Integrated circuit package and method
In an embodiment, a device includes: a package component including integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure; a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets; a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and bolts extending through the thermal module, the mechanical brace, and the package component.
1. A device comprising:
a package component comprising integrated circuit dies, an encapsulant around the integrated circuit dies, a redistribution structure over the encapsulant and the integrated circuit dies, and sockets over the redistribution structure;
a mechanical brace physically coupled to the sockets, the mechanical brace having openings, each one of the openings exposing a respective one of the sockets;
a thermal module physically and thermally coupled to the encapsulant and the integrated circuit dies; and
bolts extending through the thermal module, the mechanical brace, and the package component.
2. The device of claim 1 , wherein the openings are squares.
3. The device of claim 1 , wherein the openings are circles.
4. The device of claim 1 , wherein the openings are irregular polygons.
5. The device of claim 1 , wherein the openings and the bolts have a layout with a regular pattern.
6. The device of claim 1 , wherein the openings and the bolts have a layout with a symmetrical irregular pattern.
7. The device of claim 1 , wherein the openings and the bolts have a layout with an asymmetrical irregular pattern.
8. The device of claim 1 , wherein the mechanical brace comprises:
a first layer having a first stiffness; and
a second layer between the first layer and the sockets, the second layer having a second stiffness, the second stiffness being less than the first stiffness.
9. A device comprising:
a package component comprising an integrated circuit die, a redistribution structure over the integrated circuit die, and a socket over the redistribution structure;
a mechanical brace attached to a first side of the package component, the mechanical brace having an inner frame portion and an outer frame portion surrounding the inner frame portion, the inner frame portion physically contacting edge regions of the socket, the mechanical brace comprising a rigid layer and a soft layer between the rigid layer and the socket, the rigid layer having a first stiffness, the soft layer having a second stiffness, the second stiffness being less than the first stiffness;
a thermal module attached to a second side of the package component, the thermal module being thermally and physically coupled to the integrated circuit die; and
bolts extending through the thermal module, the mechanical brace, and the package component.
10. The device of claim 9 , wherein the socket has a third stiffness, the second stiffness being less than the third stiffness.
11. The device of claim 9 , wherein the rigid layer comprises a metal.
12. The device of claim 9 , wherein the soft layer comprises a metal foil.
13. The device of claim 9 , wherein the soft layer comprises an elastomer.
14. The device of claim 9 , wherein the rigid layer has a first thickness, the soft layer has a second thickness, and the first thickness is greater than the second thickness.
15. The device of claim 9 , wherein the outer frame portion of the rigid layer and the outer frame portion of the soft layer have the same width.
16. The device of claim 9 , wherein the outer frame portion of the rigid layer has a first width, the outer frame portion of the soft layer has a second width, and the first width is greater than the second width.
17. The device of claim 9 , wherein the outer frame portion of the rigid layer has a square shape.
18. The device of claim 9 , wherein the outer frame portion of the rigid layer has a non-truncated circular shape.
19. The device of claim 9 , wherein the outer frame portion of the rigid layer has a truncated circular shape.
20. A device comprising:
a thermal module;
a mechanical brace comprising a rigid layer and a soft layer; and
a package component clamped between the mechanical brace and the thermal module, the package component comprising:
integrated circuit dies thermally coupled to the thermal module;
a redistribution structure comprising under-bump metallurgies electrically coupled to the integrated circuit dies; and
sockets connected to the under-bump metallurgies of the redistribution structure, the soft layer disposed between the sockets and the rigid layer, the soft layer conformed to shapes of the sockets.