IP Library › Granted Patent US 12,197,774
Granted Patent B2
US 12,197,774 · App. 17/899,833 · Granted Jan 14, 2025

Semiconductor device and control method

Inventor: Nobuhiro Tsuji (Yokohama Kanagawa, JP)
Assignee: KIOXIA CORPORATION
G06F3/0656G06F3/0604G06F3/0659G06F3/0679
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Quick Facts
Patent No.
US 12,197,774
App. No.
17/899,833
Granted
Jan 14, 2025
Kind
B2
Abstract

According to one embodiment, there is provided a semiconductor device including a first chip, a second chip group having a plurality of second chips electrically connected to the first chip, and a third chip group having a plurality of third chips electrically connected to the first chip in parallel with the second chip group, in which the first chip has a command queue that stores a plurality of read commands received from the host, and a read buffer memory that buffers read data, sequentially issues the plurality of read commands stored in the command queue to the second chip group or the third chip group, stores the read data corresponding to the plurality of read commands from the second chip group or the third chip group, in the read buffer memory, and transmits any read data among the read data stored in the read buffer memory to the host based on an execution status of any read command among the plurality of read commands.

Claims (68)

1. A semiconductor device comprising:

a first chip having a terminal to which a signal from a host is configured to be input;

a second chip group having a plurality of second chips electrically connected to the first chip; and

a third chip group having a plurality of third chips electrically connected to the first chip in parallel with the second chip group, wherein the first chip includes:

a command queue configured to store a plurality of read commands received from the host; and

a read buffer memory configured to buffer read data from the second chip group or the third chip group; and the first chip is configured to:

sequentially issue the plurality of read commands stored in the command queue from the command queue to the second chip group or the third chip group;

store, in the read buffer memory, the read data retrieved from the second chip group or the third chip group in response to issuance, by the first chip, of the plurality of read commands to the second chip group or the third chip group; and

transmit any read data among the read data stored in the read buffer memory to the host based on an execution status of any read command among the plurality of read commands issued to the second chip group or the third chip group, wherein

an execution order of the plurality of read commands stored in the command queue is variable.

2. The semiconductor device according to claim 1 , wherein

the first chip is configured to:

store a part of read data corresponding to a first read command among the plurality of read commands from the second chip group or the third chip group, in the read buffer memory; and

store remaining read data corresponding to the first read command from the second chip group or the third chip group based on an execution status of a second read command other than the first read command, in the read buffer memory.

3. The semiconductor device according to claim 1 , wherein

the first chip further includes a write buffer memory,

the first chip is configured to receive a write command from the host, store write data related to the write command in the write buffer memory, and write the stored write data to the second chip group or the third chip group.

4. The semiconductor device according to claim 1 , wherein

the first chip is configured to receive a command different from the read command from the host, and further store the different command in the command queue.

5. The semiconductor device according to claim 1 , wherein

when the first chip receives a priority command for designating a command that is preferentially to be executed from the host, the first chip is configured to execute the command stored in the command queue and preferentially to be executed in response to the received priority command.

6. The semiconductor device according to claim 1 , wherein

a plurality of planes that are parallel operation elements are defined in each of the second chips and the third chips, and

the first chip is configured to transmit information obtained by editing a status of each plane to the host.

7. A control method for controlling a semiconductor device which is connectable to a host and comprises a first chip having a command queue configured to store a plurality of read commands received from the host, and a read buffer memory configured to buffer read data, a second chip group having a plurality of second chips electrically connected to the first chip, and a third chip group having a plurality of third chips electrically connected to the first chip in parallel with the second chip group, the control method comprising:

sequentially issuing the plurality of read commands received from the host and stored in the command queue of the first chip to the second chip group or the third chip group;

storing, in the read buffer memory of the first chip, read data read from the second chip group or the third chip group corresponding to the plurality of read commands issued, by the first chip, to the second chip group or the third chip group from the command queue of the first chip; and

transmitting any read data among the read data stored in the read buffer memory of the first chip to the host based on an execution status of any read command among the plurality of read commands issued to the second chip group or the third chip group from the command queue of the first chip, wherein

an execution order of the plurality of read commands stored in the command queue is variable.

8. The control method of claim 7 , further comprising:

storing a part of read data corresponding to a first read command among the plurality of read commands from the second chip group or the third chip group, in the read buffer memory; and

storing remaining read data corresponding to the first read command from the second chip group or the third chip group based on an execution status of a second read command other than the first read command, in the read buffer memory.

9. The control method of claim 7 , further comprising:

receiving a write command from the host;

storing write data related to the write command in a write buffer memory; and

writing the stored write data to the second chip group or the third chip group.

10. The control method of claim 7 , further comprising:

receiving a command different from the read command from the host; and

storing the different command in the command queue.

11. The control method of claim 7 , further comprising:

in response to the first chip receiving a priority command for designating a command that is preferentially to be executed from the host, executing the command stored in the command queue and preferentially executed in response to the received priority command.

12. The control method of claim 7 , wherein a plurality of planes that are parallel operation elements are defined in each of the second chips and the third chips, the method further comprising transmitting information obtained by editing a status of each plane to the host.

13. A semiconductor device comprising:

a first chip having a terminal to which a signal from a host is configured to be input;

a second chip group having a plurality of second chips electrically connected to the first chip; and

a third chip group having a plurality of third chips electrically connected to the first chip in parallel with the second chip group, wherein

the first chip includes:

a command queue configured to store a plurality of read commands received from the host; and

a read buffer memory configured to buffer read data read from the second chip group or the third chip group; and the first chip is configured to:

check a read operation status of the second or third chip group,

issue the plurality of read commands stored in the command queue from the command queue with priority to the second or third chip group that is not performing the read operation,

store, in the read buffer memory, the read data retrieved from the second chip group or the third chip group in response to issuance, by the first chip, of the plurality of read commands to the second chip group or the third chip group; and

transmit any read data among the read data stored in the read buffer memory to the host based on an execution status of any read command among the plurality of read commands issued to the second chip group or the third chip group, wherein

the first chip is configured to:

store a part of read data corresponding to a first read command among the plurality of read commands from the second chip group or the third chip group, in the read buffer memory; and

store remaining read data corresponding to the first read command from the second chip group or the third chip group based on an execution status of a second read command other than the first read command, in the read buffer memory.

14. The semiconductor device according to claim 13 , wherein

an execution order of the plurality of read commands stored in the command queue is variable.

15. The semiconductor device according to claim 13 , wherein

the first chip further includes a write buffer memory,

the first chip is configured to receive a write command from the host, store write data related to the write command in the write buffer memory, and write the stored write data to the second chip group or the third chip group.

16. The semiconductor device according to claim 13 , wherein

the first chip is configured to receive a command different from the read command from the host, and further store the different command in the command queue.

17. The semiconductor device according to claim 13 , wherein

when the first chip receives a priority command for designating a command that is preferentially to be executed from the host, the first chip is configured to execute the command stored in the command queue and preferentially to be executed in response to the received priority command.

18. The semiconductor device according to claim 13 , wherein

a plurality of planes that are parallel operation elements are defined in each of the second chips and the third chips, and

the first chip is configured to transmit information obtained by editing a status of each plane to the host.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 5, 2022
From: TSUJI, NOBUHIRO
To: KIOXIA CORPORATION
Reel/Frame 061320/0030 →
Priority Claims (1)
JP 2021-205982 · Dec 20, 2021 · national
Continuity (1)
Related Publication 20230195371A1 · Jun 22, 2023
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