Package body, preparation method thereof, terminal, and electronic device
A package body includes: a substrate; a plurality of electronic components, arranged on the substrate; a package material layer, located on the substrate and packaging the plurality of electronic components; a low frequency shielding conductive structure, embedded in the package material layer, where the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components, the low frequency shielding conductive structure is provided with a plurality of through holes, an area of an opening of each of at least some of the through holes is less than 1 mm*1 mm, and a thickness of the low frequency shielding conductive structure is not less than 10 μm.
1. A package body, comprising:
a substrate;
a plurality of electronic components, arranged on the substrate, wherein the plurality of electronic components comprises electronic components configured to emit low frequency electromagnetic waves, and a frequency of the low frequency electromagnetic waves is less than 10 MHz;
a package material layer, located on the substrate and packaging the plurality of electronic components; and
a low frequency shielding conductive structure, embedded in the package material layer,
wherein the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components,
wherein the low frequency shielding conductive structure covers at least the electronic components that are configured to emit the low frequency electromagnetic waves, and a region of the low frequency shielding conductive structure covering the electronic components that are configured to emit the low frequency electromagnetic waves is meshed,
wherein the low frequency shielding conductive structure is provided with a plurality of through holes,
wherein an area of an opening of each of at least some of the through holes is less than 1 mm*1 mm, and
wherein a thickness of the low frequency shielding conductive structure is not less than 10 μm.
2. The package body of claim 1 , wherein the low frequency shielding conductive structure is made of a conductive material with a conductivity not lower than 5×10 6 S/m or a magnetic permeability greater than or equal to 4π×10 −7 H/m.
3. The package body of claim 1 , wherein the area of the opening of each through hole in the region covering the electronic components that are configured to emit the low frequency electromagnetic waves in the low frequency shielding conductive structure is less than 1 mm*1 mm.
4. The package body of claim 1 , wherein the plurality of through holes of the low frequency shielding conductive structure are arranged in an array.
5. The package body of claim 1 , further comprising a conformal shielding layer arranged on an outer surface of the package material layer, wherein the conformal shielding layer is a nanoscale conductive metal layer, and wherein the low frequency shielding conductive structure is connected to the conformal shielding layer.
6. The package body of claim 5 , further comprising a complete conductive thin layer arranged between the low frequency shielding conductive structure and the conformal shielding layer.
7. The package body of claim 1 , further comprising a grounded conductive partition wall embedded in the package material layer, wherein the grounded conductive partition wall divides the package body into at least two compartments and is configured to weaken coupling of electromagnetic waves between different compartments.
8. The package body of claim 1 , further comprising a complete conductive thin layer that covers a surface of the low frequency shielding conductive structure away from the substrate.
9. A terminal, comprising:
a housing; and
a package body accommodated in the housing, wherein the package body comprises:
a substrate;
a plurality of electronic components, arranged on the substrate, wherein the plurality of electronic components comprises electronic components configured to emit low frequency electromagnetic waves, and a frequency of the low frequency electromagnetic waves is less than 10 MHz;
a package material layer, located on the substrate and packaging the plurality of electronic components; and
a low frequency shielding conductive structure, embedded in the package material layer,
wherein the low frequency shielding conductive structure is located on a side of the package material layer away from the substrate and is spaced apart from the plurality of electronic components,
wherein the low frequency shielding conductive structure covers at least the electronic components that are configured to emit the low frequency electromagnetic waves, and a region of the low frequency shielding conductive structure covering the electronic components that are configured to emit the low frequency electromagnetic waves is meshed,
wherein the low frequency shielding conductive structure is provided with a plurality of through holes,
wherein an area of an opening of each of at least some of the through holes is less than 1 mm*1 mm, and
wherein a thickness of the low frequency shielding conductive structure is not less than 10 μm.
10. The terminal of claim 9 , wherein the low frequency shielding conductive structure is made of a conductive material with a conductivity not lower than 5×10 6 S/m or a magnetic permeability greater than or equal to 4π×10 −7 /H/m.
11. The terminal of claim 9 , wherein the area of the opening of each through hole in the region covering the electronic components that are configured to emit the low frequency electromagnetic waves in the low frequency shielding conductive structure is less than 1 mm*1 mm.
12. The terminal of claim 9 , wherein the plurality of through holes of the low frequency shielding conductive structure are arranged in an array.
13. The terminal of claim 9 , wherein the package body further comprises a conformal shielding layer arranged on an outer surface of the package material layer, wherein the conformal shielding layer is a nanoscale conductive metal layer, and wherein the low frequency shielding conductive structure is connected to the conformal shielding layer.
14. The terminal of claim 13 , wherein the package body further comprises a complete conductive thin layer arranged between the low frequency shielding conductive structure and the conformal shielding layer.
15. The terminal of claim 9 , wherein the package body further comprises a grounded conductive partition wall embedded in the package material layer, wherein the grounded conductive partition wall divides the package body into at least two compartments and is configured to weaken coupling of electromagnetic waves between different compartments.