Method of manufacturing acoustic devices with improved sensitivity
A method of making an acoustic sensor (e.g., a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone) includes forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip (e.g., unsupported free end), the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion. The method also comprises attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam. One or more electrodes are disposed on or in the proximal portion of the beam.
1. A method of making a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone, comprising:
forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip, the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion; and
attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam.
2. The method of claim 1 wherein the one or more layers of piezoelectric material are formed or deposited so that the width of the beam is greater at the distal tip than at the proximal portion.
3. The method of claim 1 wherein the one or more layers of piezoelectric material are formed or deposited so that at least one side edge of the beam extends linearly between the proximal portion and the distal tip.
4. The method of claim 3 wherein the one or more layers of piezoelectric material are formed or deposited so that opposite side edges of the cantilever beam extend linearly between the proximal portion and the distal tip.
5. The method of claim 1 wherein the one or more layers of piezoelectric material are formed or deposited so that the beam is symmetrical about a centerline of the beam.
6. The method of claim 1 wherein the one or more layers of piezoelectric material are formed or deposited so that the distal tip is linear.
7. The method of claim 1 wherein the one or more layers of piezoelectric material are formed or deposited so that the beam has a trapezoidal shape.
8. The method of claim 1 further comprising forming or applying one or more electrodes to the proximal portion of the beam.
9. A method of making a microphone module, comprising:
forming or providing a printed circuit board that includes a substrate layer;
forming or providing a piezoelectric microelectromechanical systems microphone via a process comprising (a) forming one or more cantilever piezoelectric sensors including forming or depositing one or more piezoelectric layers to define a beam extending between a proximal portion and a distal tip, the beam having a width in plan view that is greater at a location distal of the proximal portion than at the proximal portion, and (b) attaching the beam to a substrate in cantilever form so that the proximal portion of the beam is anchored to the substrate and the distal tip is a free unsupported end of the beam; and
mounting the one or more piezoelectric microelectromechanical systems microphones on the printed circuit board.
10. The method of claim 9 wherein the one or more layers of piezoelectric material are formed or deposited so that the width of the beam is greater at the distal tip than at the proximal portion.
11. The method of claim 9 wherein the one or more layers of piezoelectric material are formed or deposited so that at least one side edge of the beam extends linearly between the proximal portion and the distal tip.
12. The method of claim 11 wherein the one or more layers of piezoelectric material are formed or deposited so that opposite side edges of the cantilever beam extend linearly between the proximal portion and the distal tip.
13. The method of claim 9 wherein the one or more layers of piezoelectric material are formed or deposited so that the beam is symmetrical about a centerline of the beam.
14. The method of claim 9 wherein the one or more layers of piezoelectric material are formed or deposited so that the distal tip is linear.
15. The method of claim 9 wherein the one or more layers of piezoelectric material are formed or deposited so that the beam has a trapezoidal shape.
16. The method of claim 9 further comprising forming or applying one or more electrodes to the proximal portion of the beam.
17. The method of claim 9 wherein the microphone module is a two-port module.
18. The method of claim 9 wherein forming or providing a piezoelectric microelectromechanical systems microphone includes forming a plurality of cantilever piezoelectric sensors and arranging the plurality of cantilever piezoelectric sensors in multiple pairs, at least one of the pairs having their corresponding distal tips oriented toward each other.
19. The method of claim 18 wherein at least one of the pairs has their corresponding distal tips oriented away from each other.
20. The method of claim 9 wherein forming or providing a piezoelectric microelectromechanical systems microphone includes forming a plurality of cantilever piezoelectric sensors and arranging the plurality of cantilever piezoelectric sensors in a circle such that the proximal portions of the cantilever piezoelectric sensors generally define a first circle and the distal tips of the cantilever piezoelectric sensors generally define a second circle that is larger in size than the first circle.