Method for forming mask pattern, storage medium, and apparatus for processing substrate
A technique for suppressing a metal component from remaining at a bottom of a mask pattern when the mask pattern is formed using a metal-containing resist film. A developable anti reflection film 103 is previously formed below a resist film 104 . Further, after exposing and developing the wafer W, TMAH is supplied to the wafer W to remove a surface of the anti-reflection film 103 facing a bottom of the recess pattern 110 of the resist film 104 . Therefore, the metal component 105 can be suppressed from remaining at the bottom of the recess pattern 110 . Therefore, when the SiO 2 film 102 is subsequently etched using the pattern of the resist film 104 , the etching is not hindered, so that defects such as bridges can be suppressed.
1. A method of forming a mask pattern on a surface of a substrate using a metal-containing resist, the method comprising:
forming a resist pattern by developing the substrate, wherein an under film is formed on the substrate, a resist film is formed on a surface of the under film, and then the substrate is exposed; and
removing at least a surface layer portion of the under film facing a bottom of the resist pattern to remove remaining metal components,
wherein the under film is not removed in the forming step,
wherein the under film has a property of being decomposed by irradiation with ultraviolet rays, and
wherein in the removing step, the at least a surface layer portion of the under film is removed by irradiating the substrate with ultraviolet rays.
2. The method of claim 1 , wherein in the removing step, a chemical liquid having no dissolving action on the resist film and having dissolving action on the under film is supplied to the substrate.
3. The method of claim 2 , wherein an exposed region of the resist film is not developed, and
the under film is an anti-reflection film whose exposed region is insoluble in the chemical liquid.
4. The method of claim 2 , wherein an exposed region of the resist film is developed, and
the under film is an anti-reflection film whose exposed region is insoluble in the chemical liquid.
5. The method of claim 1 , wherein the under film is an organic film containing carbon.
6. A method of forming a mask pattern on a surface of a substrate using a metal-containing resist, the method comprising:
forming a resist pattern by developing the substrate, wherein an under film is formed on the substrate, a resist film is formed on a surface of the under film, and then the substrate is exposed;
cross-linking the resist film by irradiating the surface of the substrate with ultraviolet rays; and
removing at least a surface layer of an under film facing a bottom of the resist pattern by heating the substrate, to remove remaining metal components,
wherein the under film is not developed.
7. A storage medium storing a computer program for use in a substrate processing apparatus for forming a mask pattern using a metal-containing resist on a surface of a substrate,
wherein the computer program is configured to have a group of steps to execute the method of claim 1 .
8. A substrate processing apparatus, comprising:
a development module configured to form a resist pattern by developing a resist film of a substrate, wherein an under film is formed on the substrate, the resist film containing a metal is formed on a surface of the under film, and then the substrate is exposed; and
an under film removal module configured to remove at least a surface layer portion of the under film facing a bottom of the resist pattern to remove remaining metal components,
wherein the under film has a property of being decomposed by irradiation with ultraviolet rays, and
wherein the under film removal module is configured to remove the at least a surface layer portion of the under film by irradiating the substrate with ultraviolet rays.
9. The apparatus of claim 8 , wherein the under film removal module is configured to supply a chemical liquid having no dissolving action on the resist film and having dissolving action on the under film to the substrate.
10. A substrate processing apparatus, comprising:
a development module configured to form a resist pattern by developing a resist film of a substrate, wherein an under film is formed on the substrate, the resist film containing a metal is formed on a surface of the under film, and then the substrate is exposed;
an ultraviolet irradiation module configured to irradiate a surface of the substrate after development with ultraviolet rays to cross-link the resist film; and
a heating module configured to heat the substrate after irradiation with the ultraviolet rays to remove at least a surface layer of an under film facing a bottom of the resist pattern to remove remaining metal components,
wherein the under film is not developed.
11. A method of forming a mask pattern on a surface of a substrate using a metal-containing resist, the method comprising:
forming a resist pattern by developing the substrate, wherein an under film is formed on the substrate, a resist film is formed on a surface of the under film, and then the substrate is exposed; and
processing at least a surface layer portion of the under film facing a bottom of the resist pattern to remove remaining metal components,
wherein the under film is not removed in the forming step.
12. The method of claim 11 , wherein in the processing step, a chemical liquid having no dissolving action on the resist film and having dissolving action on the under film is supplied to the substrate.
13. The method of claim 12 , wherein an exposed region of the resist film is not developed, and
the under film is an anti-reflection film whose exposed region is insoluble in the chemical liquid.
14. The method of claim 12 , wherein an exposed region of the resist film is developed, and
the under film is an anti-reflection film whose exposed region is insoluble in the chemical liquid.
15. The method of claim 11 , wherein the under film has a property of being decomposed by irradiation with ultraviolet rays, and
in the processing step, the at least a surface layer portion of the under film is removed by irradiating the substrate with ultraviolet rays.
16. The method of claim 15 , wherein the under film is an organic film containing carbon.
17. The method of claim 11 , wherein in the processing step, the surface layer portion of the under film facing the bottom of the resist pattern is heated.
18. The method of claim 11 , wherein in the processing step, with a two-fluid rinse is supplied on the surface layer portion of the under film facing the bottom of the resist pattern.
19. A substrate processing apparatus, comprising:
a development module configured to form a resist pattern by developing a resist film of a substrate, wherein an under film is formed on the substrate, the resist film containing a metal is formed on a surface of the under film, and then the substrate is exposed; and
an under film processing module configured to process at least a surface layer portion of the under film facing a bottom of the resist pattern to remove remaining metal components.