Semiconductor device with source/drain contact
A semiconductor device includes a substrate, an epitaxial structure over the substrate, a conductive structure, and a dielectric liner. The conductive structure extends from within the epitaxial structure to above the epitaxial structure. The dielectric liner extends along a sidewall of the conductive structure. The dielectric liner has a top end capped by the conductive structure.
1. A semiconductor device, comprising:
a substrate;
an epitaxial structure over the substrate;
a conductive structure extending from within the epitaxial structure to above the epitaxial structure; and
a dielectric liner extending along a sidewall of the conductive structure, the dielectric liner having a top end capped by the conductive structure, wherein the conductive structure has a non-linear sidewall profile comprising a lower section with a first slope and an upper section with a second slope different from the first slope, wherein a slope change from the first slope to the second slope is at a topmost position of the top end of the dielectric liner.
2. The semiconductor device of claim 1 , wherein the epitaxial structure has a recessed profile.
3. The semiconductor device of claim 2 , wherein the recessed profile of epitaxial structure is directly below the conductive structure.
4. The semiconductor device of claim 1 , further comprising:
a gate structure over the substrate, the gate structure having a top surface lower than the top end of the dielectric liner.
5. The semiconductor device of claim 4 , further comprising:
an interlayer dielectric (ILD) layer around the gate structure, the ILD layer having a top surface lower than the top end of the dielectric liner.
6. The semiconductor device of claim 5 , wherein the top surface of the ILD layer is level with the top surface of the gate structure.
7. The semiconductor device of claim 1 , wherein the dielectric liner has a bottom end higher than a bottom end of the conductive structure.
8. The semiconductor device of claim 7 , wherein the bottom end of the dielectric liner is in contact with the epitaxial structure.
9. The semiconductor device of claim 1 , wherein the dielectric liner is a nitride-based material.
10. A semiconductor device, comprising:
a gate structure over a substrate;
source/drain regions on opposite sides of the gate structure, respectively;
a first conductive feature extending from a position above a top surface of a first one of the source/drain regions to a position below the top surface of the first one of the source/drain regions, the first conductive feature having a stepped sidewall structure, the stepped sidewall structure comprising an upper sidewall, a lower sidewall laterally offset from the upper sidewall, and an intermediary surface laterally extending from a bottom end of the upper sidewall to a top end of the lower sidewall; and
a first liner on the lower sidewall of the stepped sidewall structure of the first conductive feature and absent from the upper sidewall of the stepped sidewall structure of the first conductive feature, wherein the intermediary surface of the stepped sidewall structure of the first conductive feature is at the same elevation as a topmost position of the first liner.
11. The semiconductor device of claim 10 , wherein the top end of the lower sidewall of the stepped sidewall structure is higher than a top surface of the gate structure.
12. The semiconductor device of claim 10 , wherein the first liner has a top end level with the top end of the lower sidewall of the stepped sidewall structure.
13. The semiconductor device of claim 10 , wherein the first liner has a bottom end higher than a bottom end of the lower sidewall of the stepped sidewall structure.
14. The semiconductor device of claim 10 , wherein the upper sidewall of the stepped sidewall structure has a slope different than a slope of the lower sidewall of the stepped sidewall structure.
15. The semiconductor device of claim 10 , further comprising:
a second conductive feature extending from a position above a top surface of a second one of the source/drain regions to a position below the top surface of the second one of the source/drain regions, the second conductive feature has a stepped sidewall structure; and
a second liner on a lower sidewall of the stepped sidewall structure of the second conductive feature and absent from an upper sidewall of the stepped sidewall structure of the second conductive feature.
16. A semiconductor device, comprising:
a transistor gate disposed on a substrate;
source and drain regions on opposite sides of the transistor gate, respectively;
a first gate spacer on a first side of the transistor gate facing the source region;
a second gate spacer on a second side of the transistor gate facing the drain region;
a conductive structure spaced apart from the transistor gate at least by the first gate spacer, the conductive structure having a discontinuous sidewall profile with an upper section and a lower section misaligned with the upper section; and
a dielectric layer extending along the lower section of the discontinuous sidewall profile of the conductive structure, and terminating prior to covering the upper section of the discontinuous sidewall profile of the conductive structure, wherein a topmost position of the lower section of the discontinuous sidewall profile of the conductive structure is level with a topmost position of the dielectric layer.
17. The semiconductor device of claim 16 , wherein the lower section of the discontinuous sidewall profile has a steeper slope than the upper section of the discontinuous sidewall profile.
18. The semiconductor device of claim 16 , wherein the upper section of the discontinuous sidewall profile has a bottom higher than a top surface of the transistor gate.
19. The semiconductor device of claim 16 , wherein the dielectric layer comprises metal oxide.
20. The semiconductor device of claim 16 , wherein the transistor gate is over a fin extending from the substrate.