Three dimensional memory device containing resonant tunneling barrier and high mobility channel and method of making thereof
A memory device includes an alternating stack of insulating layers and control gate layers, a memory opening vertically extending through the alternating stack, and a memory opening fill structure containing a memory film and a vertical semiconductor channel located within the memory opening. The memory film contains a resonant tunneling barrier stack, a semiconductor barrier layer, and a memory material layer located between the resonant tunneling barrier stack and the semiconductor barrier layer.
1. A memory device, comprising:
an alternating stack of insulating layers and control gate layers;
a memory opening vertically extending through the alternating stack; and
a memory opening fill structure comprising a memory film and a vertical semiconductor channel located within the memory opening,
wherein the memory film comprises a resonant tunneling barrier stack, a semiconductor barrier layer, and a memory material layer located between the resonant tunneling barrier stack and the semiconductor barrier layer;
wherein the resonant tunneling barrier stack comprises at least two semiconductor quantum wells.
2. The memory device of claim 1 , wherein the at least two semiconductor quantum wells comprise an inner quantum well and an outer quantum well located between the inner quantum well and the alternating stack.
3. The memory device of claim 2 , wherein:
the inner quantum well comprises an inner semiconductor well layer located between a first barrier layer and a second barrier layer; and
the outer quantum well comprises an outer semiconductor well layer located between the second barrier layer and a third barrier layer.
4. The memory device of claim 3 , wherein the inner semiconductor well layer is thinner than the outer semiconductor well layer.
5. The memory device of claim 4 , wherein the inner semiconductor well layer and the outer semiconductor well layer have a narrower bandgap than the first, second and third barrier layers.
6. The memory device of claim 5 , wherein the inner semiconductor well layer and the outer semiconductor well layer comprise indium arsenide, and the first, second and third barrier layers comprise aluminum antimonide.
7. The memory device of claim 6 , wherein the memory material layer comprises a dielectric charge storage material, the vertical semiconductor channel comprises a first compound semiconductor material, and the semiconductor barrier layer comprises a second compound semiconductor material having a wider bandgap than the first compound semiconductor material.
8. The memory device of claim 7 , wherein the memory material layer comprises a silicon nitride layer and the vertical semiconductor channel comprises an indium arsenide layer.
9. The memory device of claim 8 , wherein the semiconductor barrier layer comprises an aluminum antimonide layer which is thicker than the resonant tunneling barrier stack.
10. A memory device, comprising:
an alternating stack of insulating layers and control gate layers;
a memory opening vertically extending through the alternating stack; and
a memory opening fill structure comprising a memory film and a vertical semiconductor channel located within the memory opening,
wherein the memory film comprises a resonant tunneling barrier stack, a semiconductor barrier layer, and a memory material layer located between the resonant tunneling barrier stack and the semiconductor barrier layer;
wherein:
the semiconductor barrier layer is located between the memory material layer and the vertical semiconductor channel; and
the resonant tunneling barrier stack is located between the memory material layer and the alternating stack.
11. The memory device of claim 10 , wherein:
the semiconductor barrier layer surrounds the vertical semiconductor channel;
the memory material layer surrounds the semiconductor barrier layer; and
the resonant tunneling barrier stack surrounds the memory material layer.
12. A memory device, comprising:
an alternating stack of insulating layers and control gate layers;
a memory opening vertically extending through the alternating stack; and
a memory opening fill structure comprising a memory film and a vertical semiconductor channel located within the memory opening,
wherein the memory film comprises a resonant tunneling barrier stack, a semiconductor barrier layer, and a memory material layer located between the resonant tunneling barrier stack and the semiconductor barrier layer;
wherein:
the resonant tunneling barrier stack is located between the memory material layer and the vertical semiconductor channel; and
the semiconductor barrier layer is located between the memory material layer and the alternating stack.
13. The memory device of claim 12 , wherein:
the resonant tunneling barrier stack surrounds the vertical semiconductor channel;
the memory material layer surrounds the resonant tunneling barrier stack; and
the semiconductor barrier layer surrounds the memory material layer.
14. A method of operating a memory device comprising an alternating stack of insulating layers and control gate layers, a memory opening vertically extending through the alternating stack, and a memory opening fill structure comprising a memory film and a vertical semiconductor channel located within the memory opening, wherein the memory film comprises a resonant tunneling barrier stack, a semiconductor barrier layer, and a memory material layer located between the resonant tunneling barrier stack and the semiconductor barrier layer;
the method comprising:
applying a negative voltage to at least one of the control gate electrodes to program the memory material layer; and
applying a positive voltage to at least one of the control gate electrodes to erase the memory material layer.