IP Library › Granted Patent US 12,237,811
Granted Patent B2
US 12,237,811 · App. 18/115,054 · Granted Feb 25, 2025

Device emitting or detecting terahertz waves, and manufacturing method for device

Inventor: Yasushi Koyama (Kamakura, JP)
Assignee: Canon Kabushiki Kaisha
H03B7/08H01Q1/2283H01Q9/0457H01Q9/24H01Q23/00
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Quick Facts
Patent No.
US 12,237,811
App. No.
18/115,054
Granted
Feb 25, 2025
Kind
B2
Abstract

A device includes a first antenna arranged on a substrate, with the first antenna comprising a first semiconductor layer having terahertz-wave gain and a first conductor layer, a second antenna arranged on the substrate, with the second antenna comprising a second semiconductor layer having terahertz-wave gain and a second conductor layer, and a third conductor layer arranged on the substrate and electrically connecting the first antenna and the second antenna. A shunt device is arranged on the substrate and electrically connected to the third conductor layer. In planar view, the shunt device does not overlap with at least the first conductor layer.

Claims (25)

1. A device comprising:

a first antenna arranged on a substrate, the first antenna comprising a first semiconductor layer having terahertz-wave gain and a first conductor layer;

a second antenna arranged on the substrate, the second antenna comprising a second semiconductor layer having terahertz-wave gain and a second conductor layer;

a third conductor layer arranged on the substrate and electrically connecting the first antenna and the second antenna; and

a shunt device arranged on the substrate and electrically connected to the third conductor layer,

wherein, in planar view, the shunt device does not overlap with at least the first conductor layer.

2. The device according to claim 1 , wherein, in planar view, the shunt device does not overlap with the second conductor layer.

3. The device according to claim 1 , wherein the shunt device comprises at least a first capacitance.

4. The device according to claim 3 , wherein the first capacitance comprises at least a fourth conductor layer.

5. The device according to claim 4 , further comprising a fifth conductor layer arranged on the substrate,

wherein the fifth conductor layer is located between the first conductor layer and the substrate and between the fourth conductor layer and the substrate.

6. The device according to claim 5 , wherein the fifth conductor layer is supplied with a ground potential.

7. The device according to claim 4 , wherein a distance from the substrate to the fourth conductor layer is shorter than a distance from the substrate to the first conductor layer.

8. The device according to claim 3 , wherein the shunt device comprises at least a second capacitance, and

wherein, in planar view, the third conductor layer is located between the first capacitance and the second capacitance.

9. The device according to claim 8 , wherein shunt device comprises at least a first resistance and a second resistance, and

wherein, in planar view, the first resistance is located between the third conductor layer and the first capacitance, and the second resistance is located between the third conductor layer and the second capacitance.

10. The device according to claim 9 , wherein the first resistance and the first capacitance are connected in series, and the second resistance and the second capacitance are connected in series.

11. The device according to claim 1 , wherein a length from the substrate to the third conductor layer is equal to a length from the substrate to the first conductor layer.

12. The device according to claim 1 , wherein the shunt device is connected to a node of an electric field of the terahertz-wave in the third conductor layer.

13. The device according to claim 1 , further comprising a plurality of antennas, wherein the first antenna, the second antenna, and the plurality of antennas are arranged in a m×n matrix, with m≥2 and n≥2.

14. The device according to claim 1 , wherein the first conductor layer constitutes a patch antenna.

15. The device according to claim 14 , wherein the at least one of the first semiconductor layer and the second semiconductor layer comprises a negative resistance element.

16. The device according to claim 15 , wherein the negative resistance element is a resonance tunnel diode.

17. The device according to claim 1 , wherein the terahertz-wave is an electromagnetic wave in the frequency region of 30 GHz or more and 30 THz or less.

Priority Claims (1)
JP 2019-173084 · Sep 24, 2019 · national
Continuity (2)
Continuation 17027875 · Sep 22, 2020
Related Publication 20230208359A1 · Jun 29, 2023
References Cited (42)
US 9154084B2 · Harwalkar et al. · 2015 [cited by applicant]
US 9184697B2 · Sekiguchi et al. · 2015 [cited by applicant]
US 9865920B1 · Kuo et al. · 2018 [cited by applicant]
US 9998074B2 · Koyama · 2018 [cited by applicant]
US 10090585B2 · Dinc et al. · 2018 [cited by applicant]
US 10985466B2 · Ma et al. · 2021 [cited by applicant]
US 11626839B2 · Koyama · 2023 [cited by examiner]
US 20100026400A1 · Koyama et al. · 2010 [cited by applicant]
US 20100045392A1 · Koyama et al. · 2010 [cited by applicant]
US 20120119838A1 · Koyama et al. · 2012 [cited by applicant]
US 20120274410A1 · Koyama · 2012 [cited by applicant]
US 20140132466A1 · Inoue et al. · 2014 [cited by applicant]
US 20140197896A1 · Ouchi · 2014 [cited by examiner]
US 20140266477A1 · Sekiguchi et al. · 2014 [cited by applicant]
US 20150346034A1 · Lee · 2015 [cited by examiner]
US 20160006215A1 · Koyama et al. · 2016 [cited by applicant]
US 20160344343A1 · Feiginov et al. · 2016 [cited by applicant]
US 20160373061A1 · Sekiguchi · 2016 [cited by applicant]
US 20170271774A1 · Mukai · 2017 [cited by examiner]
US 20180152141A1 · Koyama · 2018 [cited by examiner]
US 20190067788A1 · Koyama · 2019 [cited by examiner]
US 20200293806A1 · Sato et al. · 2020 [cited by applicant]
US 20200296265A1 · Itsuji et al. · 2020 [cited by applicant]
US 20200296266A1 · Koyama et al. · 2020 [cited by applicant]
US 20210066811A1 · Tsuruda · 2021 [cited by applicant]
CN 102668370A · 2012 [cited by applicant]
CN 103811860A · 2014 [cited by applicant]
CN 105190991A · 2015 [cited by applicant]
JP 2005123385A · 2005 [cited by applicant]
JP 2008010811A · 2008 [cited by applicant]
JP 2014200065A · 2014 [cited by applicant]
JP 2017201779A · 2017 [cited by applicant]
WO 2016203712A1 · 2016 [cited by applicant]
Jenshan Lin et al., “Two-Dimensional Quasi-Optical Power-Combining Arrays Using Strongly Coupled Oscillators”, IEEE Transactions on Microwave Theory and Techniques, vol. 42, No. 4, pp. 734-741, Apr. 1994. [cited by applicant]
Hidetoshi Kanaya et al., “Fundamental Oscillation up to 1.42 THz in Resonant Tunneling Diodes by Optimized Collector Spacer Thickness”, J. Infrared Milli. Terahz Waves, vol. 35, pp. 425-431, Feb. 16, 2014. [cited by applicant]
Masahiro Asada et al., “Theoretical analysis of coupled oscillator array using resonant tunneling diodes in subterahertz and terahertz range”, J. Appl. Phys., vol. 103, pp. 124514, Jun. 27, 2008. [cited by applicant]
Masahiro Asada et al., “Resonant Tunneling Diodes for Sub-Terahertz and Terahertz Oscillators”, Jpn. J. Appl. Phys., vol. 47, No. 6, pp. 4375-4384, Jun. 13, 2008. [cited by applicant]
M. Reddy et al., Monolithic Schottky-Collector Resonant Tunnel Diode Oscillator Arrays to 650 Ghz:, IEEE Electron Device Letters, vol. 18, No. 5, pp. 218-221 (May 31, 1997). [cited by applicant]
M. Minegishi et al., “Mode Switching in an Active Antenna Using Reactive FET”, European Microwave Conference Proceedings, Vo. 2, pp. 1127-1130 (May 9, 1994). [cited by applicant]
Feb. 16, 2021 Extended European Search Report in European Patent Application No. 20 19 7671.9. [cited by applicant]
Nov. 29, 2023 Office Action in Chinese Patent Application Pub. No. 202010996019.1. [cited by applicant]
Jul. 9, 2024 Office Action in Japanese Patent Application Pub. No. 2023-117649 (with English translation). [cited by applicant]