Cooling module with integrated pump for immersion cooling in electronics
Embodiments of the present invention provide a cooling module for cooling heat-generating electronic devices in an immersion cooling system. The cooling module includes an integrated pump, which draws immersion fluid from the surrounding dielectric bath and drives it into a pressurized plenum to pressurize the coolant fluid and drive the pressurized coolant fluid through a nozzle plate containing a microconvective nozzle array. The array accelerates the fluid to produce a multiplicity of microjets that impinge on a surface of the heat-generating electronic device to be cooled. The effluent from the cooling module may be directed to flow into and wash over nearby heat-generating devices to help cool the nearby heat-generating devices. The effluent may also be directed to the inlets of daughter cooling modules attached to other heat-generating electronic devices. In some embodiments, cooling modules of the present invention may include fluid collection and fluid discharge manifolds that may be configured and arranged to target specific regions of an immersion bath that might otherwise become relatively stagnant, thereby enhancing overall system circulation and convective environment for other nearby server components. In some embodiments, cooling modules of the present invention may include daughter cooling modules connected to the pressurized inlet plenum of the parent cooling module pressurized by its coolant pump. The addition of the cooling module to immersion bath cooling systems achieves much higher rates of cooling than can be achieved with immersion baths alone.
1 . A cooling module for cooling a heat-generating electronic device attached to a printed circuit board immersed in a container of immersion fluid, the cooling module comprising: (a) a housing comprising set of inner walls; (b) a nozzle plate, fixedly attached to the housing, the nozzle plate comprising a fluid receiving side, a fluid ejection side, opposite the fluid receiving side, and a multiplicity of nozzles extending through the nozzle plate from the fluid receiving side to the fluid ejection side, each nozzle adapted to produce a microjet of immersion fluid as the immersion fluid exits the fluid ejection side of the nozzle plate; (c) a fastener for attaching the cooling module to the heat-generating electronic device, opposite the printed circuit board, so that the fluid ejection surface of the nozzle plate is oriented to face an impingement zone on the heat-generating electronic device, the fluid ejection surface of the nozzle plate being spaced apart from the impingement zone so as to define an impingement channel and an outlet between the cooling module and the heat-generating electronic device; (d) a plenum defined by the inner walls of the housing and the nozzle plate; (e) an inlet formed in the housing and in fluid communication with the plenum, the inlet configured to permit immersion fluid in the container to pass into the housing; and (f) a pump comprising a motor mechanically connected to a set of rotors disposed inside the housing; (g) whereby (i) operation of the motor rotates the set of rotors on the pump, causing the set of rotors to fill and pressurize the plenum by drawing immersion fluid from the container into the housing through the inlet and pushing the immersion fluid into the plenum, and (ii) pressurizing the plenum causes the multiplicity of nozzles in the nozzle plate to eject a multiplicity of microjets into the impingement channel to strike the impingement zone of the heat-generating electronic device before exiting the cooling module through the outlet; further comprising a fluid collection manifold, fluidly coupled to the inlet of the cooling module; and wherein the fluid collection manifold is configured to draw immersion fluid from a stagnant region of immersion fluid in the container.
2 . The cooling module of claim 1 , wherein the pump is a positive displacement pump.
3 . The cooling module of claim 1 , wherein the pump is a centrifugal pump.
4 . The cooling module of claim 1 , wherein the pump is an axial pump.
5 . The cooling module of claim 1 , wherein the heat-generating electronic device attached to the printed circuit board comprises:
(a) a central processing unit; or
(b) a graphical processing unit; or
(c) a component of a power inversion system; or
(d) a component of a power conversion system; or
(e) a combination of two or more of the above-listed devices.
6 . The cooling module of claim 1 , wherein the nozzle plate comprises one or more microconvective nozzle arrays.
7 . The cooling module of claim 1 , wherein the fluid collection manifold is configured to draw immersion fluid from the outlet of another cooling module constructed according to claim 1 .
8 . The cooling module of claim 1 , wherein the fluid collection manifold is configured to draw immersion fluid from a vicinity of: (a) a central processing unit; or (b) a graphical processing unit; or (c) a component of a power inversion system; or (d) a component of a power conversion system; or (e) a hard disk drive; or (f) a voltage regulator module; or (g) an electronic memory device; or (h) a combination of two or more of the above-listed devices.
9 . The cooling module of claim 1 , wherein the fluid collection manifold is configured to draw immersion fluid from an external heat exchanger.
10 . The cooling module of claim 1 , wherein the cooling module further comprises: (a) a second inlet; and (b) a second fluid collection manifold fluidly coupled to the second inlet.
11 . The cooling module of claim 1 , further comprising a fluid discharge manifold, fluidly coupled to the outlet of the cooling module.
12 . The cooling module of claim 11 , wherein the fluid discharge manifold is configured to discharge immersion fluid into a stagnant region of immersion fluid in the container.
13 . The cooling module of claim 11 , wherein the fluid discharge manifold is configured to discharge immersion fluid so that the immersion fluid will flow into or wash over another heat-generating electronic device attached to the printed circuit board.
14 . The cooling module of claim 11 , wherein the fluid discharge manifold is configured to discharge immersion fluid into the inlet of another cooling module constructed according to claim 1 .
15 . The cooling module of claim 11 , wherein the fluid discharge manifold is configured to discharge immersion fluid into a vicinity of:
(a) a central processing unit; or
(b) a graphical processing unit; or
(c) a component of a power inversion system; or
(d) a component of a power conversion system; or
(e) a hard disk drive; or
(f) a voltage regulator module; or
(g) an electronic memory device; or
(h) a combination of two or more of the above-listed devices.
16 . The cooling module of claim 11 , wherein the fluid discharge manifold is configured to discharge immersion fluid into an external heat exchanger.
17 . The cooling module of claim 11 , further comprising:
(a) a second outlet; and
(b) a second fluid discharge manifold connected to the second outlet.
18 . The cooling module of claim 1 , further comprising:
(a) a second inlet;
(b) a second pump comprising a second motor mechanically connected to a second set of rotors disposed inside the housing; and
(c) operation of the second motor rotates the second set of rotors on the second pump, causing the second set of rotors to fill and pressurize the plenum by drawing immersion fluid from the container into the housing through the second inlet and pushing the immersion fluid into the plenum.
19 . The cooling module of claim 1 , further comprising a fluid reservoir interposed between the set of rotors and the plenum such that the immersion fluid drawn into the housing by the set of rotors passes through the reservoir before passing into and pressurizing the plenum.
20 . The cooling module of claim 1 , further comprising an electrical power cable that electrically couples the motor to an electrical power supply port on the printed circuit board and supplies electrical power for operation of the motor.
21 . The cooling module of claim 1 , wherein the fastener comprises a server attachment flange configured to assist in mounting the cooling module to the heat-generating electronic device.
22 . The cooling module of claim 1 , wherein the fastener comprises a torsion screw configured to assist in mounting the cooling module to the heat-generating electronic device.
23 . The cooling module of claim 1 , further comprising an effluent routing vane to guide immersion fluid flowing out of the outlet.