Actively clamped carrier assembly for processing tools
Embodiments of the present disclosure are related to carrier assemblies that can clamp more than one optical device substrates and methods for forming the carrier assemblies. The carrier assembly includes a carrier, one or more substrates, and a mask. The carrier is magnetically coupled to the mask to retain the one or more substrates. The carrier assembly is used for supporting and transporting the one or more substrates during processing. The carrier assembly is also used for masking the one or more substrates during PVD processing. Methods for assembling the carrier assembly in a build chamber are described herein.
1. A carrier assembly, comprising:
a mask, the mask including a pattern of openings disposed through the mask, the mask including pinholes;
a carrier, the carrier including:
a magnet disposed in the carrier, the magnet magnetically coupled to the mask;
a plurality of pockets recessed into the carrier, each pocket of the plurality of pockets having a width corresponding to a substrate to be disposed therein, each substrate of the plurality of substrates to be disposed in each pocket of the plurality of pockets abuts sidewalls of a respective pocket; and alignment pins disposed in the carrier and disposed through the pinholes in the mask, the alignment pins adjacent to a sidewall of the sidewalls of the plurality of pockets.
2. The carrier assembly of claim 1 , wherein the pattern of openings correspond to a first region, a second region, and a third region of a waveguide combiner.
3. The carrier assembly of claim 1 , wherein the mask includes a stainless steel material or a non-ferrous material.
4. The carrier assembly of claim 1 , wherein the mask including a non-ferrous material is bonded to a ferrous strike plate, the ferrous strike plate is disposed between the mask and the magnet.
5. The carrier assembly of claim 1 , wherein the mask is a clamp ring.
6. The carrier assembly of claim 1 , wherein the carrier assembly is operable to be scanned vertically during processing.
7. A carrier assembly, comprising:
a mask, the mask including a pattern of openings disposed through the mask, the mask including pinholes;
a carrier, the carrier including:
a magnet disposed in the carrier, the magnet magnetically coupled to the mask;
a plurality of pockets recessed into the carrier, one or more substrates disposed in the plurality of pockets, and the one or more substrates abut sidewalls of the plurality of pockets; and
alignment pins disposed in the carrier and disposed through the pinholes in the mask, the alignment pins adjacent to one of the sidewalls of the plurality of pockets.
8. The carrier assembly of claim 7 , wherein the pattern of openings correspond to a first region, a second region, and a third region of a waveguide combiner.
9. The carrier assembly of claim 7 , wherein the mask includes a stainless steel material or a non-ferrous material.
10. The carrier assembly of claim 7 , wherein the mask including a non-ferrous material is bonded to a ferrous strike plate, the ferrous strike plate is disposed between the mask and the magnet.
11. The carrier assembly of claim 7 , wherein the mask is a clamp ring.
12. The carrier assembly of claim 7 , wherein the carrier assembly is operable to be scanned vertically during processing.