Photonic semiconductor device and method of manufacture
A package includes a photonic layer on a substrate, the photonic layer including a silicon waveguide coupled to a grating coupler; an interconnect structure over the photonic layer; an electronic die and a first dielectric layer over the interconnect structure, where the electronic die is connected to the interconnect structure; a first substrate bonded to the electronic die and the first dielectric layer; a socket attached to a top surface of the first substrate; and a fiber holder coupled to the first substrate through the socket, where the fiber holder includes a prism that re-orients an optical path of an optical signal.
1. A package comprising:
a waveguide and a coupler on a first side of a first substrate;
an electronic die embedded in a first dielectric layer, the electronic die and the first dielectric layer being disposed over the first substrate, the waveguide and the coupler;
a second substrate over and bonded to top surfaces of the electronic die and the first dielectric layer;
socket coupled to a top surface of the second substrate, wherein inner sidewalls of the socket form a cavity; and
a microlens disposed on the top surface of the second substrate and in the cavity.
2. The package of claim 1 , further comprising an interconnect structure on the first side of the first substrate, wherein the first substrate comprises conductive vias extending from the interconnect structure to a second side of the first substrate.
3. The package of claim 1 , further comprising a fiber holder attached to the socket, the fiber holder comprising a casing and a prism, the fiber holder covering the cavity and the microlens.
4. The package of claim 3 , further comprising a void between the microlens and the fiber holder.
5. The package of claim 3 , wherein the prism is an arc prism.
6. The package of claim 1 , further comprising a pin disposed on the top surface of the second substrate, wherein the socket comprises a recess, wherein the pin protrudes into the recess.
7. The package of claim 6 , wherein the pin and the microlens are formed of a same material.
8. A package comprising:
a first substrate having an optical coupler;
an electronic die bonded to the first substrate, the electronic die being laterally offset from the optical coupler;
a first dielectric layer over the first substrate and along sidewalls of the electronic die;
a second substrate having a first side and a second side, the first side of the second substrate being bonded to the electronic die; and
a lens on the second side of the second substrate, wherein the lens is aligned with the optical coupler.
9. The package of claim 8 , wherein the second substrate extends over the first dielectric layer.
10. The package of claim 8 , further comprising:
a socket on the second side of the second substrate, the socket having a cavity, the lens being within the cavity.
11. The package of claim 10 , further comprising:
a pin protruding from the second side of the second substrate, wherein the pin extends into an opening in the socket.
12. The package of claim 11 , wherein a material of the pin and a material of the lens are the same.
13. The package of claim 10 , further comprising:
a casing attached to the socket, the casing being configured to couple to an optical fiber.
14. The package of claim 13 , wherein the casing includes a prism aligned with the lens.
15. A method comprising:
coupling a semiconductor die to a first wafer, the first wafer comprising a substrate, a photonic structure over the substrate, and an interconnect structure over the substrate;
depositing a first dielectric layer over the first wafer, the first dielectric layer covering sidewalls of the semiconductor die;
attaching a second substrate to a top surface of the semiconductor die and a top surface of the first dielectric layer; and
forming a lens over a top surface of the second substrate.
16. The method of claim 15 , wherein the photonic structure comprises a grating coupler and a waveguide.
17. The method of claim 15 , further comprising:
forming a pin over the top surface of the second substrate, wherein the pin and the lens are formed of a same material.
18. The method of claim 17 , further comprising:
attaching a socket to the second substrate, the socket fitting over the pin, the socket having a cavity, the cavity being aligned with the lens.
19. The method of claim 18 , further comprising:
attaching a casing to the socket, wherein the socket comprises a prism, wherein the casing includes a protrusion that extends into a recess in the socket.
20. The method of claim 19 , wherein the casing covers the cavity.