IP Library Granted Patent US 12,334,270
Granted Patent B2
US 12,334,270 · App. 17/969,176 · Granted Jun 17, 2025

Multilayer electronic component containing coating layers having an island region

Inventors: Sung Min Cho (Suwon-si, KR); Jang Yeol Lee (Suwon-si, KR); Ho Phil Jung (Suwon-si, KR)
Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
H01G4/30H01G4/12H01G4/224H01G4/232
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Quick Facts
Patent No.
US 12,334,270
App. No.
17/969,176
Granted
Jun 17, 2025
Kind
B2
Abstract

A multilayer electronic component includes a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes; external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and coating layers respectively covering the plating layer and including an island region exposing a portion of a surface of the plating layer.

Claims (24)

1. A multilayer electronic component comprising:

a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes;

external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and

coating layers respectively covering each of the plating layers and including an island region exposing a portion of a surface of the plating layer,

wherein 0.5 μm to 5 μm is a range of an average diameter of the island region.

2. The multilayer electronic component of claim 1 , wherein 0.1 to 10% is a range of a ratio of an area of the coating layer, which is a ratio of a region where the coating layer is disposed on the surface of the plating layer.

3. The multilayer electronic component of claim 1 , wherein 90 to 99.9% is a range of a ratio of an area of the exposed surface of the plating layer.

4. The multilayer electronic component of claim 1 , wherein the coating layer includes at least one material selected from the group consisting of aluminum oxide, hafnium oxide, silicon oxide, titanium oxide, zirconium oxide and tin oxide.

5. The multilayer electronic component of claim 1 , wherein the coating layer has a multi-layer structure.

6. The multilayer electronic component of claim 1 , wherein the coating layer includes a layer in which only a portion of the layer covering the plating layer is removed.

7. The multilayer electronic component of claim 1 , wherein 30 nm to 0.2 μm is a range of a thickness of the coating layer.

8. The multilayer electronic component of claim 1 , wherein the island region includes a plurality of island regions, and 5 to 10 μm is a range of a shortest distance between the plurality of island regions.

9. The multilayer electronic component of claim 1 , wherein the plating layer is a tin (Sn) plating layer.

10. The multilayer electronic component of claim 1 , wherein the electrode layer includes a conductive metal and glass.

11. The multilayer electronic component of claim 1 , further comprising an additional coating layer disposed on a region of the body, in which the external electrode is not disposed.

12. The multilayer electronic component of claim 11 , wherein the additional coating layer covers an entire surface of the region of the body, in which the external electrode is not disposed.

13. A multilayer electronic component comprising:

a body including a plurality of internal electrodes and a dielectric layer interposed between the plurality of internal electrodes;

external electrodes disposed on the body, connected to the plurality of internal electrodes, and including electrode layers and plating layers respectively covering the electrode layers; and

coating layers respectively covering each of the plating layers and including an island region exposing a portion of a surface of the plating layer,

wherein the island region includes a plurality of island regions, and 5 to 10 μm is a range of a shortest distance between the plurality of island regions.

14. The multilayer electronic component of claim 13 , wherein the coating layers include an inorganic material.

15. The multilayer electronic component of claim 13 , wherein the coating layers include at least one material selected from the group consisting of aluminum oxide, hafnium oxide, silicon oxide, titanium oxide, zirconium oxide, and tin oxide.

16. The multilayer electronic component of claim 15 , wherein the at least one material includes aluminum oxide.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 19, 2022
From: CHO, SUNG MIN; LEE, JANG YEOL; JUNG, HO PHIL
To: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Reel/Frame 061471/0926 →
Priority Claims (1)
KR 10-2021-0191395 · Dec 29, 2021 · national
Continuity (1)
Related Publication 20230207213A1 · Jun 29, 2023
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