IP Library Granted Patent US 12,202,015
Granted Patent B2
US 12,202,015 · App. 17/477,453 · Granted Jan 21, 2025

Airborne contaminant management method and system

Inventors: Chih-Ming Tsao (Hsinchu, TW); Tzu-Sou Chuang (Hsinchu, TW); Chwen Yu (Hsinchu, TW)
Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
B08B15/00B01D46/442G05B15/02H01J49/0036H01J49/40H01L21/67017B01D2279/35G06V10/751G06V20/00H01L21/67703H01L21/67739
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Quick Facts
Patent No.
US 12,202,015
App. No.
17/477,453
Granted
Jan 21, 2025
Kind
B2
Abstract

A method includes: generating a contaminant distribution map by sampling an environment of a cleanroom; selecting a first fabrication tool of the cleanroom by comparing the contaminant distribution map with at least one diffusion image in a first database; comparing parameters of the first fabrication tool against process utility information in a second database; and when the parameters are consistent with the process utility information, taking at least one action. The one action may include moving a cleaning tool to a location associated with a contaminant concentration of the contaminant distribution map; turning on a fan of the cleaning tool; stopping pod transit to the first fabrication tool; or halting production by the first fabrication tool.

Claims (49)

1. A method, comprising:

generating a contaminant distribution map by sampling an environment of a cleanroom;

selecting a first fabrication tool of the cleanroom by comparing the contaminant distribution map with at least one diffusion image in a first database;

comparing parameters of the first fabrication tool against process utility information in a second database; and

when the parameters are consistent with the process utility information, taking at least one action of:

moving a cleaning tool to a location associated with a contaminant concentration of the contaminant distribution map;

turning on a fan of the cleaning tool;

stopping pod transit to the first fabrication tool; or

halting production by the first fabrication tool.

2. The method of claim 1 , wherein selecting the first fabrication tool comprises:

selecting a first diffusion image of the at least one diffusion image; and

selecting the first fabrication tool when a confidence level of the first fabrication tool is a highest confidence level of all fabrication tools associated with the first diffusion image.

3. The method of claim 2 , wherein the confidence level is determined based on at least one computational fluid dynamics simulation.

4. The method of claim 3 , wherein the confidence level is forecasted by a trained machine learning analysis model.

5. The method of claim 1 , wherein:

moving the cleaning tool to the location is performed when a peak concentration level of the contaminant distribution map is above a first threshold; and

turning on the fan is performed when the peak concentration level is above a second threshold higher than the first threshold.

6. The method of claim 5 , wherein:

stopping pod transit and halting production are performed when the peak concentration level is above a third threshold higher than the second threshold.

7. The method of claim 1 , wherein selecting the first fabrication tool includes selecting a tool accessory located beneath a raised floor of the cleanroom.

8. A method, comprising:

generating cleanroom contaminants data by sampling cleanroom contaminants by a sampling system;

generating a first image based on the cleanroom contaminants data by a time-of-flight mass spectrometer (TOF-MS);

selecting a first fabrication tool based on a forecast using the first image and at least one other cleanroom diffusion image; and

reducing contaminant concentration near the first fabrication tool by an automated guided vehicle (AGV) dispatched by an AGV controller.

9. The method of claim 8 , wherein sampling the cleanroom contaminants includes sampling at least one of chlorofluorocarbons, hydrofluorocarbons, perfluorocarbons, isopropyl alcohol, acetone or total volatile organic compounds (TVOC).

10. The method of claim 8 , wherein sampling the cleanroom contaminants includes sampling by the sampling system including sampling units at an areal density in a range of about 1 per square meter (m 2 ) to about 50 per m 2 .

11. The method of claim 10 , wherein areal density of the sampling units is higher in a first zone of the cleanroom than in a second zone of the cleanroom.

12. The method of claim 11 , wherein the first zone includes an etching apparatus or an electroless copper plating apparatus.

13. The method of claim 8 , further comprising verifying the first fabrication tool by confirming:

acid or solvent supply send from the first fabrication tool;

operational status of the first fabrication tool;

utility information of the first fabrication tool; or

chemical use information of the first fabrication tool.

14. A method, comprising:

positioning a wafer in a fabrication tool;

detecting a peak concentration level of a contaminant above a first threshold;

predicting the fabrication tool as a source of the contaminant;

stopping delivery of further wafers to the fabrication tool;

completing processing of the wafer by the fabrication tool;

removing the wafer from the fabrication tool;

lowering the peak concentration level by repairing the fabrication tool; and

resuming delivery of the further wafers to the fabrication tool when the fabrication tool is repaired and the peak concentration level is below a baseline threshold lower than the first threshold.

15. The method of claim 14 , further comprising dispatching a cleaning tool to the fabrication tool when the peak concentration level exceeds a second threshold between the first threshold and the baseline threshold.

16. The method of claim 15 , further comprising filtering air near the fabrication tool when the peak concentration level exceeds a third threshold between the second threshold and the first threshold.

17. The method of claim 16 , further comprising recalling the cleaning tool when the peak concentration level exceeds the first threshold.

18. The method of claim 16 , wherein filtering the air includes turning on a fan of the cleaning tool in fluidic communication with a filter of the cleaning tool.

19. The method of claim 18 , wherein filtering the air includes orienting the filter toward a location associated with the peak concentration level by a drive system of the cleaning tool.

20. The method of claim 15 , wherein dispatching the cleaning tool includes transmitting a dispatch command wirelessly from an automated guided vehicle (AGV) controller to an AGV having a filtration system.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Nov 23, 2021
From: TSAO, CHIH-MING; CHUANG, TZU-SOU; YU, CHWEN
To: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Reel/Frame 058201/0302 →
Continuity (2)
Provisional Application 63163271 · Mar 19, 2021
Related Publication 20220297170A1 · Sep 22, 2022
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