High temperature electronic device thermal management system
A high temperature electronic device thermal management system. Data centers contain many large racks of computer servers with electronic devices that generate heat. For the devices to function properly, they must not exceed a maximum temperature. Typical techniques for thermal management of data center electronics involve using sub-ambient temperature coolants via refrigeration cycles, requiring significant input energy to operate. The present thermal management system includes a flow management system to produce elevated coolant temperatures while sustaining safe device temperatures. This allows the coolant to reject to ambient temperatures globally and year-round, enabling reduced energy usage by no longer requiring refrigeration cycles. Further, operation at or above 55° C. would allow for implementation of additional waste heat recovery processes with increased energy efficiency.
1. A cooling system for cooling a heat-generating electronic device, comprising:
a first cooling loop, comprising
a first coolant that is configured to remove heat created by the heat-generating electronic device,
at least one component which acts to elevate a pressure of the first coolant, and
a first heat exchanger interface that is configured to transfer heat out of the first coolant;
a bypass path bypassing the first heat exchanger interface and forming a fluid path between portions of the first cooling loop;
at least one flow controlling element configured to control a flow rate of the first coolant within the portions of the first cooling loop and a flow rate of the first coolant through the bypass path; and
a management system configured to
sense the temperature of the first coolant,
sense the current temperature at a location either inside of or outside of the location of the heat-generating electronic device,
obtain a periodic maximum temperature of an ambient environment in the vicinity of the location of the electronic device, and
control the at least one flow controlling element, based on the sensed coolant temperature and a temperature of the heat-generating electronic device, to adjust the flow rate of the first coolant within the portions of the first cooling loop and the flow rate of the first coolant through the bypass path.
2. The cooling system of claim 1 , wherein the management system is configured to control the at least one flow controlling element, based on the sensed coolant temperature, the temperature of the heat-generating electronic device, and at least one of the current temperature and the periodic maximum temperature, to adjust the flow rate of the first coolant within the portions of the first cooling loop and the flow rate of the first coolant through the bypass path.
3. The cooling system of claim 1 , wherein the management system is configured to maintain the first coolant temperature above the sensed current temperature.
4. The cooling system of claim 1 , wherein the management system is configured to maintain the first coolant temperature above the periodic maximum temperature.
5. The cooling system of claim 1 , wherein the management system is configured to maintain the first coolant temperature above 55° C.
6. The cooling system of claim 1 , wherein the first coolant is a single-phase coolant.
7. The cooling system of claim 1 , wherein the only change of phase of the first coolant occurs at the first heat exchanger interface.
8. The cooling system of claim 1 , wherein the first coolant is a liquid coolant.
9. The cooling system of claim 8 , wherein the first coolant comprises any one of water and a water-glycol mix.
10. The cooling system of claim 1 , further comprising an air cooling system to provide cooling for other heat generating elements.
11. The cooling system of claim 1 , further comprising a second cooling loop comprising a second coolant that is configured to transfer heat from the heat-generating electronic device to the first coolant, at least one component that acts to elevate the pressure of the second coolant, and a second heat exchanger interface that is configured to transfer heat out of the second coolant.
12. The cooling system of claim 11 , wherein the second coolant is a liquid coolant.
13. The cooling system of claim 12 , wherein the second coolant comprises any one of water, a water-glycol mix, and a dielectric fluid.
14. The cooling system of claim 11 , wherein the first heat exchanger interface is configured to interface with the ambient environment and the second heat exchanger interface is configured to transfer heat between the second coolant and the first coolant.
15. The cooling system of claim 14 , wherein heat is transferred from the second coolant to the first coolant using a liquid-liquid heat exchanger.
16. The cooling system of claim 11 , further comprising at least one cooling element that is configured to facilitate direct contact of the second coolant with a heat generating electronic device.
17. The cooling system of claim 1 , wherein the first heat exchanger interface comprises a liquid-air heat exchanger.
18. The cooling system of claim 1 , wherein the at least one flow controlling element is configured to variably direct either none, some, or all of the first coolant to the first heat exchanger interface.
19. The cooling system of claim 1 , further comprising at least one cooling element that is configured to facilitate direct contact of the first coolant with a heat generating electronic device.
20. The cooling system of claim 1 , wherein the first heat exchanger interface comprises a heat exchanger that is configured to interface with a waste heat recovery system.
21. A cooling system for cooling a heat-generating electronic device, comprising:
a first cooling loop, comprising
a first coolant that is configured to remove heat created by the heat-generating electronic device,
at least one component which acts to elevate a pressure of the first coolant, and
a first heat exchanger interface that is configured to transfer heat out of the first coolant;
a bypass path bypassing the first heat exchanger interface and forming a fluid path between portions of the first cooling loop;
at least one flow controlling element configured to control a flow rate of the first coolant within the portions of the first cooling loop and a flow rate of the first coolant through the bypass path; and
a management system configured to
sense the temperature of the first coolant,
sense the current temperature at a location either inside of or outside of the location of the heat-generating electronic device,
obtain a periodic maximum temperature of an ambient environment in the vicinity of the location of the electronic device, and
control the at least one flow controlling element, based on a temperature of the heat-generating electronic device and at least one of the current temperature and the periodic maximum temperature, to adjust the flow rate of the first coolant within the portions of the first cooling loop and the flow rate of the first coolant through the bypass path.