Method of making acoustic devices with directional reinforcement
A method of making an acoustic sensor includes forming or providing a mold having one or more grooves extending in a direction of the length of the mold to a distal end of the mold. The method also includes forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold. The method also includes forming or applying an electrode to the proximal portion of the structure and releasing the structure from the mold to form one or more cantilever beams. The corrugated section inhibits bending of the corrugated section along the length of the distal portion of the structure when the acoustic sensor is subjected to sound pressure.
1. A method of making a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone, comprising:
forming or providing a mold extending along a length and having two or more grooves in a top surface of the mold, the two or more grooves extending in a direction of the length of the mold to a distal end of the mold, the two or more grooves diverging from each other along their lengths;
forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including two or more grooves that correspond to the two or more grooves of the mold;
forming an electrode or applying an electrode to the proximal portion of the structure; and
releasing the structure from the mold to form one or more cantilever beams.
2. The method of claim 1 wherein the beam has a triangular profile.
3. A method of making a piezoelectric sensor for a piezoelectric microelectromechanical systems microphone, comprising:
forming or providing a mold extending along a length and having one or more grooves in a top surface of the mold, the one or more grooves extending in a direction of the length of the mold to a distal end of the mold;
forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold, a thickness of the beam between a top surface of the beam and a bottom surface of the beam being greater in the corrugated section than in the proximal portion of the beam; and
releasing the structure from the mold to form one or more cantilever beams.
4. A method of making an electronic device, comprising:
forming or providing a printed circuit board that includes a substrate layer;
forming or providing one or more piezoelectric microelectromechanical systems microphones via a process including (a) forming or providing a mold extending along a length and having one or more grooves in a top surface of the mold, the one or more grooves extending in a direction of the length of the mold to a distal end of the mold, (b) forming or depositing a structure having one or more piezoelectric layers over the top surface of the mold to define a beam with a proximal portion and a distal portion, the distal portion having a corrugated section including one or more grooves that correspond to the one or more grooves of the mold, (c) forming an electrode or applying an electrode to the proximal portion of the structure, (d) releasing the structure from the mold, and (e) leaving a part of the structure attached to a substrate in a cantilevered manner to form a cantilever beam that deflects when subjected to sound pressure, a thickness of the beam between a top surface and a bottom surface being greater in the corrugated section than in the proximal portion of the beam; and
mounting the one or more piezoelectric microelectromechanical systems microphones on the printed circuit board.
5. The method of claim 4 wherein the corrugated section has two or more grooves.
6. The method of claim 5 wherein the two or more grooves extend parallel to each other.
7. The method of claim 5 wherein the two or more grooves extend parallel to a central longitudinal axis of the beam.
8. The method of claim 4 wherein the two or more grooves diverge from each other along their lengths.
9. The method of claim 4 wherein the beam has a triangular profile.
10. The method of claim 3 wherein the corrugated section has two or more grooves.
11. The method of claim 10 wherein the two or more grooves extend parallel to each other.
12. The method of claim 10 wherein the two or more grooves extend parallel to a central longitudinal axis of the beam.
13. The method of claim 10 wherein the two or more grooves diverge from each other along their lengths.
14. The method of claim 10 wherein the beam has a triangular profile.