IP Library › Granted Patent US 12,265,329
Granted Patent B2
US 12,265,329 · App. 17/393,889 · Granted Apr 1, 2025

Actinic ray-sensitive or radiation-sensitive resin composition, actinic ray-sensitive or radiation-sensitive film, pattern forming method, and method for manufacturing electronic device

Inventors: Kotaro Takahashi (Haibara-gun, JP); Yasunori Yonekuta (Haibara-gun, JP); Taro Miyoshi (Haibara-gun, JP)
Assignee: FUJIFILM Corporation
G03F7/0045C07D235/18C07D263/57C07D277/66C08F212/24
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Quick Facts
Patent No.
US 12,265,329
App. No.
17/393,889
Granted
Apr 1, 2025
Kind
B2
Abstract

An actinic ray-sensitive or radiation-sensitive resin composition includes a resin having a solubility in a developer, which changes by the action of an acid, a compound that generates an acid upon irradiation with actinic rays or radiation; and an acid diffusion control agent, in which a molecular weight of the acid diffusion control agent is 420 or more, and a distance Ra between a Hansen solubility parameter of the acid diffusion control agent and a Hansen solubility parameter of the air satisfies 15≤Ra≤45.

Claims (25)

1. An actinic ray-sensitive or radiation-sensitive resin composition comprising:

a resin having a solubility in a developer, which changes by an action of an acid;

a compound that generates an acid upon irradiation with actinic rays or radiation; and

an acid diffusion control agent,

wherein a molecular weight of the acid diffusion control agent is 420 or more,

a distance Ra between a Hansen solubility parameter of the acid diffusion control agent and a Hansen solubility parameter of air is from 15 MPa 0.5 to 45 MPa 0.5 , and

the acid diffusion control agent is a compound represented by General Formula (Q-1),

in General Formula (Q-1),

Rq 1 and Rq 2 each independently represents a substituent,

Xq represents —NH—, —S—, or —O—,

in a case where Xq represents —NH—, the compound represented by General Formula (Q-1) is a compound represented by General Formula (Q11),

in General Formula (Q 11),

Rq 11 and Rq 12 each independently represents an alkyl group or an aryl group, and

Lq 1 and Lq 2 each independently represents a single bond, or —O—, —(C═O)—, an alkylene group, or a divalent linking group formed by combination of these groups, and

in a case where Xq represents —S— or —O—,

mq represents an integer of 0 to 5, in a case where mq is 2 or more, a plurality of Rq 1 's may be the same as or different from each other, and in a case where mq is 2 or more, the plurality of Rq 1 's may be bonded to each other to form a ring structure, and

nq represents an integer of 0 to 4, in a case where nq is 2 or more, a plurality of Rq 2 's may be the same as or different from each other, and in a case where nq is 2 or more, the plurality of Rq 2 's may be bonded to each other to form a ring structure.

2. The actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ,

wherein Ra is from 17 MPa 0.5 to 42 MPa 0.5 .

3. An actinic ray-sensitive or radiation-sensitive film formed of the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 .

4. A pattern forming method comprising:

forming a resist film using the actinic ray-sensitive or radiation-sensitive resin composition according to claim 1 ;

exposing the resist film; and

developing the exposed resist film using a developer.

5. A method for manufacturing an electronic device, comprising the pattern forming method according to claim 4 .

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 4, 2021
From: TAKAHASHI, KOTARO; YONEKUTA, YASUNORI; MIYOSHI, TARO
To: FUJIFILM CORPORATION
Reel/Frame 057081/0419 →
Priority Claims (1)
JP 2019-063688 · Mar 28, 2019 · national
Continuity (2)
Continuation PCTJP2020008780 · Mar 3, 2020
Related Publication 20210373438A1 · Dec 2, 2021
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