IP Library Granted Patent US 12,295,190
Granted Patent B2
US 12,295,190 · App. 17/882,925 · Granted May 6, 2025

Light-emitting device and method of manufacturing the light-emitting device

Inventors: Shogo Abe (Tokushima, JP); Keita Shimizu (Komatsushima, JP); Takashi Kadota (Komatsushima, JP)
Assignee: NICHIA CORPORATION
H10H20/854H01L25/165H01L25/167H10H20/8506H10H20/0361H10H20/0362H10H20/8514H10H20/857H10H20/882
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Quick Facts
Patent No.
US 12,295,190
App. No.
17/882,925
Granted
May 6, 2025
Kind
B2
Abstract

A light-emitting device includes: a package defining a recess; a light-emitting element disposed on a bottom surface of the recess; and a sealing member disposed in the recess so as to cover the light-emitting element. The sealing member includes a filler-containing layer which contains a filler and covers the light-emitting element, and a light-transmissive layer disposed on the filler-containing layer. The recess is further defined by a lateral surface having a stepped portion between the bottom surface of the recess and an opening of the recess. The light-transmissive layer covers the stepped portion. An upper surface of the light-transmissive layer is downwardly recessed.

Claims (40)

1. A light-emitting device comprising:

a package defining a recess;

a light-emitting element disposed on a bottom surface of the recess; and

a sealing member disposed in the recess so as to cover the light-emitting element, wherein:

the sealing member comprises a filler-containing layer which contains a light-reflective filler and a light-transmissive resin and covers the light-emitting element, and a light-transmissive layer which contains the light-transmissive resin, is free of the light-reflective filler, and is disposed on the filler-containing layer,

the recess is further defined by a lateral surface having a stepped portion between the bottom surface of the recess and an opening of the recess,

the light-transmissive layer covers the stepped portion,

an upper surface of the light-transmissive layer is downwardly recessed,

an entire upper surface of the filler-containing layer is below the stepped portion, and

the upper surface of the light-reflective filler in the filler-containing layer is directly below the stepped portion.

2. The light-emitting device according to claim 1 , wherein:

the filler-containing layer has a thickness of twice or more of the height of the light-emitting element.

3. The light-emitting device according to claim 1 , wherein:

the light-reflective filler is composed of at least one of titanium oxide, silica, silicon oxide, aluminum oxide, zirconium oxide, magnesium oxide, potassium titanate, zinc oxide, or boron nitride.

4. The light-emitting device according to claim 1 , wherein:

the sealing member is formed by:

supplying an uncured sealing member into the recess, the uncured sealing member comprising the light-reflective filler and the light-transmissive resin, and

applying a centrifugal force to the package in a direction perpendicular to the bottom surface of the recess to sediment the light-reflective filler toward the bottom surface of the recess to form the filler-containing layer and the light-transmissive layer.

5. The light-emitting device according to claim 1 , wherein:

the sealing member further comprises a phosphor layer containing a phosphor, and the filler-containing layer is disposed between the phosphor layer and the light-transmissive layer.

6. The light-emitting device according to claim 5 , wherein:

the phosphor layer covers the bottom surface of the recess and an upper surface of the light-emitting element.

7. The light-emitting device according to claim 5 , wherein:

the phosphor layer has a thickness of equal to or less than half the height of the light-emitting element.

8. The light-emitting device according to claim 5 , wherein:

the filler-containing layer does not contain a phosphor.

9. A light-emitting device comprising:

a package defining a recess;

a light-emitting element disposed on a bottom surface of the recess; and

a sealing member disposed in the recess so as to cover the light-emitting element, wherein:

the sealing member comprises a filler-containing layer which contains a filler and a light-transmissive resin and covers the light-emitting element, a light-transmissive layer which contains the light-transmissive resin and is disposed on the filler-containing layer, and a phosphor layer which contains a phosphor, wherein the filler-containing layer does not contain a phosphor,

the recess is further defined by a lateral surface having a stepped portion between the bottom surface of the recess and an opening of the recess,

the light-transmissive layer covers the stepped portion,

an upper surface of the light-transmissive layer is downwardly recessed,

an entire upper surface of the filler-containing layer is below the stepped portion, and

the upper surface of the filler in the filler-containing layer is directly below the stepped portion.

10. The light-emitting device according to claim 9 , wherein:

the phosphor layer covers the bottom surface of the recess and an upper surface of the light-emitting element.

11. The light-emitting device according to claim 9 , wherein:

the phosphor layer has a thickness of equal to or less than half the height of the light-emitting element.

Priority Claims (1)
JP 2019-149936 · Aug 19, 2019 · national
Continuity (2)
Continuation 16995016 · Aug 17, 2020
Related Publication 20220384695A1 · Dec 1, 2022
References Cited (38)
US 9893250B1 · Ichikawa et al. · 2018 [cited by applicant]
US 20030080341A1 · Sakano et al. · 2003 [cited by applicant]
US 20080037252A1 · Nii · 2008 [cited by examiner]
US 20080303411A1 · Ohta et al. · 2008 [cited by applicant]
US 20090039369A1 · Niino · 2009 [cited by examiner]
US 20120112623A1 · Kobashi · 2012 [cited by examiner]
US 20130188381A1 · Kotani · 2013 [cited by applicant]
US 20140339585A1 · Liao et al. · 2014 [cited by applicant]
US 20160020369A1 · Ukawa · 2016 [cited by applicant]
US 20160111610A1 · Ota · 2016 [cited by examiner]
US 20160233396A1 · Ota et al. · 2016 [cited by applicant]
US 20160254417A1 · Morimura et al. · 2016 [cited by applicant]
US 20160268485A1 · Morimura et al. · 2016 [cited by applicant]
US 20170155022A1 · Tomonari et al. · 2017 [cited by applicant]
US 20180062049A1 · Otsuka et al. · 2018 [cited by applicant]
US 20180097161A1 · Sano · 2018 [cited by examiner]
US 20190058092A1 · Oyamada · 2019 [cited by examiner]
US 20190355883A1 · Yeh · 2019 [cited by examiner]
JP 2002033520A · 2002 [cited by applicant]
JP 2006295018A · 2006 [cited by applicant]
JP 2008041917A · 2008 [cited by applicant]
JP 2009016779A · 2009 [cited by applicant]
JP 2012114416A · 2012 [cited by applicant]
JP 2013149906A · 2013 [cited by applicant]
JP 2013183042A · 2013 [cited by applicant]
JP 2014229901A · 2014 [cited by applicant]
JP 2016029720A · 2016 [cited by applicant]
JP 2016054176A · 2016 [cited by applicant]
JP 2016082212A · 2016 [cited by applicant]
JP 2016162850A · 2016 [cited by applicant]
JP 2016167493A · 2016 [cited by applicant]
JP 2017069457A · 2017 [cited by applicant]
JP 2017108091A · 2017 [cited by applicant]
JP 2018082034A · 2018 [cited by applicant]
WO WO2016142992A1 · 2016 [cited by applicant]
Final Office Action on U.S. Appl. No. 16/995,016 DTD Mar. 18, 2022. [cited by applicant]
Notice of Allowance on U.S. Appl. No. 16/995,016 DTD Jun. 15, 2022. [cited by applicant]
U.S. Office Action on U.S. Appl. No. 16/995,016 DTD Nov. 10, 2021. [cited by applicant]