Package with integrated optical die and method forming same
A method includes forming a package, which includes an optical die and a protection layer attached to the optical die. The optical die includes a micro lens, with the protection layer and the micro lens being on a same side of the optical die. The method further includes encapsulating the package in an encapsulant, planarizing the encapsulant to reveal the protection layer, and removing the protection layer to form a recess in the encapsulant. The optical die is underlying the recess, with the micro lens facing the recess.
1. A method comprising:
forming a first package comprising an optical die and a protection layer attached to the optical die, wherein the optical die comprises a micro lens, and wherein the protection layer and the micro lens are on a same side of the optical die;
encapsulating the first package in a first encapsulant;
planarizing the first encapsulant to reveal the protection layer; and
removing the protection layer to form a recess in the first encapsulant, wherein the optical die is underlying the recess, with the micro lens facing the recess, wherein after the protection layer is removed, a portion of the recess extends into the first encapsulant, and extends to a level lower than a back surface of the optical die, and wherein the portion of the recess extending into the first encapsulant forms a recess ring encircling the optical die.
2. The method of claim 1 , wherein the forming the first package comprises adhering the optical die to a die-attach film.
3. The method of claim 2 further comprising:
sawing an optical wafer into a plurality of optical dies, with the optical die being one of the plurality of optical dies.
4. The method of claim 3 further comprising:
encapsulating the optical die in a second encapsulant;
planarizing the second encapsulant to reveal electrical connectors in the optical die; and
sawing the second encapsulant to form the first package.
5. The method of claim 1 , wherein the optical die comprises a semiconductor substrate, and wherein the micro lens is recessed into the semiconductor substrate from a surface of the semiconductor substrate.
6. The method of claim 1 , wherein the optical die comprises a semiconductor substrate, and wherein the micro lens protrudes out of a back surface of the semiconductor substrate.
7. The method of claim 1 , wherein a package component is also encapsulated in the first encapsulant, and wherein after the first encapsulant is planarized, the package component is revealed, and the optical die is covered by the protection layer.
8. The method of claim 1 further comprising:
bonding the first package to a package component, wherein the first encapsulant is applied on the package component, and the method further comprises sawing the package component and the first encapsulant to form a second package.
9. The method of claim 1 , wherein the optical die comprises a photodiode.
10. A method comprising:
forming a first package component comprising:
placing a die-attach film on a carrier;
placing an optical die on the die-attach film, wherein the optical die comprises a micro lens, and the die-attach film extends into the micro lens to act as a filling layer; and
encapsulating the optical die in a first encapsulant; and
encapsulating the first package component in a second encapsulant to form a second package component, wherein a first top surface of the optical die is recessed lower than a second top surface of the second encapsulant to form a recess, and wherein the optical die is exposed to the recess.
11. The method of claim 10 further comprising, after the first package component is encapsulated in the second encapsulant, removing the die-attach film to expose the optical die.
12. The method of claim 10 wherein at a time the die-attach film is removed, the second encapsulant encircling the optical die comprises curved and concave top surfaces.
13. The method of claim 10 , wherein the first encapsulant comprises a molding compound.
14. The method of claim 10 further comprising placing an optical fiber facing the micro lens, wherein the optical fiber is configured to optically couple to the optical die.
15. The method of claim 10 further comprising bonding the second package component to a third package component.
16. The method of claim 10 , wherein the placing the first package component comprises pressing the optical die against the die-attach film, so that the die-attach film is pressed into an additional recess in the optical die.
17. A method comprising:
placing a first package component comprising an optical die onto a carrier through a die-attach film, wherein the optical die comprises:
a semiconductor substrate; and
a micro lens at a top surface of the semiconductor substrate, wherein the die-attach film physically contacts the micro lens;
placing a second package component comprising a device die therein;
molding the first package component and the second package component in a molding compound;
removing the die-attach film that covers the optical die to reveal the micro lens; and
forming an interconnect structure electrically coupling to the optical die and the second package component.
18. The method of claim 17 , wherein the die-attach film extends into a recess of the semiconductor substrate, and wherein the micro lens is in the recess.
19. The method of claim 18 further comprising:
de-bonding a reconstructed wafer comprising the optical die and the die-attach film from the carrier; and
sawing the reconstructed wafer to separate the first package component from other package components having a same structure as the first package component.
20. The method of claim 18 , wherein the placing the first package component comprises pressing the optical die against the die-attach film, so that the die-attach film is pressed into the recess.