IP Library Granted Patent US 11,976,369
Granted Patent B2
US 11,976,369 · App. 17/857,954 · Granted May 7, 2024

Low-temperature/BEOL-compatible highly scalable graphene synthesis tool

Inventors: Kaustav Banerjee (Goleta, CA); Ravi Iyengar (Milipitas, CA); Satish Sundar (San Jose, CA); Nalin Rupesinghe (Cambridge, GB)
Assignee: DESTINATION 2D INC.
C23C8/64
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Quick Facts
Patent No.
US 11,976,369
App. No.
17/857,954
Granted
May 7, 2024
Kind
B2
Abstract

In one aspect, a highly scalable diffusion-couple apparatus includes a transfer chamber configured to load a wafer into a process chamber. The process chamber is configured to receive the wafer substrate from the transfer chamber. The process chamber comprises a chamber for growth of a diffusion material on the wafer. A heatable bottom substrate disk includes a first heating mechanism. The heatable bottom substrate disk is fixed and heatable to a specified temperature. The wafer is placed on the heatable bottom substrate disk. A heatable top substrate disk comprising a second heating mechanism. The heatable top substrate disk is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the wafer on the heatable bottom substrate disk. While the heatable top substrate disk applies the mechanical pressure a chamber pressure is maintained at a specified low value. The first heating mechanism and the second heating mechanism can be independently tuned to any value in the working range.

Claims (37)

1. A scalable diffusion-couple apparatus comprising:

a transfer chamber configured to load a wafer into a process chamber;

the process chamber configured to receive the wafer from the transfer chamber comprising:

a chamber for growth of a diffusion material on the wafer;

a heatable bottom disk comprising a first heating mechanism,

wherein the heatable bottom disk is fixed and heatable to a specified temperature, and

wherein the wafer is placed on the heatable bottom disk;

a heatable top disk comprising a second heating mechanism,

wherein the heatable top disk is configured to move up and down along an x axis and an x prime axis to apply a mechanical pressure to the wafer on the heatable bottom disk, and

wherein the heatable top disk applies the mechanical pressure while a chamber pressure is maintained at a less than 10 −3 torr;

wherein the first heating mechanism and the second heating mechanism are tuned independently.

2. The scalable diffusion-couple apparatus of claim 1 ,

wherein the diffusion material comprises a carbon material.

3. The scalable diffusion-couple apparatus of claim 2 ,

wherein the carbon material comprises a graphene material.

4. The scalable diffusion-couple apparatus of claim 1 , further comprising:

one or more pumps configured to control a pressure value in the process chamber to between 10 −3 torr to 10 −7 torr.

5. The scalable diffusion-couple apparatus of claim 1 ,

wherein the wafer comprises a silicon wafer of a 300 mm diameter, a 200 mm diameter, or a 150 mm diameter.

6. The scalable diffusion-couple apparatus of claim 1 ,

wherein the heatable bottom disk comprises a 300 mm disk.

7. The scalable diffusion-couple apparatus of claim 1 ,

wherein the heatable bottom disk is heated to 500° C. with a ±3° C. uniformity across the heatable bottom disk while the heatable top disk applies the mechanical pressure to the wafer.

8. The scalable diffusion-couple apparatus of claim 7 ,

wherein the heatable top disk applies 50 psi to 125 psi of mechanical pressure to the wafer.

9. The scalable diffusion-couple apparatus of claim 1 ,

wherein the heatable top disk applies the mechanical pressure while the chamber pressure is maintained at a 10 −6 to 10 −7 torr to prevent contamination of the growth process.

10. The scalable diffusion-couple apparatus of claim 1 ,

wherein a direct synthesis of high-quality atomically-thin film is performed in the process chamber.

11. The scalable diffusion-couple apparatus of claim 1 ,

wherein the scalable diffusion-couple apparatus is integrated in a complementary metal-oxide-semiconductor (CMOS) microelectronics manufacturing process.

12. The scalable diffusion-couple apparatus of claim 1 ,

further comprising a liner having surface that is composed of graphite.

13. The diffusion-couple apparatus of claim 1 ,

further comprising a liner that comprises an Aluminum Nitride, quartz, or a SiC coated graphite.

14. The scalable diffusion-couple apparatus of claim 1 ,

wherein a liner comprises Aluminum.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2022
From: BANERJEE, KAUSTAV; IYENGAR, RAVI; RUPESINGHE, NALIN; SUNDAR, SATISH
To: DESTINATION 2D INC.
Reel/Frame 062149/0315 →
Continuity (2)
Provisional Application 63218498 · Jul 6, 2021
Related Publication 20230105855A1 · Apr 6, 2023
Cited By (9)
US 12,286,710 US 12,368,061 US 12,368,102 US 12,412,757 US 12,438,089 US 12,529,141 US 12,604,687 US 12,644,185 US 12,727,408