Granted Patent B2

US 12,189,314 · App. 18/035,008 · Granted Jan 7, 2025

Inventors: Sebastianus Adrianus Goorden (Eindhoven, NL); Simon Gijsbert Josephus Mathijssen (Rosmalen, NL); Leendert Jan Karssemeijer (Hertogenbosch, NL); Manouk Rijpstra (Eindhoven, NL); Ralph Brinkhof (Vught, NL); Kaustuve Bhattacharyya (Veldhoven, NL)

Assignee: ASML NETHERLANDS B.V.

G03F9/7046G03F7/70625G03F7/706831G03F7/706837

Abstract

Claims (42)

1. A method to determine at least one performance indicator for a metrology process, the performance indicator being indicative of measurement performance for a measurement performed using a first measurement recipe, the method comprising:

obtaining first measurement data relating to one or more setup substrates and a first set of measurement conditions;

determining the first measurement recipe based on the first measurement data; and

determining the at least one performance indicator from:

one or more components of the first measurement data obtained from a component analysis or statistical decomposition; or

a comparison of one or more first measurement values relating to the first measurement recipe and one or more second measurement values relating to a second measurement recipe, wherein the second measurement recipe is determined based on second measurement data, the second measurement data being different to the first measurement data and relating to a second set of measurement conditions, the second set of measurement conditions being different to the first set of measurement conditions.

2. The method as claimed in claim 1 , wherein the determining the first measurement recipe comprises optimizing the first measurement recipe as a subset of the first set of measurement conditions so as to optimize accuracy of measurements performed using the first measurement recipe.

3. The method as claimed in claim 2 , wherein the optimizing the first measurement recipe comprises determining one or more illumination conditions to be used for a measurement and/or determining a weighting for each illumination condition to be used for a measurement.

4. The method as claimed in claim 1 , wherein the performance indicator is determined from the comparison of the one or more first measurement values and the one or more second measurement values.

5. The method as claimed in claim 4 , wherein the performance indicator is determined from a difference of the one or more first measurement values and the one or more second measurement values.

6. The method as claimed in claim 4 , wherein the second set of measurement conditions is different from the first set of measurement conditions in terms of one or more selected from:

illumination conditions used to obtain the respective measurement data,

intensity imbalance measurements relating to the respective measurement data,

the one or more setup substrates,

measurement points on each of the one or more setup substrates,

lots or groups of the one or more setup substrates, or

any combination of two or more of these.

7. The method as claimed in claim 4 , comprising optimizing the second measurement recipe as a subset of the second set of measurement conditions so as to optimize accuracy of measurements performed using the second measurement recipe, and such that the one or more first measurement values are similar to the one or more second measurement values.

8. The method as claimed in claim 4 , wherein the second measurement data comprises a proper subset of the first measurement data and the second set of measurement conditions comprises a proper subset of the first set of measurement conditions.

9. The method as claimed in claim 8 , wherein the second set of measurement conditions comprises a proper subset of illumination conditions comprised within the first set of measurement conditions, and the optimizing the second measurement recipe comprises determining one or more illumination conditions to be used for a measurement and/or determining a weighting for each illumination condition to be used for a measurement.

10. The method as claimed in claim 4 , comprising:

obtaining first production measurement data relating to metrology performed on a production substrate using the first measurement recipe;

obtaining second production measurement data relating to metrology performed on a production substrate using the second measurement recipe; and

comparing the first processed production measurement data and the second processed production measurement data.

11. The method as claimed in claim 10 , wherein the production measurement data comprises alignment data and the first measurement recipe comprises a measurement recipe for alignment metrology.

12. The method as claimed in claim 10 , wherein the production measurement data comprises post-exposure metrology data and the first measurement recipe comprises a measurement recipe for post-exposure metrology.

13. The method as claimed in claim 1 , wherein the at least one performance indicator is determined from one or more components of the first measurement data obtained from:

a principal component analysis;

an independent component analysis; or

a single value decomposition.

14. The method as claimed in claim 13 , wherein the measurement data comprises one or more swing curves, wherein each swing curve describes variation of a measurement parameter as a function of illumination condition.

15. A non-transient computer program carrier comprising instructions therein, the instructions, when executed by a computer system, configured to cause the computer system to perform claim 1 .

16. A processing arrangement comprising:

the non-transient computer program carrier of claim 15 ; and

a processor operable to run the instructions of the non-transient computer program carrier.

17. A metrology apparatus comprising the processing arrangement of claim 16 .

18. The metrology apparatus as claimed in claim 17 , comprising a scatterometer and being operable to measure post-exposure metrology data.

19. An alignment sensor comprising the processing arrangement of claim 16 .

20. A lithographic apparatus comprising:

the alignment sensor of claim 19 ;

a patterning device support for supporting a patterning device; and

a substrate support for supporting a substrate.

Assignments (1)

Priority Claims (1)

Continuity (1)

References Cited (53)