Semiconductor device with adsorption promoting layer
A semiconductor device includes a stacked film of electrode layers and insulating layers. A charge storage layer is in a hole in the stacked film on a first insulating film. A channel layer is on the charge storage layer via a second insulating film. An adsorption promoting layer is on surfaces of a third insulating layer covering the insulating layers and the first insulating film facing the electrode layers. The third insulating film includes a first metal element and a first element, and the adsorption promoting layer includes a second element and a third element. The difference in electronegativity between the second element and the third element is larger than a difference in electronegativity between the first metal element and the first element.
1. A semiconductor device, comprising:
a stacked film including a plurality of electrode layers alternating with a plurality of insulating layers;
a channel layer formed in a hole extending through the stacked film;
a charge storage layer formed between the channel layer and the stacked film;
a first insulating film between the stacked film and charge storage layer;
a second insulating film between the charge storage layer and the channel layer;
a third insulating film between each electrode layer in the plurality of electrode layers and respectively adjacent insulating layers in the plurality of insulating layers, the third insulating film also being between the first insulating film and each electrode layer in the plurality of electrode layers; and
an adsorption promoting layer formed on surfaces of the third insulating film facing each respective electrode layer in the plurality of electrode layers, wherein
the third insulating film comprises a first metal element and a first element,
the adsorption promoting layer comprises a second element and a third element,
each respective electrode layer includes a first electrode layer and a second electrode layer surrounded by the first electrode layer,
the first electrode layer is between the second electrode layer and the third insulating film,
the first electrode layer comprises a second metal element,
the second electrode layer comprises a third metal element,
the first electrode layer is in direct contact with the adsorption promoting layer,
the adsorption promoting layer is in direct contact with the third insulating film, and
a difference in electronegativity between the second element and the third element is larger than a difference in electronegativity between the first metal element and the first element.
2. The semiconductor device according to claim 1 , wherein
the first metal element is aluminum, and
the second metal element is titanium.
3. The semiconductor device according to claim 1 , wherein
the second element is one of titanium, zirconium, hafnium, yttrium, scandium, lanthanum, or tantalum, and
the third element is oxygen.
4. The semiconductor device according to claim 1 , wherein
the second element is one of zirconium, hafnium, yttrium, or lanthanum, and
the third element is chlorine.
5. The semiconductor device according to claim 1 , wherein
the second element is one of silicon, titanium, zirconium, hafnium, yttrium, scandium, lanthanum, tantalum, or vanadium, and
the third element is fluorine.
6. The semiconductor device according to claim 1 , wherein a thickness of the adsorption promoting layer is in a range of 0.1 nm to 0.5 nm.
7. The semiconductor device according to claim 1 , wherein
an electrical resistivity of the first electrode layer is higher than an electrical resistivity of the second electrode layer, and
a thickness of the first electrode layer is 2.0 nm or less.
8. The semiconductor device according to claim 1 , wherein a dielectric constant of the third insulating film is higher than a dielectric constant of the first insulating film.
9. The semiconductor device according to claim 1 , wherein the third element is one of boron, carbon, nitrogen, gallium, germanium, or arsenic.
10. The semiconductor device according to claim 1 , wherein the adsorption promoting layer further comprises a noble gas element.
11. A semiconductor device, comprising:
a stacked film including a plurality of electrode layers alternating with a plurality of insulating layers;
a channel layer formed in a hole extending through the stacked film;
a charge storage layer between the channel layer and the stacked film;
a first insulating film between the stacked film and charge storage layer;
a second insulating film between the charge storage layer and the channel layer;
a third insulating film between each electrode layer in the plurality of electrode layers and respectively adjacent insulating layers in the plurality of insulating layers, the third insulating film also being between the first insulating film and each electrode layer in the plurality of electrode layers; and
an adsorption promoting layer formed on surfaces of the third insulating film facing each respective electrode layer in the plurality of electrode layers, wherein
the third insulating film comprises a first metal element and a first element,
the adsorption promoting layer comprises a second element, a third element, and fourth element,
each respective electrode layer comprises a first electrode layer and a second electrode layer, the second electrode layer including a second metal element,
the first electrode layer is between the second electrode layer and the third insulating film,
the fourth element is a noble gas element,
the first electrode layer is in direct contact with the adsorption promoting layer, and
the adsorption promoting layer is in direct contact with the third insulating film.
12. The semiconductor device according to claim 6 , wherein the second element is a metal element.
13. The semiconductor device according to claim 12 , wherein the third element is oxygen.
14. The semiconductor device according to claim 13 , wherein the fourth element is one of helium, neon, or argon.