Granted Patent B2

US 12,298,083 · App. 17/311,722 · Granted May 13, 2025

Inventors: Shuhei Hatano (Shizuoka, JP); Hideki Moriuchi (Shizuoka, JP); Katsuya Okumura (Tokyo, JP)

Assignee: TOMOEGAWA CORPORATION

F28D15/046C09K5/045F28D15/0233F28F21/085F28D2021/0028

Abstract

Claims (22)

1. A temperature control device, comprising:

(i) a temperature control unit, which controls a temperature of an object, comprising:

a temperature control medium; and

a metal body in which a space serving as a channel of said temperature control medium is formed,

wherein said temperature control medium has a latent heat of evaporation of said temperature control medium within a range of from 70 to 200 KJ/kg when said temperature control medium changes a state thereof from a liquid to a gas, and said temperature control medium has a coefficient of volume expansion which is at most 250 times when said temperature control medium changes a state thereof from a liquid to a gas under atmospheric pressure, and

wherein at least one part of said temperature control medium exists in said space in a solid state;

(ii) a storage tank configured to store said temperature control medium;

(iii) a supply path configured to supply said temperature control medium from the storage tank to the channel; and

(iv) a recovery path configured to recover said temperature control medium from the channel to the storage tank.

2. The temperature control device according to claim 1 , wherein said temperature control medium is at least one selected from the group consisting of hydrofluorocarbons and hydrofluoro ethers.

3. The temperature control device according to claim 1 , wherein said temperature control medium is 1,1,2,2,3,3,4-heptafluorocyclopentane.

4. The temperature control device according to claim 1 , wherein said metal body is a porous metal body.

5. The temperature control device according to claim 1 , wherein said metal body is a metal fiber body.

6. The temperature control device according to claim 5 , wherein said metal fiber body is a metal fiber sheet containing copper fibers.

7. The temperature control device according to claim 1 , further comprising a housing body for accommodating said metal body.

8. The temperature control device according to claim 7 , wherein said housing body is composed of at least one selected from the group consisting of a copper plate, an aluminum plate, a copper foil, and an aluminum foil.

9. The temperature control device according to claim 1 , further comprising a support body for supporting said metal body, wherein a hollow portion serving as an external channel for introducing said temperature control medium into said channel is formed in said support body.

10. The temperature control device according to claim 9 , wherein a through-hole through which said temperature control medium is led out from said hollow portion toward said metal body is formed in said support body.

11. The temperature control device according to claim 9 , further comprising a lid body for covering said metal body.

12. The temperature control device according to claim 6 , further comprising a first metal layer provided on an upper side of the metal fiber sheet and a second metal layer provided on a lower side of the metal fiber sheet.

13. The temperature control device according to claim 1 , further comprising a decompression portion that depressurizes said space.

14. The temperature control device according to claim 1 , further comprising a bypass path connecting said supply unit and said recovery unit.

Assignments (2)

Priority Claims (1)

Continuity (1)

References Cited (38)