IP Library › Granted Patent US 12,196,628
Granted Patent B2
US 12,196,628 · App. 17/754,317 · Granted Jan 14, 2025

Strain gauge and sensor module

Inventor: Satoshi Sato (Kanagawa, JP)
Assignee: MINEBEA MITSUMI Inc.
G01L1/2287H05K1/189G01B7/16G01B7/18G01L1/22H05K1/16H05K1/167H05K2201/09263H05K2201/10151
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Quick Facts
Patent No.
US 12,196,628
App. No.
17/754,317
Granted
Jan 14, 2025
Kind
B2
Abstract

A strain gauge includes a substrate made from resin and having flexibility, a resistor formed on one surface of the substrate, and an insulating resin layer covering the resistor, wherein the insulating resin layer is a thermoplastic polyimide layer.

Claims (22)

1. A sensor module comprising:

a strain gauge; and

a flexure element configured to transmit strain to the strain gauge,

wherein the strain gauge includes

a substrate made from resin and having flexibility;

a resistor formed on a surface of the substrate; and

an insulating resin layer covering the resistor,

wherein the insulating resin layer is a thermoplastic polyimide layer, and

wherein the insulating resin layer is fused to the flexure element.

2. The sensor module according to claim 1 , wherein a thickness of the insulating resin layer is 5 μm or more and 7 μm or less.

3. The sensor module according to claim 1 , further comprising:

a flexible print circuit board on which an electrode is formed,

wherein the strain gauge includes a terminal section exposed from the insulating resin layer, the terminal section being electrically connected to the resistor, and

the terminal section is electrically connected to the electrode via a conductive adhesive layer.

4. The sensor module according to claim 3 , wherein the conductive adhesive layer is an anisotropic conductive film.

5. The sensor module according to claim 1 , further comprising:

a flexible print circuit board on which an electrode is formed,

wherein the strain gauge includes a terminal section exposed from the insulating resin layer, the terminal section being electrically connected to the resistor,

the terminal section is electrically connected to the electrode via a conductive adhesive layer, and

the insulating resin layer is fused to an area of the flexible print circuit board where the electrode is not formed.

6. The sensor module according to claim 5 ,

wherein a side of the flexible print circuit board opposite from a side where the electrode is formed is pasted to the flexure element.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 11, 2022
From: SATO, SATOSHI
To: MINEBEA MITSUMI INC.
Reel/Frame 059890/0543 →
Priority Claims (1)
JP 2019-181206 · Oct 1, 2019 · national
Continuity (1)
Related Publication 20220390301A1 · Dec 8, 2022
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