Semiconductor package
A semiconductor package including a first semiconductor chip including a logic structure and a second semiconductor chip bonded to the first semiconductor chip may be provided. The first semiconductor chip may include signal lines on a first surface of a first semiconductor substrate and connected to the logic structure, a power delivery network on a second surface of the first semiconductor substrate, the second surface being opposite to the first surface, and penetration vias penetrating the first semiconductor substrate and connecting the power delivery network to the logic structure. The second semiconductor chip may include a capacitor layer that is on a second semiconductor substrate and is adjacent to the power delivery network.
1. A semiconductor package, comprising:
a logic structure on a first surface of a first semiconductor substrate, the logic structure including
active patterns on the first surface of the first semiconductor substrate,
buried power rails in the first semiconductor substrate, and
active contacts connecting the buried power rails to the active patterns;
a capacitor layer including power decoupling capacitors on a second semiconductor substrate; and
a power delivery network connected to the logic structure and the capacitor layer, the power delivery network being on a second surface of the first semiconductor substrate, the second surface being opposite to the first surface,
wherein the first semiconductor substrate includes penetration vias penetrating therethrough, and the penetration vias connects the buried power rails in the logic structure to the power delivery network.
2. The semiconductor package of claim 1 , wherein
the power delivery network comprises power lines on the second surface of the first semiconductor substrate, the first surface facing the power delivery network, and
the capacitor layer is between the power delivery network and the second semiconductor substrate.
3. The semiconductor package of claim 1 , wherein
the power delivery network comprises,
power lines on the second surface of the first semiconductor substrate, the first surface facing the power delivery network, and
first bonding pads connected to the power lines,
the capacitor layer comprises second bonding pads connected to the power decoupling capacitors, and
the first bonding pads are bonded to the second bonding pads.
4. The semiconductor package of claim 1 , further comprising:
first bonding pads on the second surface of the first semiconductor substrate and connected to the logic structure through the penetration vias, the first semiconductor substrate facing the power delivery network,
wherein the power delivery network comprises,
power lines on the capacitor layer, and
second bonding pads bonded to the first bonding pads, the second bonding pads connected to the power lines through the first bonding pads.
5. The semiconductor package of claim 1 , wherein
the logic structure comprises,
logic devices on the first semiconductor substrate,
signal lines connected to the logic devices, and
first bonding pads connected to the signal lines,
the capacitor layer comprises second bonding pads connected to the power decoupling capacitors, and
the first bonding pads are bonded to the second bonding pads.
6. The semiconductor package of claim 1 , wherein the penetration vias have a diameter ranging from 50 nm to 150 nm and a vertical length ranging from 300 nm to 1 μm.
7. The semiconductor package of claim 1 , wherein each of the power decoupling capacitors comprises:
a bottom electrode pad on the second semiconductor substrate;
a plurality of bottom electrodes on the bottom electrode pad;
a capacitor dielectric layer covering the bottom electrodes with a uniform thickness; and
a top electrode on the capacitor dielectric layer, the top electrode covering an entirety of the bottom electrodes.
8. A semiconductor package, comprising:
a first chip including
a first semiconductor substrate including a first surface and a second surface opposite to the first surface,
a logic structure on the first surface, the logic structure including
active patterns on the first surface of the first semiconductor substrate,
buried power rails in the first semiconductor substrate, and
active contacts connecting the buried power rails to the active patterns,
a power delivery network on the second surface and connected to the logic structure,
penetration vias penetrating the first semiconductor substrate and connecting the buried power rails in the logic structure to the power delivery network, and
first bonding pads connected to the power delivery network; and
a second chip including a plurality of power decoupling capacitors and second bonding pads connected to the plurality of power decoupling capacitors,
wherein the first and second bonding pads are bonded to each other, and
the power decoupling capacitors face the power delivery network.
9. The semiconductor package of claim 8 , wherein the logic structure further comprises:
signal lines on the active contacts and connected to the active contacts,
wherein the buried power rails are connected to the active patterns.
10. The semiconductor package of claim 9 , wherein the power delivery network comprises power lines connected to the penetration vias.
11. The semiconductor package of claim 9 , wherein the power delivery network is on the second surface of the first semiconductor substrate, and the power delivery network comprises power lines connected to the penetration vias.
12. The semiconductor package of claim 8 , wherein the plurality of power decoupling capacitors comprises:
a plurality of bottom electrodes on a second semiconductor substrate;
a capacitor dielectric layer covering surfaces of the plurality of bottom electrodes; and
a top electrode on the capacitor dielectric layer.
13. The semiconductor package of claim 12 , wherein each of the bottom electrodes includes a bottom portion and a sidewall portion, which is vertically extended from the bottom portion to define an empty space.
14. The semiconductor package of claim 12 , wherein each of the bottom electrodes has a pillar shape perpendicular to a top surface of the second semiconductor substrate.
15. The semiconductor package of claim 8 , wherein the plurality of power decoupling capacitors comprises:
a bottom electrode on a second semiconductor substrate;
a top electrode; and
a capacitor dielectric layer between the bottom electrode and the top electrode,
wherein the bottom electrode, the capacitor dielectric layer, and the top electrode are parallel to a top surface of the second semiconductor substrate.
16. A semiconductor package, comprising:
a first chip comprising
active patterns on a first surface of a first semiconductor substrate,
buried power rails in the first semiconductor substrate,
active contacts connecting the buried power rails to the active patterns,
a power delivery network on a second surface of the first semiconductor substrate, the second surface being opposite to the first surface, and
penetration vias penetrating the first semiconductor substrate and connecting the buried power rails to the power delivery network; and
a second chip bonded to the first chip, the second chip comprising a capacitor layer that is on a second semiconductor substrate and is adjacent to the power delivery network.
17. The semiconductor package of claim 16 , wherein the capacitor layer comprises:
a bottom electrode pad on the second semiconductor substrate;
a plurality of bottom electrodes on the bottom electrode pad;
a capacitor dielectric layer covering the bottom electrodes with a uniform thickness; and
a top electrode on the capacitor dielectric layer, the top electrode covering an entirety of the bottom electrodes.
18. The semiconductor package of claim 16 , wherein
the first chip further comprises a device isolation layer between the active patterns,
a top surface of the device isolation layer is lower than top surfaces of the active patterns, and
the buried power rails are in the device isolation layer.
19. The semiconductor package of claim 16 , wherein
the first chip further comprises a plurality of first bonding pads connected to the power delivery network, and
the second chip further comprises a plurality of second bonding pads bonded to the plurality of first bonding pads.