IP Library › Granted Patent US 12,300,417
Granted Patent B2
US 12,300,417 · App. 17/499,269 · Granted May 13, 2025

Electronic component and information reading method

Inventors: Toru Tonogai (Tokyo, JP); Kyosuke Inui (Tokyo, JP); Yuichi Oyanagi (Tokyo, JP); Izuru Kimura (Tokyo, JP)
Assignee: TDK CORPORATION
H01F27/2804H01F27/255H01F2027/2809
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 12,300,417
App. No.
17/499,269
Granted
May 13, 2025
Kind
B2
Abstract

An element body includes a metal-particle-dispersed body in which metal particles are dispersed, the metal-particle-dispersed body includes a display region on a surface, and the display region includes a display pattern in which a resin exposed portion where a resin appears on a surface and a metal exposed portion where the metal particles appear on the surface are alternately repeated.

Claims (64)

1. An electronic component comprising an element body,

wherein the element body includes a metal-particle-dispersed body in which metal particles are dispersed,

the metal-particle-dispersed body includes a display region on a surface, and

the display region includes a display pattern in which a resin exposed portion where a resin appears on a surface and a metal exposed portion where the metal particles appear on the surface are alternately repeated,

wherein the metal particles are dispersed in the resin of the metal-particle-dispersed body, and

the metal exposed portion is a portion where a concave portion having a predetermined pattern is formed on the surface of the metal-particle-dispersed body and the metal particles are exposed, and the resin exposed portion is a portion where the resin remains on the surface where the concave portion is not formed.

2. The electronic component according to claim 1 ,

wherein a concave portion having a predetermined pattern is formed on the surface of the metal-particle-dispersed body, and a resin is embedded in the concave portion,

the resin exposed portion is a portion where the resin is embedded, and the metal exposed portion is a portion where the concave portion is not formed and the metal particles are exposed, and

a surface of the resin exposed portion is approximately flush with or recessed from a surface of the metal exposed portion.

3. An information reading method from an electronic component, the method comprising:

irradiating the display region of the electronic component according to claim 2 with specific light having a wavelength shorter than a wavelength of red light; and

reading information included in the display region from reflected light.

4. An electronic component comprising an element body,

wherein the element body includes a metal-particle-dispersed body in which metal particles are dispersed,

the metal-particle-dispersed body includes a display region on a surface, and

the display region includes a display pattern in which a resin exposed portion where a resin appears on a surface and a metal exposed portion where the metal particles appear on the surface are alternately repeated,

wherein a resin layer is formed on the surface of the metal-particle-dispersed body, and

the metal exposed portion is a portion where a concave portion having a predetermined pattern is formed on a surface of the resin layer and the resin layer is removed, and the resin exposed portion is a portion where the concave portion is not formed and the resin layer remains.

5. The electronic component according to claim 4 ,

wherein a concave portion having a predetermined pattern is formed on the surface of the metal-particle-dispersed body, and a resin is embedded in the concave portion,

the resin exposed portion is a portion where the resin is embedded, and the metal exposed portion is a portion where the concave portion is not formed and the metal particles are exposed, and

a surface of the resin exposed portion is approximately flush with or recessed from a surface of the metal exposed portion.

6. An information reading method from an electronic component, the method comprising:

irradiating the display region of the electronic component according to claim 4 with specific light having a wavelength shorter than a wavelength of red light; and

reading information included in the display region from reflected light.

7. An electronic component comprising an element body,

wherein the element body includes a metal-particle-dispersed body in which metal particles are dispersed,

the metal-particle-dispersed body includes a display region on a surface, and

the display region includes a display pattern in which a resin exposed portion where a resin appears on a surface and a metal exposed portion where the metal particles appear on the surface are alternately repeated,

wherein the metal exposed portion is recessed up to a predetermined depth in comparison to the resin exposed portion.

8. The electronic component according to claim 7 ,

wherein a concave portion having a predetermined pattern is formed on the surface of the metal-particle-dispersed body, and a resin is embedded in the concave portion,

the resin exposed portion is a portion where the resin is embedded, and the metal exposed portion is a portion where the concave portion is not formed and the metal particles are exposed, and

a surface of the resin exposed portion is approximately flush with or recessed from a surface of the metal exposed portion.

9. An information reading method from an electronic component, the method comprising:

irradiating the display region of the electronic component according to claim 7 with specific light having a wavelength shorter than a wavelength of red light; and

reading information included in the display region from reflected light.

10. An electronic component comprising an element body,

wherein the element body includes a magnetic particle-dispersed body in which magnetic particles are dispersed and a metal-particle-dispersed body in which metal particles are dispersed,

the magnetic particle-dispersed body includes a display region on a surface,

the display region has a display pattern in which a resin exposed portion where a resin appears on a surface and a magnetic substance exposed portion where the magnetic particles appear on the surface are alternately repeated,

the metal particles are dispersed in the resin of the metal-particle-dispersed body, and

the metal-particle-dispersed body includes a metal exposed portion, wherein the metal exposed portion is a portion where a concave portion having a predetermined pattern is formed on the surface of the metal-particle-dispersed body and the metal particles are exposed, and the resin exposed portion is a portion where the resin remains on the surface where the concave portion is not formed.

11. An information reading method from an electronic component, the method comprising:

irradiating the display region of the electronic component according to claim 6 with specific light having a wavelength shorter than a wavelength of red light; and

reading information included in the display region from reflected light.

12. An electronic component comprising an element body,

wherein the element body includes a magnetic particle-dispersed body in which magnetic particles are dispersed and a metal-particle-dispersed body in which metal particles are dispersed,

the magnetic particle-dispersed body includes a display region on a surface, and

the display region has a display pattern in which a resin exposed portion where a resin appears on a surface and a magnetic substance exposed portion where the magnetic particles appear on the surface are alternately repeated,

wherein a resin layer is formed on the surface of the metal-particle-dispersed body, and

the metal-particle-dispersed body includes a metal exposed portion, wherein the metal exposed portion is a portion where a concave portion having a predetermined pattern is formed on a surface of the resin layer and the resin layer is removed, and the resin exposed portion is a portion where the concave portion is not formed and the resin layer remains.

13. An information reading method from an electronic component, the method comprising:

irradiating the display region of the electronic component according to claim 12 with specific light having a wavelength shorter than a wavelength of red light; and

reading information included in the display region from reflected light.

14. An electronic component comprising an element body,

wherein the element body includes a magnetic particle-dispersed body in which magnetic particles are dispersed and a metal-particle-dispersed body in which metal particles are dispersed,

the magnetic particle-dispersed body includes a display region on a surface, and

the display region has a display pattern in which a resin exposed portion where a resin appears on a surface and a magnetic substance exposed portion where the magnetic particles appear on the surface are alternately repeated,

the metal-particle-dispersed body includes a metal exposed portion, wherein the metal exposed portion is recessed up to a predetermined depth in comparison to the resin exposed portion.

15. An information reading method from an electronic component, the method comprising:

irradiating the display region of the electronic component according to claim 14 with specific light having a wavelength shorter than a wavelength of red light; and

reading information included in the display region from reflected light.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2021
From: TONOGAI, TORU; INUI, KYOSUKE; OYANAGI, YUICHI; KIMURA, IZURU
To: TDK CORPORATION
Reel/Frame 057766/0249 →
Priority Claims (1)
JP 2020-172652 · Oct 13, 2020 · national
Continuity (1)
Related Publication 20220115177A1 · Apr 14, 2022
References Cited (16)
US 20140145814A1 · Lee · 2014 [cited by examiner]
US 20160012961A1 · Suzuki · 2016 [cited by examiner]
US 20180061551A1 · Kondou · 2018 [cited by examiner]
US 20180096775A1 · Shibuya · 2018 [cited by examiner]
US 20190115127A1 · Iso · 2019 [cited by examiner]
US 20200152370A1 · Kang · 2020 [cited by examiner]
US 20200350110A1 · Shibuya et al. · 2020 [cited by applicant]
US 20200381159A1 · Sano · 2020 [cited by examiner]
US 20200395167A1 · Haseyama · 2020 [cited by examiner]
US 20200409338A1 · Takahashi · 2020 [cited by examiner]
US 20210057146A1 · Yang · 2021 [cited by examiner]
US 20210134518A1 · Kondo et al. · 2021 [cited by applicant]
US 20210259111A1 · Okumura · 2021 [cited by examiner]
JP 2005045103A · 2005 [cited by applicant]
JP 2018037516A · 2018 [cited by applicant]
JP 2018056475A · 2018 [cited by applicant]