IP Library › Granted Patent US 12,200,875
Granted Patent B2
US 12,200,875 · App. 17/277,748 · Granted Jan 14, 2025

Copper metallization for through-glass vias on thin glass

Inventors: Yiu-Hsiang Chang (Taoyuan, TW); Jen-Chieh Lin (Horseheads, NY); Prantik Mazumder (Ithaca, NY); Scott Christopher Pollard (Big Flats, NY); Pei-Lien Tseng (Zhubei, TW)
Assignee: Industrial Technology Research Institute
H05K3/423C23C18/1653C25D7/00H05K1/0306
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Quick Facts
Patent No.
US 12,200,875
App. No.
17/277,748
Granted
Jan 14, 2025
Kind
B2
Abstract

A method for metallizing through-glass vias in a glass substrate includes functionalizing a surface of the glass substrate with a silane. The glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t. The method further includes applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface, disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias; positioning an electrode within the electrolyte; and applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%.

Claims (21)

1. A method for metallizing through-glass vias in a glass substrate, the method comprising:

functionalizing a surface of the glass substrate with a silane, wherein the glass substrate has an average thickness t and comprises a plurality of vias extending through the thickness t;

applying an electroless plating solution comprising a copper ion to deposit a copper seed layer on the functionalized surface;

disposing an electrolyte within the plurality of vias, wherein the electrolyte comprises copper ions to be deposited on the copper seed layer within the plurality of vias;

positioning an electrode within the electrolyte; and

applying a current between the electrode and the glass substrate, thereby reducing the copper ions into copper within the plurality of vias such that each of the plurality of vias is filled with copper and the copper has a void volume fraction of less than 5%, wherein the second current density is greater than or equal to 0.75 amps/dm 2 and less than or equal to 2 amps/dm 2.

2. The method according to claim 1 , wherein the average thickness t of the glass substrate is greater than or equal to 50 μm and less than or equal to 150 μm.

3. The method according to claim 1 , wherein the average thickness t of the glass substrate is greater than or equal to 90 μm and less than or equal to 110 μm.

4. The method according to claim 1 , wherein each of the plurality of vias has an average diameter of greater than or equal to 8 μm and less than or equal to 20 μm; and

an aspect ratio of the average thickness t of the glass substrate to the average diameter of the plurality of vias is greater than or equal to 5:1 and less than or equal to 12:1.

5. The method according to claim 1 , wherein the electrolyte further comprises chloride ions and an additive.

6. The method according to claim 5 , wherein the additive consists of nitrotetrazolium blue chloride.

7. The method according to claim 6 , wherein the additive is present in the electrolyte in a concentration of greater than or equal to 20 ppm and less than or equal to 60 ppm.

8. The method according to claim 5 , wherein the chloride ions are present in the electrolyte in a concentration of greater than or equal to 20 ppm and less than or equal to 140 ppm.

9. The method according to claim 1 , wherein applying the current comprises applying the current at a current density of greater than or equal to 0.05 amps/dm 2 and less than or equal to 2 amps/dm 2 .

10. The method according to claim 1 , further comprising wetting the glass substrate including the copper seed layer prior to disposing the electrolyte within the plurality of vias.

11. The method according to claim 1 , wherein the copper in each of the plurality of vias has a void volume fraction of less than 1%.

12. The method according to claim 1 , wherein the copper in each of the plurality of vias is free of voids.

13. The method according to claim 1 , further comprising cleaning the glass substrate prior to functionalizing the surface, wherein the glass substrate has a water contact angle of less than or equal to 5 degrees after the cleaning.

14. The method according to claim 1 , wherein functionalizing the surface of the glass substrate comprises functionalizing sidewalls of the plurality of vias.

15. The method according to claim 1 , further comprising annealing the glass substrate comprising the copper seed layer prior to disposing the electrolyte within the plurality of vias.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 20, 2021
From: LIN, JEN-CHIEH; MAZUMDER, PRANTIK; POLLARD, SCOTT CHRISTOPHER; TSENG, PEI-LIEN; CHANG, YIU-HSIANG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 058431/0331 →
Continuity (2)
Provisional Application 62733991 · Sep 20, 2018
Related Publication 20210360797A1 · Nov 18, 2021
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