Acoustic wave resonator assembly and related modules
Embodiments of this disclosure relate to reducing coupling between acoustic wave resonators. An isolation region of a substrate can be located between acoustic wave resonators. The isolation region can reduce capacitive coupling through the substrate between the acoustic wave resonators. In certain embodiments, the isolation region can be located between acoustic wave resonators of different filters to thereby increase isolation between the filters.
1. An acoustic wave resonator assembly comprising:
a first acoustic wave resonator including a first electrode; and
a second acoustic wave resonator including a second electrode and at least a portion of a piezoelectric layer, the second electrode positioned over the piezoelectric layer, the piezoelectric layer having a crystalline structure that is disrupted in a region that is between the first electrode and the second electrode, the region being a solid region, and the first acoustic wave resonator and the second acoustic wave resonator being on a single die.
2. The acoustic wave resonator assembly of claim 1 further comprising a support substrate, both the first electrode and the second electrode positioned over the support substrate, and the piezoelectric layer positioned over the support substrate.
3. The acoustic wave resonator assembly of claim 2 wherein the support substrate is a silicon substrate.
4. The acoustic wave resonator assembly of claim 1 wherein the piezoelectric layer includes aluminum nitride.
5. The acoustic wave resonator assembly of claim 1 wherein the first electrode is a first interdigital transducer electrode, and the second electrode is a second interdigital transducer electrode.
6. The acoustic wave resonator assembly of claim 1 wherein the first acoustic wave resonator includes another portion of the piezoelectric layer.
7. The acoustic wave resonator assembly of claim 1 wherein the piezoelectric layer is amorphous in the region.
8. The acoustic wave resonator assembly of claim 1 wherein the piezoelectric layer is polycrystalline in the region.
9. The acoustic wave resonator assembly of claim 1 wherein the first acoustic wave resonator and the second acoustic wave resonator are included in a single filter.
10. An acoustic wave resonator assembly comprising:
a support substrate;
a piezoelectric layer over the support substrate;
a first electrode of a first acoustic wave resonator, the first electrode positioned over the support substrate; and
a second electrode of a second acoustic wave resonator, the second electrode positioned over the support substrate, the piezoelectric layer having a crystalline structure that is disrupted in a region that is between the first electrode and the second electrode, the region being a solid region.
11. The acoustic wave resonator assembly of claim 10 wherein the second electrode is in physical contact with the piezoelectric layer.
12. The acoustic wave resonator assembly of claim 10 wherein the support substrate is a silicon substrate.
13. The acoustic wave resonator assembly of claim 10 wherein the piezoelectric layer includes aluminum nitride.
14. The acoustic wave resonator assembly of claim 10 wherein the first electrode is a first interdigital transducer electrode, and the second electrode is a second interdigital transducer electrode.
15. The acoustic wave resonator assembly of claim 10 wherein the piezoelectric layer is amorphous in the region.
16. The acoustic wave resonator assembly of claim 10 wherein the piezoelectric layer is polycrystalline in the region.
17. The acoustic wave resonator assembly of claim 10 wherein the first acoustic wave resonator and the second acoustic wave resonator are included in a single filter.
18. A packaged radio frequency module comprising:
an acoustic wave filter assembly including a support substrate, a piezoelectric layer over the support substrate, a first electrode of a first acoustic wave resonator that is positioned over the support substrate, and a second electrode of a second acoustic wave resonator that is positioned over the support substrate and in physical contact with the piezoelectric layer, the piezoelectric layer having a crystalline structure that is disrupted in a region that is between the first electrode and the second electrode, the region being a solid region, and the first acoustic wave resonator and the second acoustic wave resonator being included in an acoustic wave filter;
a radio frequency switch electrically connected to the acoustic wave filter; and
a package enclosing the acoustic wave filter assembly and the radio frequency switch.
19. The packaged radio frequency module of claim 18 further comprising a radio frequency amplifier, the radio frequency switch configured to electrically couple the radio frequency amplifier to the acoustic wave filter.
20. The packaged radio frequency module of claim 18 further comprising an antenna port, the radio frequency switch configured to electrically couple the acoustic wave filter to the antenna port.