
a magnetic tunneling junction (MTJ) on the bottom electrode, wherein a bottom surface width in the cross section view of the bottom electrode is less than a bottom surface width in a cross section view of the MTJ, sidewalls of the MTJ are aligned with sidewalls of the first vertical portion and the second vertical portion, and the MTJ comprises:
a pinned layer on and directly contacting the bottom electrode;
a barrier layer on the pinned layer;
a free layer on the barrier layer; and
a top electrode on the MTJ.
2. The semiconductor device of claim 1 , further comprising:
a second IMD layer on the substrate;
a metal interconnection in the second IMD layer;
the first IMD layer on the second IMD layer; and
the bottom electrode on the metal interconnection.
3. The semiconductor device of claim 2 , further comprising the liner between the bottom electrode and the metal interconnection.
4. The semiconductor device of claim 3 , wherein the liner and the bottom electrode comprise different materials.
5. The semiconductor device of claim 3 , wherein the liner comprises titanium (Ti).
6. The semiconductor device of claim 3 , wherein the liner comprises a U-shape.
7. The semiconductor device of claim 1 , wherein the bottom electrode comprises titanium nitride (TiN).
8. The semiconductor device of claim 1 , wherein the bottom electrode is a single piece.