Semiconductor device and manufacturing method thereof
A semiconductor device, including a substrate, a semiconductor structure, a first gate dielectric layer, a first gate, a source, and a drain, is provided. The semiconductor structure includes a first metal oxide layer and a second metal oxide layer. The second metal oxide layer covers a top surface and a sidewall of the first metal oxide layer. The second metal oxide layer has a stepped structure at the sidewall of the first metal oxide layer. A carrier mobility of the first metal oxide layer is greater than a carrier mobility of a channel region of the second metal oxide layer. A thickness of the second metal oxide layer is greater than or equal to a thickness of the first metal oxide layer. A difference between a width of the first gate and a width of the first metal oxide layer is less than 0.5 μm.
1. A semiconductor device, comprising:
a substrate;
a second gate, located on the substrate;
a second gate dielectric layer, located on the second gate;
a semiconductor structure, located on the substrate and comprising:
a first metal oxide layer, located on the second gate dielectric layer; and
a second metal oxide layer, wherein the second metal oxide layer covers a top surface and a sidewall of the first metal oxide layer, the second metal oxide layer has a stepped structure at the sidewall of the first metal oxide layer, a carrier mobility of the first metal oxide layer is greater than a carrier mobility of a channel region of the second metal oxide layer, and a thickness of the second metal oxide layer is greater than or equal to a thickness of the first metal oxide layer;
a first gate dielectric layer, located on the semiconductor structure;
a first gate, located on the first gate dielectric layer and overlapping with the first metal oxide layer, wherein a difference between a width of the first gate and a width of the first metal oxide layer is less than 0.5 μm;
a transfer electrode, located on the second gate;
an interlayer dielectric layer, located on the transfer electrode and the first gate; and
a source and a drain, electrically connected to the second metal oxide layer, wherein the source and the drain are located on the interlayer dielectric layer, wherein the source is electrically connected to the second gate through the transfer electrode.
2. The semiconductor device according to claim 1 , wherein an oxygen concentration of the channel region of the second metal oxide layer is greater than an oxygen concentration of the first metal oxide layer.
3. The semiconductor device according to claim 1 , wherein an indium concentration of the channel region of the second metal oxide layer is less than an indium concentration of the first metal oxide layer.
4. The semiconductor device according to claim 1 , wherein a thickness of the second metal oxide layer is 15 nm to 25 nm, and a thickness of the first metal oxide layer is 5 nm to 15 nm.
5. The semiconductor device according to claim 1 , wherein a sidewall of the first gate and the sidewall of the first metal oxide layer overlap in a normal direction of a top surface of the substrate.
6. The semiconductor device according to claim 1 , wherein a material of the second metal oxide layer is InGaZnO, and a material of the first metal oxide layer is InGaZnO or InWZnO.
7. The semiconductor device according to claim 1 , wherein a horizontal distance between a sidewall of the first gate and a rise of the stepped structure of the second metal oxide layer is less than 0.5 μm.
8. The semiconductor device according to claim 1 , wherein the second metal oxide layer comprises a source region, a drain region, and the channel region located between the source region and the drain region, wherein resistivities of the source region and the drain region are less than a resistivity of the channel region, and the channel region overlaps with the first metal oxide layer.
9. The semiconductor device according to claim 8 , wherein the stepped structure is located in the source region and/or the drain region.
10. A manufacturing method of a semiconductor device, comprising:
forming a second gate on a substrate;
forming a second gate dielectric layer on the second gate;
forming a first metal oxide layer on the second gate dielectric layer;
forming a second metal oxide layer on the first metal oxide layer, wherein the second metal oxide layer covers a top surface and a sidewall of the first metal oxide layer, and the second metal oxide layer has a stepped structure at the sidewall of the first metal oxide layer, wherein a thickness of the second metal oxide layer is greater than or equal to a thickness of the first metal oxide layer;
forming a first gate dielectric layer on the second metal oxide layer;
forming a first gate on the first gate dielectric layer, wherein the first gate overlaps with the first metal oxide layer, wherein a difference between a width of the first gate and a width of the first metal oxide layer is less than 0.5 μm;
forming a transfer electrode on the second gate;
forming a source region, a drain region, and a channel region located between the source region and the drain region in the second metal oxide layer, wherein a carrier mobility of the first metal oxide layer is greater than a carrier mobility of the channel region of the second metal oxide layer;
forming an interlayer dielectric layer on the transfer electrode and the first gate; and
forming a source and a drain on the interlayer dielectric layer, wherein the source and the drain are electrically connected to the second metal oxide layer, wherein the source is electrically connected to the second gate through the transfer electrode.
11. The manufacturing method of the semiconductor device according to claim 10 , wherein a width of the second gate is greater than a width of the first metal oxide layer.
12. The manufacturing method of the semiconductor device according to claim 10 , wherein using the first gate as a mask, a doping process is performed on the second metal oxide layer to form the source region, the drain region, and the channel region in the second metal oxide layer.
13. The manufacturing method of the semiconductor device according to claim 10 , wherein a material of the second metal oxide layer comprises InGaZnO, and a material of the first metal oxide layer comprises InGaZnO or InWZnO.
14. The manufacturing method of the semiconductor device according to claim 10 , wherein a horizontal distance between a sidewall of the first gate and a rise of the stepped structure of the second metal oxide layer is less than 0.5 μm.
15. The manufacturing method of the semiconductor device according to claim 10 , wherein a thickness of the second metal oxide layer is 15 nm to 25 nm, and a thickness of the first metal oxide layer is 5 nm to 15 nm.
16. The manufacturing method of the semiconductor device according to claim 10 , wherein a sidewall of the first gate is aligned with the sidewall of the first metal oxide layer.