Ceramic electronic component including insulating layer
A ceramic electronic component, includes: a body including a dielectric layer and first and second internal electrodes, the body having first and second surfaces, third and fourth surfaces, and fifth and sixth surfaces; a first external electrode disposed on the first surface of the body, and extending onto a portion of each of the third to sixth surfaces of the body; a second external electrode disposed on the second surface of the body and extending onto a portion of each of the third to sixth surfaces of the body; and an insulating layer disposed on the third to sixth surfaces of the body, and extending onto the first and second external electrodes, wherein in at least one of cross-sections in first and second directions and cross-sections in first and third directions, the insulating layer extends outwardly beyond the first and second surfaces of the body.
1. An electronic component, comprising:
a ceramic electronic component comprising:
a body including a dielectric layer and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first band portion disposed on a first portion of each of the third to sixth surfaces of the body;
a second external electrode including a second band portion disposed on a second portion of each of the third to sixth surfaces of the body, wherein each of the first and second external electrodes comprises a first electrode layer disposed on the body and including a first conductive metal and glass, and a second electrode layer disposed on the first electrode layer and including a second conductive metal and a first resin; and
an insulating layer disposed on the third to sixth surfaces of the body and an entirety of a portion of the body that is not covered by the first and second external electrodes, and extending onto the first and second external electrodes, the insulating layer covers an entirety of the first and second band portions, and the insulating layer comprising a second resin comprising at least one selected from a silicone resin, a fluorine resin, a urea resin, a melamine resin, and an unsaturated polyester resin,
a printed circuit board comprising an electrode pad; and
a conductive adhesive,
wherein the ceramic electronic component is mounted on the electrode pad through the conductive adhesive, and the conductive adhesive is disposed on either the third surface or the fourth surface,
wherein the plurality of first and second internal electrodes are alternately disposed in the second direction, and
wherein, in at least one of cross-sections in the first and second directions and cross-sections in the first and third directions, the insulating layer extends outwardly beyond the first and second surfaces of the body.
2. The electronic component of claim 1 , wherein the insulating layer further covers at least a portion disposed on a corner connecting each of the third to sixth surfaces of the body to each of the first and second surfaces of the body.
3. The electronic component of claim 1 , wherein the insulating layer further comprises a ceramic.
4. The electronic component of claim 3 , wherein the ceramic comprises at least one of lead zirconate titanate, alumina, silica, silicon carbide, and magnesium oxide.
5. The electronic component of claim 1 , wherein the second resin of the insulating layer comprises the silicone resin.
6. The electronic component of claim 1 , wherein the first conductive metal of the first electrode layer comprises copper (Cu) or nickel (Ni),
the second conductive metal of the second electrode layer comprises copper (Cu) or nickel (Ni), and
the first resin of the second electrode layer comprises an epoxy resin.
7. The electronic component of claim 1 , wherein the first and second external electrodes further comprise a third electrode layer disposed on the second electrode layer and including a third conductive metal, respectively.
8. The electronic component of claim 7 , wherein the third electrode layer has a multilayer structure including a first layer including nickel (Ni) as the third conductive metal and a second layer including tin (Sn) as a fourth conductive metal.
9. An electronic component, comprising:
a ceramic electronic component comprising:
a body including a dielectric layer and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode including a first connection portion disposed on the first surface of the body, a first band portion extending from the first connection portion onto a first portion of each of the third to sixth surfaces of the body, and a first corner portion connecting the first connection portion and the first band portion;
a second external electrode including a second connection portion disposed on the second surface of the body, a second band portion extending from the second connection portion onto a second portion of each of the third to sixth surfaces of the body, and a second corner portion connecting the second connection portion and the second band portion, wherein each of the first and second external electrodes comprises a first electrode layer disposed on the body and including a first conductive metal and glass, and a second electrode layer disposed on the first electrode layer and including a second conductive metal and a first resin; and
an insulating layer covering the third to sixth surfaces of the body and a portion of each of the first and second external electrodes, the insulating layer comprising a second resin comprising at least one selected from a silicone resin, a fluorine resin, a urea resin, a melamine resin, and an unsaturated polyester resin;
a printed circuit board comprising an electrode pad; and
a conductive adhesive,
wherein the ceramic electronic component is mounted on the electrode pad through the conductive adhesive, and the conductive adhesive is disposed on the first band portion and the second band portion,
wherein, in at least one of cross-sections in the first and second directions and cross-sections in the first and third directions, an end portion of the insulating layer is disposed on the first and second corner portions, and
wherein the insulating layer covers an entirety of the first and second band portions.
10. The electronic component of claim 9 , wherein the first corner portion is disposed at a corner at which the first surface of the body is connected to the third to sixth surfaces of the body, respectively,
wherein the second corner portion is disposed at a corner at which the second surface of the body is connected to the third to sixth surfaces of the body, respectively.
11. The electronic component of claim 9 , wherein the first and second corner portions have a rounded shape.
12. An electronic component, comprising:
a ceramic electronic component comprising:
a body including a dielectric layer and a plurality of first and second internal electrodes alternately disposed with the dielectric layer interposed therebetween, the body having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction;
a first external electrode covering a first portion of the body, the first external electrode having a first band portion, a first corner portion, and a first outermost layer that has a first corner, wherein the first corner is disposed in the first corner portion, and the first band portion extends from the first corner portion onto a first portion of each of the third to sixth surfaces of the body;
a second external electrode covering a second portion of the body, the second external electrode having a second band portion, a second corner portion, and a second outermost layer that has a second corner, wherein the second corner is disposed in the second corner portion, wherein the second band portion extends from the second corner portion onto a second portion of each of the third to sixth surfaces of the body, wherein each of the first and second external electrodes comprises a first electrode layer disposed on the body and including a first conductive metal and glass, and a second electrode layer disposed on the first electrode layer and including a second conductive metal and a first resin; and
an insulating layer disposed on an entirety of a portion of the body not covered by the first and second external electrodes, the insulating layer covers an entirety of the first and second band portions, the insulating layer is disposed on and extends beyond the first and second corners, and the insulating layer has an end portion disposed on the first and second corner portions;
a printed circuit board comprising an electrode pad; and
a conductive adhesive,
wherein the ceramic electronic component is mounted on the electrode pad through the conductive adhesive, and the conductive adhesive is disposed on either the third surface or the fourth surface, and
wherein the plurality of first and second internal electrodes are alternately disposed in the second direction.
13. The electronic component of claim 12 , wherein the first and second corners have a rounded shape.
14. The electronic component of claim 12 , wherein each of the first and second outermost layers includes a third conductive metal.
15. The electronic component of claim 14 , wherein the first and second conductive metals of the first and second outermost layers, respectively, includes one of nickel (Ni) and tin (Sn).
16. The electronic component of claim 12 , wherein
the first corner is disposed at a corner at which the first surface of the body is connected to each of the third to sixth surfaces of the body, and
the second corner is disposed at a corner at which the second surface of the body is connected to each of the third to sixth surfaces of the body.
17. The electronic component of claim 12 , wherein the insulating layer is disposed on and covers (i) edges connecting adjacent first corners, and (ii) edges connecting adjacent second corners.
18. The electronic component of claim 12 , wherein the insulating layer comprises a second resin comprising at least one selected from a silicone resin, a fluorine resin, a urea resin, a melamine resin, and an unsaturated polyester resin.