Electronic devices having multiple alignment layers
An electronic device includes a first substrate, a second substrate on the first substrate, a third substrate between the first substrate and the second substrate, a first optical media layer between the first substrate and the third substrate, and a second optical media layer between the second substrate and the third substrate. A sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion. Another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion.
1. An electronic device, comprising:
a first substrate;
a second substrate on the first substrate;
a third substrate between the first substrate and the second substrate;
a first optical media layer between the first substrate and the third substrate; and
a second optical media layer between the second substrate and the third substrate, wherein a sidewall of the third substrate is recessed from a sidewall of the first substrate and a sidewall of the second substrate to form a recessed portion, and another sidewall of the third substrate protrudes from another sidewall of the first substrate and another sidewall of the second substrate to form a protruding portion that is opposite to the recessed portion in a cross-sectional view of the electronic device.
2. The electronic device according to claim 1 , further comprising:
a first conductive layer disposed between the first optical media layer and the first substrate;
a second conductive layer disposed between the second optical media layer and the second substrate;
a third conductive layer disposed between the first optical media layer and the third substrate; and
a fourth conductive layer disposed between the first optical media layer and the third substrate, wherein portions of the first conductive layer and the second conductive layer are exposed from the recessed portion, and portions of the third conductive layer and the fourth conductive layer are exposed from the protruding portion.
3. The electronic device according to claim 2 , further comprising:
a first conductive adhesive disposed in the recessed portion and directly contacting the first conductive layer and the second conductive layer.
4. The electronic device according to claim 2 , further comprising:
a second conductive adhesive disposed on the protruding portion and directly contacting the third conductive layer and the fourth conductive layer.
5. The electronic device according to claim 1 , wherein the first optical media layer and the second optical media layer are dye-doped liquid crystal layers respectively comprising at least a dichroic dye.
6. An electronic device, comprising:
a first substrate;
a second substrate on the first substrate;
a third substrate between the first substrate and the second substrate;
a first optical media layer between the first substrate and the third substrate; and
a second optical media layer between the second substrate and the third substrate, wherein the first substrate, the third substrate and the second substrate are displaced layer by layer along a direction parallel to a surface of the first substrate to form a stepped structure comprising a first step portion and a second step portion at a first side and a third step portion and a fourth step portion at a second side opposite to the first side along the direction.
7. The electronic device according to claim 6 , further comprising:
a first conductive layer disposed between the first optical media layer and the first substrate and exposed from the first step portion of the stepped structure;
a second conductive layer disposed between the second optical media layer and the second substrate and exposed from the fourth step portion of the stepped structure;
a third conductive layer disposed between the first optical media layer and the third substrate and exposed from the third step portion of the stepped structure; and
a fourth conductive layer disposed between the second optical media layer and the third substrate and exposed from the second step portion of the stepped structure.