Thermal management of RF devices using embedded microjet arrays
The present invention generally relates to a microjet array for use as a thermal management system for a heat generating device, such as an RF device. The microjet array is formed in a jet plate, which is attached directly to the substrate containing the heat generating device. Additional enhancing features are used to further improve the heat transfer coefficient above that inherently achieved by the array. Some of these enhancements may also have other functions, such as adding mechanical structure, electrical connectivity or pathways for waveguides. This technology enables higher duty cycles, higher power levels, increased component lifetime, and/or improved SWaP for RF devices operating in airborne, naval (surface and undersea), ground, and space environments. This technology serves as a replacement for existing RF device thermal management solutions, such as high-SWaP finned heat sinks and cold plates.
1. An assembly, comprising:
a semiconductor component, disposed on a semiconductor substrate, and having a heat generating device disposed therein, wherein one surface of the semiconductor substrate that is configured to be directly contacted by a fluid is referred to as an impingement surface;
a jet plate, where a reservoir is formed within the assembly as a sealed enclosure bounded by the jet plate and the impingement surface, the jet plate comprises a plurality of microjets arranged as a two-dimensional array and at least one exhaust port, and each of the microjets and the exhaust port are in communication with the reservoir;
a region of the impingement surface where a flow of the fluid from each of the plurality of microjets is perpendicular to the impingement surface is defined as an impingement zone; and
at least one feature, disposed in the reservoir, each feature extending from the jet plate to the impingement surface, configured to serve as a structural member and disposed outside each of the impingement zones, wherein the at least one feature comprises a wall jet feature and/or an effluent flow control feature.
2. The assembly of claim 1 , wherein a smallest perimeter that surrounds the two-dimensional array does not include the at least one exhaust port.
3. The assembly of claim 1 , wherein the fluid is single-phase.
4. The assembly of claim 1 , wherein the at least one feature increases heat transfer between the fluid and the impingement surface.
5. The assembly of claim 4 , wherein the at least one feature increases the heat transfer between the fluid and the impingement surface by way of increased contact area.
6. The assembly of claim 4 , wherein the at least one feature increases the heat transfer between the fluid and the impingement surface by way of enhanced momentum transfer via a secondary impingement zone.
7. The assembly of claim 1 , wherein the at least one feature extends into the reservoir and contacts the impingement surface and the jet plate.
8. The assembly of claim 7 , wherein a channel is disposed within the at least one feature.
9. The assembly of claim 8 , wherein the channel comprises an electrical conduit.
10. The assembly of claim 8 , wherein the channel comprises a pathway allowing light and electromagnetic waves to pass therethrough.
11. The assembly of claim 1 , wherein the at least one feature serves as an alignment feature.