Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer via
One aspect of this disclosure is a power amplifier module that includes a power amplifier, a semiconductor resistor, a tantalum nitride terminated through wafer via, and a conductive layer electrically connected to the power amplifier. The semiconductor resistor can include a resistive layer that includes a same material as a layer of a bipolar transistor of the power amplifier. A portion of the conductive layer can be in the tantalum nitride terminated through wafer via. The conductive layer and the power amplifier can be on opposing sides of a semiconductor substrate. Other embodiments of the module are provided along with related methods and components thereof.
1. A power amplifier system comprising:
a power amplifier on a front side of a semiconductor substrate, the power amplifier including a bipolar transistor having a collector, a base, and an emitter;
a semiconductor resistor on the semiconductor substrate, the semiconductor resistor including a resistive layer formed of a same material as a layer of the bipolar transistor;
a tantalum nitride terminated through wafer via; and
a conductive layer on a back side of the semiconductor substrate that is opposite the front side of the semiconductor substrate, a portion of the conductive layer being in the tantalum nitride terminated through wafer via, and the conductive layer being electrically connected to the power amplifier.
2. The power amplifier system of claim 1 wherein the emitter includes the layer of the bipolar transistor.
3. The power amplifier system of claim 1 wherein the base includes the layer of the bipolar transistor.
4. The power amplifier system of claim 1 wherein the bipolar transistor is electrically connected to the semiconductor resistor.
5. The power amplifier system of claim 4 wherein the semiconductor resistor is configured to provide ballast resistance for the bipolar transistor.
6. The power amplifier system of claim 1 comprising a first die and a second die, the first die including the bipolar transistor and the semiconductor resistor, and the second die including a bias circuit configured to generate a bias signal based at least in part on an indication of a resistance of the semiconductor resistor and to provide the bias signal to the power amplifier.
7. The power amplifier system of claim 1 wherein the conductive layer includes copper, and a tantalum nitride termination of the tantalum nitride terminated through wafer via is configured to inhibit diffusion of copper from the conductive layer into the semiconductor substrate.
8. The power amplifier system of claim 1 wherein the conductive layer includes copper and is configured as a ground plane.
9. The power amplifier system of claim 1 wherein the semiconductor substrate is a gallium arsenide substrate.
10. The power amplifier system of claim 9 wherein the conductive layer is a copper layer, and a tantalum nitride termination of the tantalum nitride terminated through wafer via surrounds an interface between the copper layer and a metallization layer on the front side of the gallium arsenide substrate.
11. A power amplifier module comprising:
a power amplifier on a front side of a gallium arsenide substrate, the power amplifier including a bipolar transistor having a collector, a base, and an emitter;
a semiconductor resistor on the gallium arsenide substrate, the semiconductor resistor including a resistive layer formed of a same material as a layer of the bipolar transistor, and the resistive layer being disposed laterally from and being electrically isolated from the layer of the bipolar transistor;
a through wafer via extending through the gallium arsenide substrate and having a tantalum nitride termination on the front side of the gallium arsenide substrate; and
a conductive layer on a back side of the gallium arsenide substrate, a portion of the conductive layer being in the tantalum nitride terminated through wafer via, and the conductive layer being electrically connected to the power amplifier.
12. The power amplifier module of claim 11 wherein the conductive layer includes copper, and the tantalum nitride termination is configured to inhibit diffusion of copper from the conductive layer into the gallium arsenide substrate.
13. The power amplifier module of claim 11 wherein the base includes the layer of the bipolar transistor.
14. The power amplifier module of claim 11 wherein the emitter includes the layer of the bipolar transistor.
15. The power amplifier module of claim 11 wherein the bipolar transistor is a heterojunction bipolar transistor.
16. The power amplifier module of claim 11 wherein a plurality of differently doped gallium arsenide layers form the semiconductor resistor.
17. A power amplifier module comprising:
a power amplifier on a front side of a gallium arsenide substrate, the power amplifier including a heterojunction bipolar transistor having a collector, a base, and an emitter;
a semiconductor resistor on the gallium arsenide substrate, the semiconductor resistor including a plurality of differently doped gallium arsenide layers, the plurality of differently doped gallium arsenide layers includes a resistive layer formed of a same material as a layer of the heterojunction bipolar transistor, and the resistive layer is disposed laterally from and is electrically isolated from the layer of the heterojunction bipolar transistor;
a through wafer via extending through the gallium arsenide substrate, the through wafer via including a tantalum nitride termination on the front side of the gallium arsenide substrate; and
a conductive layer on a back side of the gallium arsenide substrate that is opposite the front side of the gallium arsenide substrate, a portion of the conductive layer being in the through wafer via and being electrically connected to the emitter of the heterojunction bipolar transistor, the conductive layer including copper and configured as a ground plane.
18. The power amplifier module of claim 17 wherein the tantalum nitride termination surrounds an interface between copper of the conductive layer in the through wafer via and a metallization layer on the front side of gallium arsenide substrate.
19. The power amplifier module of claim 17 wherein the semiconductor resistor includes a doped layer of indium gallium phosphide.
20. The power amplifier module of claim 17 further comprising a bias circuit configured to generate a bias signal based at least in part on an indication of a resistance of the semiconductor resistor and to provide the bias signal to the power amplifier.