Vertical variable resistance memory devices
A vertical variable resistance memory device including gate electrodes spaced apart from each other in a first direction on a substrate, each of the gate electrodes including graphene and extending in a second direction, the first direction being substantially perpendicular to an upper surface of the substrate and the second direction being substantially parallel to the upper surface of the substrate; first insulation patterns between the gate electrodes, each of the first insulation patterns including boron nitride (BN); and at least one pillar structure extending in the first direction through the gate electrodes and the first insulation patterns on the substrate, wherein the at least one pillar structure includes a vertical gate electrode extending in the first direction; and a variable resistance pattern on a sidewall of the vertical gate electrode.
1. A vertical variable resistance memory device, comprising:
gate electrodes spaced apart from each other in a first direction on a substrate to form a plurality of gate electrode structures, each of the gate electrodes including graphene and extending in a second direction, the first direction being substantially perpendicular to an upper surface of the substrate and the second direction being substantially parallel to the upper surface of the substrate;
first insulation patterns between the gate electrodes, each of the first insulation patterns including boron nitride (BN);
second insulation patterns between the gate electrodes and extending along the first direction into the substrate, and each of the second insulation patterns including amorphous boron nitride and being in direct contact with the substrate; and
pillar structures extending in the first direction through the gate electrodes and the first insulation patterns on the substrate, each of the pillar structures includes a vertical gate electrode extending in the first direction and a variable resistance pattern on a sidewall of the vertical gate electrode;
first wirings electrically connected to the plurality of gate electrode structures, each of the first wirings extending in the second direction on the plurality of gate electrode structures; and
second wirings electrically connected to the vertical gate electrodes of the pillar structures, each of the second wirings extending in a third direction on the pillar structures to overlap the second insulation patterns, the third direction being substantially parallel to the upper surface of the substrate and crossing the second direction,
wherein the first insulation patterns include amorphous boron nitride (a-BN); and
wherein each of the second insulation patterns has an extension extending continuously in the second direction between the pillar structures that are spaced apart from each other along a third direction crossing to the second direction.
2. The vertical variable resistance memory device as claimed in claim 1 , wherein the pillar structures are spaced apart from each other in the second direction.
3. The vertical variable resistance memory device as claimed in claim 2 , wherein
the plurality of gate electrode structures are spaced apart from each other in the third direction that is substantially parallel to the upper surface of the substrate and substantially perpendicular to the second direction.
4. The vertical variable resistance memory device as claimed in claim 3 , wherein:
the gate electrodes in each of the plurality of gate electrode structures are stacked in a staircase shape in which extension lengths of the gate electrodes in the second direction decrease in a stepwise manner from a lowermost level toward an uppermost level, and
the extension of the second insulation patterns has a length in the second direction greater than or equal to an extension length in the second direction of a lowermost one of the gate electrodes in each of the plurality of gate electrode structures.
5. The vertical variable resistance memory device as claimed in claim 4 , wherein the first insulation patterns between the gate electrodes in each of the plurality of gate electrode structures are stacked in a staircase shape in which extension lengths of the first insulation patterns in the second direction decrease in a stepwise manner from a lowermost level toward an uppermost level.
6. The vertical variable resistance memory device as claimed in claim 3 , wherein an upper surface of the second insulation patterns is higher than upper surfaces of the gate electrode structures.
7. The vertical variable resistance memory device as claimed in claim 1 , wherein the variable resistance pattern includes a perovskite-based material or a transition metal oxide.
8. A vertical variable resistance memory device, comprising:
gate electrode structures each including gate electrodes spaced apart from each other in a first direction on a substrate, each of the gate electrodes extending in a second direction, the gate electrode structures being spaced apart from each other in a third direction, the first direction being substantially perpendicular to an upper surface of the substrate, the second direction being substantially parallel to the upper surface of the substrate, the third direction being substantially parallel to the upper surface of the substrate and crossing the second direction, and the gate electrodes in each of the gate electrode structures being stacked in a staircase shape in which extension lengths of the gate electrodes in the second direction decrease in a stepwise manner from a lowermost level toward an uppermost level;
first insulation patterns between the gate electrodes in each of the gate electrode structures, each of the first insulation patterns including amorphous boron nitride (a-BN);
second insulation patterns between the gate electrode structures and extending into the substrate, each of the second insulation patterns including a-BN and being in direct contact with the substrate, the second insulation patterns electrically insulating the gate electrode structures from each other; and
pillar structures extending in the first direction on the substrate, the pillar structures extending through the gate electrodes and the first insulation patterns therebetween in each of the gate electrode structures, and each of the pillar structures includes a concentric arrangement comprising a vertical gate electrode extending in the first direction and a variable resistance pattern on a sidewall of the vertical gate electrode;
first wirings electrically connected to the gate electrode structures, each of the first wirings extending in the second direction on the gate electrode structures; and
second wirings electrically connected to the vertical gate electrodes of the pillar structures, each of the second wirings extending in the third direction on the pillar structures to overlap the second insulation patterns,
wherein the second insulation patterns have an extension extending continuously in the second direction between the pillar structures that are spaced apart from each other along the third direction, and
wherein the extension of the second insulation patterns is greater than or equal to an extension length of a lowermost one of the gate electrodes in each of the gate electrode structures.
9. The vertical variable resistance memory device as claimed in claim 8 , wherein upper surfaces of the second insulation patterns are higher than upper surfaces of the gate electrode structures.
10. The vertical variable resistance memory device as claimed in claim 8 , wherein lower surfaces and sidewalls of ones of the gate electrodes in each of the gate electrode structures are covered by the first insulation patterns and the second insulation patterns.
11. The vertical variable resistance memory device as claimed in claim 8 , wherein:
each of the first insulation patterns between the gate electrodes and one of the gate electrodes directly contacting an upper surface thereof in each of the gate electrode structures form a step layer, and
a plurality of step layers are stacked in a staircase shape in which extension lengths in the second direction of the step layers decrease in a stepwise manner from a lowermost level toward an uppermost level.
12. The vertical variable resistance memory device as claimed in claim 8 , wherein each of the gate electrodes and the vertical gate electrode include graphene.
13. The vertical variable resistance memory device as claimed in claim 8 , wherein the pillar structures are spaced apart from each other in the second direction.
14. A vertical variable resistance memory device, comprising:
gate electrode structures each including gate electrodes spaced apart from each other in a first direction on a substrate, each of the gate electrodes including graphene and extending in a second direction, the gate electrode structures being spaced apart from each other in a third direction, the first direction being substantially perpendicular to an upper surface of the substrate, the second direction being substantially parallel to the upper surface of the substrate, and the third direction being substantially parallel to the upper surface of the substrate and crossing the second direction;
first insulation patterns between the gate electrodes in each of the gate electrode structures, each of the first insulation patterns including amorphous boron nitride (a-BN);
second insulation patterns between the gate electrode structures and extending into the substrate, each of the second insulation patterns including a-BN and being in direct contact with the substrate, the second insulation patterns electrically insulating the gate electrode structures from each other;
pillar structures each extending in the first direction on the substrate, each of the pillar structures extending through the gate electrodes and the first insulation patterns therebetween in each of the gate electrode structures, and each of the pillar structures including:
a vertical gate electrode including graphene and extending in the first direction; and
a variable resistance pattern on a sidewall of the vertical gate electrode,
first wirings electrically connected to the gate electrode structures, each of the first wirings extending in the second direction on the gate electrode structures; and
second wirings electrically connected to the vertical gate electrodes of the pillar structures, each of the second wirings extending in the third direction on the pillar structures to overlap the second insulation patterns,
wherein each of the second insulation patterns has an extension extending continuously in the second direction between the pillar structures that are spaced apart from each other along the third direction.
15. The vertical variable resistance memory device as claimed in claim 14 , wherein upper surfaces of the second insulation patterns are higher than upper surfaces of the gate electrode structures.
16. The vertical variable resistance memory device as claimed in claim 14 , wherein:
the extension of the second insulation patterns has a length in the second direction greater than or equal to an extension length in the second direction of a lowermost one of the gate electrodes in each of the gate electrode structures.