IP Library › Granted Patent US 12,336,247
Granted Patent B2
US 12,336,247 · App. 18/417,984 · Granted Jun 17, 2025

Single crystal semiconductor structure and method of fabricating the same

Inventors: Junhee Choi (Suwon-si, KR); Joohun Han (Hwaseong-si, KR); Vladimir Matias (Santa Fe, NM)
Assignees: SAMSUNG ELECTRONICS CO., LTD.; iBeam Materials, Inc.
H10D62/83H01L21/02428H01L21/02488H01L21/0254H01L21/02546H01L21/0259H01L21/02617H10D62/40H10D62/402
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Quick Facts
Patent No.
US 12,336,247
App. No.
18/417,984
Granted
Jun 17, 2025
Kind
B2
Abstract

A single crystal semiconductor structure includes: an amorphous substrate; a single crystal semiconductor layer provided on the amorphous substrate; and a thin orienting film provided between the amorphous substrate and the single crystal semiconductor layer, wherein the thin orienting film is a single crystal thin film, and the thin orienting film has a non-zero thickness that is equal to or less than 10 times a critical thickness h c .

Claims (15)

1. A single crystal semiconductor structure comprising:

an amorphous substrate;

a single crystal film formed directly on the amorphous substrate;

a single crystal semiconductor layer formed directly on the single crystal film, the single crystal semiconductor layer comprising a lower single crystal layer and an upper single crystal layer, and

a mask pattern between the lower single crystal layer and the upper single crystal layer,

wherein a lattice constant of the single crystal film is different from a lattice constant of the single crystal semiconductor layer.

2. The single crystal semiconductor structure of claim 1 , wherein a thickness of the single crystal film is 50 nm or less.

3. The single crystal semiconductor structure of claim 1 , wherein the single crystal film has a (001) direction or a (111) direction.

4. The single crystal semiconductor structure of claim 1 , wherein the single crystal semiconductor layer comprises a Group III-V compound semiconductor layer.

5. The single crystal semiconductor structure of claim 4 , wherein the single crystal semiconductor layer comprises GaN layer having a (001) direction.

6. The single crystal semiconductor structure of claim 1 ,

wherein the lower single crystal layer comprises a nucleation layer for the upper single crystal layer.

7. The single crystal semiconductor structure of claim 6 , wherein a crystallinity of the upper single crystal layer is higher than a crystallinity of the lower single crystal layer.

8. The single crystal semiconductor structure of claim 6 , wherein the single crystal film has a lattice structure that matches a lattice structure of the lower single crystal layer.

9. The single crystal semiconductor structure of claim 1 , wherein the single crystal film comprises a CeO 2 film having the (111) direction or a Sc 2 O 3 film having the (111) direction.

Priority Claims (1)
KR 10-2020-0026814 · Mar 3, 2020 · national
Continuity (4)
Division 17969420 · Oct 19, 2022
Division 17100340 · Nov 20, 2020
Provisional Application 62939086 · Nov 22, 2019
Related Publication 20240154000A1 · May 9, 2024
References Cited (17)
US 6319782B1 · Nakabayashi · 2001 [cited by applicant]
US 6455166B1 · Truchan et al. · 2002 [cited by applicant]
US 6638838B1 · Eisenbeiser et al. · 2003 [cited by applicant]
US 10087547B2 · Chen et al. · 2018 [cited by applicant]
US 10546976B2 · Matias et al. · 2020 [cited by applicant]
US 20030057491A1 · Mitani et al. · 2003 [cited by applicant]
US 20040004234A1 · Yagishita · 2004 [cited by examiner]
US 20090269875A1 · Kato et al. · 2009 [cited by applicant]
US 20160233383A1 · Matias et al. · 2016 [cited by applicant]
US 20180351040A1 · Matias · 2018 [cited by applicant]
JP 3779831B2 · 2006 [cited by applicant]
JP 2013040058A · 2013 [cited by applicant]
KR 1020130026671A · 2013 [cited by applicant]
WO 2016130725A1 · 2016 [cited by applicant]
Choi, J. H., et al., “Nearly single-crystalline GaN light-emitting diodes on amorphous glass substrates”. Nature Photonics, vol. 5, Dec. 2011, pp. 763-769. [cited by applicant]
Dai, Y., et al., “Engineering of the Curie temperature of epitaxial Sr1-xBaxTiO3 films via strain”, Journal of Applied Physics, vol. 120, 2016, pp. 114101-1 to 114101-6 (7 pages). [cited by applicant]
Smirnov, Sergey. “Physical Modeling of Electron Transport in Strained Silicon and Silicon-Germanium”, 2013. Vienna University of Technology, pp. 42-45. PhD dissertation (139 pages total). [cited by applicant]