Light emitting device structure and method for manufacturing same
A light emitting element structure may include at least one light emitting element which is disposed on a substrate and spaced apart from each other, and extends in a direction perpendicular to the substrate; an auxiliary layer which is disposed on the substrate, exposes at least a portion of the upper surface of the substrate, and surrounds the outer surface of the light emitting element; a current spreading layer which is disposed on the auxiliary layer and electrically contacts an end of the light emitting element; a first pad which is electrically connected to the end of the light emitting element, disposed on the current spreading layer, and does not to overlap the light emitting element; and a second pad which is electrically connected to another end of the light emitting element disposed on the upper surface of the exposed substrate and spaced apart from the auxiliary layer.
1. A light-emitting element structure comprising:
at least one light-emitting element which is disposed on a substrate and extends in a direction perpendicular to the substrate;
an auxiliary layer which is disposed on the substrate, exposes at least a portion of an upper surface of the substrate, and surrounds an outer surface of the at least one light-emitting element;
a current spreading layer which is disposed on the auxiliary layer, surrounds an entire side surface and an upper surface of an end portion of the at least one light-emitting element, and electrically contacts the end portion of the at least one light-emitting element;
a first pad which is electrically connected to the end portion of the at least one light-emitting element, disposed on the current spreading layer, and does not overlap the at least one light-emitting element; and
a second pad which is electrically connected to another end portion of the at least one light-emitting element, disposed on the at least a portion of the upper surface of the substrate, and spaced apart from the auxiliary layer, wherein
the first pad entirely surrounds the at least one light-emitting element in plan view,
the second pad entirely surrounds the at least one light-emitting element in plan view, and
the second pad entirely surrounds an outer periphery of the auxiliary layer in plan view.
2. The light-emitting element structure of claim 1 , further comprising:
a first area overlapping the at least one light-emitting element; and
a second area,
wherein the auxiliary layer and the current spreading layer are disposed in the first area and at least a portion of the second area.
3. The light-emitting element structure of claim 2 , wherein
the auxiliary layer includes an insulating material and is disposed such that the end portion of the at least one light-emitting element is partially exposed, and
the current spreading layer includes a transparent conductive material and entirely surrounds the end portion of the at least one light-emitting element.
4. The light-emitting element structure of claim 3 , wherein
the first pad includes a first extension portion and a first electrode line electrically connected to the first extension portion, and
the first electrode line includes two ends electrically connected to different side portions of the first extension portion and is disposed in the second area to surround the first area.
5. The light-emitting element structure of claim 4 , wherein the first extension portion has a width greater than a width of the first electrode line.
6. The light-emitting element structure of claim 5 , wherein the second pad has a constant width.
7. The light-emitting element structure of claim 2 , wherein the at least one light-emitting element includes:
a semiconductor crystal that extends in a direction; and
an insulating film surrounding an outer peripheral surface of the semiconductor crystal.
8. The light-emitting element structure of claim 7 , wherein
the semiconductor crystal includes:
a first conductivity-type semiconductor contacting the substrate;
a second conductivity-type semiconductor having a polarity different from a polarity of the first conductivity-type semiconductor;
an element active layer disposed between the first conductivity-type semiconductor and the second conductivity-type semiconductor; and
an electrode layer disposed on the second conductivity-type semiconductor, and
the insulating film is disposed such that an upper surface of the electrode layer is exposed.
9. The light-emitting element structure of claim 8 , wherein
the auxiliary layer contacts an outer surface of the insulating film,
the current spreading layer electrically contacts the electrode layer exposed by the insulating film, and
the first pad is electrically connected to the electrode layer through the current spreading layer.
10. The light-emitting element structure of claim 8 , wherein
the substrate includes a base substrate and a conductive semiconductor layer disposed on the base substrate,
the first conductivity-type semiconductor electrically contacts the conductive semiconductor layer, and
the second pad is disposed on the conductive semiconductor layer and is electrically connected to the first conductivity-type semiconductor.
11. The light-emitting element structure of claim 2 , wherein the at least one light-emitting element includes:
a first light-emitting element; and
a second light-emitting element spaced apart from the first light-emitting element.
12. The light-emitting element structure of claim 11 , wherein
the first area includes:
a first sub-area which overlaps the first light-emitting element; and
a second sub-area which overlaps the second light-emitting element and is spaced apart from the first sub-area, and the second area includes:
a third area disposed between the first sub-area and the second sub-area; and
a fourth area disposed at an outer periphery of the first sub-area and the second sub-area.
13. The light-emitting element structure of claim 12 , wherein the first pad includes:
a second extension portion disposed in the third area;
a second electrode line disposed in the fourth area; and
at least one connection portion disposed in the third area and electrically connecting the second extension portion and the second electrode line.
14. The light-emitting element structure of claim 13 , wherein the second electrode line surrounds the first sub-area and the second sub-area.
15. The light-emitting element structure of claim 13 , wherein the at least one connection portion is disposed in the third area.
16. The light-emitting element structure of claim 15 , wherein
the at least one connection portion includes:
a first connection portion which extends in a first direction, includes two ends electrically contacting the second electrode line, and includes a central portion overlapping the second extension portion; and
a second connection portion which extends in a second direction different from the first direction, electrically contacts the second electrode line, and includes a central portion overlapping the second extension portion, and
the first connection portion and the second connection portion intersect each other at the second extension portion.
17. A method of manufacturing a light-emitting element structure, the method comprising:
preparing a substrate and at least one light-emitting element which is disposed on the substrate and extends in a direction perpendicular to the substrate;
forming an auxiliary layer surrounding an outer surface of the at least one light-emitting element on the substrate;
forming a current spreading layer disposed on the auxiliary layer, surrounds a side surface and an upper surface of an end portion of the at least one light-emitting element, and electrically contacting the end portion of the at least one light-emitting element;
forming a first pad disposed on the current spreading layer and electrically connected to the end portion of the at least one light-emitting element, the first pad entirely surrounding the at least one light-emitting element in plan view; and
forming a second pad disposed on the substrate and electrically connected to another end portion of the at least one light-emitting element, the second pad entirely surrounding the at least one light-emitting element and entirely surrounding an outer periphery of the auxiliary layer in plan view.
18. The method of claim 17 , wherein
the auxiliary layer includes an insulating material and is disposed such that the end portion of the at least one light-emitting element is partially exposed,
the current spreading layer includes a transparent conductive material and surrounds the end portion of the at least one light-emitting element, and
the first pad is electrically connected to the end portion of the at least one light-emitting element through the current spreading layer.
19. The method of claim 18 , wherein
the forming of the first pad includes forming an extension portion and an electrode line electrically connected to the extension portion,
the extension portion does not overlap the at least one light-emitting element, and
the electrode line surrounds an area overlapping the at least one light-emitting element.
20. The method of claim 19 , wherein
the substrate includes a base substrate and a conductive semiconductor layer disposed on the base substrate, and
the forming of the second pad includes forming the second pad on the conductive semiconductor layer to be electrically connected to the another end portion of the at least one light-emitting element.
21. The light-emitting element structure of claim 1 , wherein
the current spreading layer contacts the entire side surface and the upper surface of the end portion of the at least one light-emitting element,
the first pad is spaced apart from the second pad in plan view and
the second pad entirely surrounds the first pad in plan view.