Selective etch using deposition of a metalloid or metal containing hardmask
A method for selectively etching at least one feature in a silicon oxide region with respect to a lower oxygen containing region is provided. An etch gas comprising a metalloid or metal containing precursor and a halogen containing component is provided. The etch gas is formed into a plasma. At least one feature in the silicon oxide region is selectively etched with respect to the lower oxygen containing region, while simultaneously forming a metalloid or metal containing hardmask over the lower oxygen containing region.
1. A method for selectively etching at least one feature in a silicon oxide region with respect to a lower oxygen containing region, wherein the lower oxygen containing region and the silicon oxide region form a structure, wherein the silicon oxide region is adjacent to the lower oxygen containing region and wherein a mask is above at least part of the silicon oxide region and the lower oxygen containing region and wherein the mask provides an exposed part of the lower oxygen containing region and an exposed part of the silicon oxide region, comprising:
providing an etch gas comprising a metalloid halide and/or a metal halide;
forming the etch gas into a plasma; and
simultaneously selectively etching at least one feature in the exposed part of the silicon oxide region with respect to the lower oxygen containing region and forming a metalloid or metal containing hardmask on the exposed part of the lower oxygen containing region, wherein a portion of the silicon oxide region below the mask is not etched and the metalloid or metal containing hardmask is not formed on a portion of the lower oxygen containing region below the mask.
2. The method, as recited in claim 1 , wherein the etch gas further comprises a carbon containing component and a hydrogen containing component.
3. The method, as recited in claim 2 , wherein the hydrogen containing component and the carbon containing component comprises at least one of a hydrocarbon or hydrofluorocarbon.
4. The method, as recited in claim 2 , wherein the hydrogen containing component and the carbon containing component comprises at least one of CH 2 F 2 , CHF 3 , CH 3 F, CH 4 , C 4 F 6 , C 2 H 2 , CF 4 , and C 4 F 8 .
5. The method, as recited in claim 2 , wherein the etch gas further comprises an oxygen containing component comprising at least one of O 2 , O 3 , CO 2 , CO, NO, NO 2 , N 2 O, SO 2 , SO 3 , H 2 O, H 2 O 2 , and COS.
6. The method, as recited in claim 2 , wherein the etch gas further comprises an inert gas from the group consisting of nitrogen, helium, argon, and neon.
7. The method, as recited in claim 1 , wherein a top side of the lower oxygen containing region is oxidized forming an oxidized layer and further comprising providing a selective pre-etch before providing the etch gas, wherein the selective pre-etch partially etches the at least one feature of the silicon oxide region and etches the oxidized layer over the exposed part of the lower oxygen containing region without forming a metalloid or metal containing hardmask.
8. The method, as recited in claim 7 , wherein the metalloid or metal containing hardmask is deposited from where the oxide layer is etched.
9. The method as recited in claim 1 , wherein the lower oxygen containing region comprises at least one of silicon, silicon germanium, germanium, elemental metal, and metal nitrides.
10. The method, as recited in claim 1 , wherein the metalloid halide and/or the metal halide comprises WF 6 and/or MoF 6 .
11. The method, as recited in claim 1 , wherein the metalloid halide and/or the metal halide comprises at least one of silicon (Si), germanium (Ge), tin (Sn), titanium (Ti), zirconium (Zr), hafnium (Hf), vanadium (V), niobium (Nb), tantalum (Ta), boron (B), aluminum (Al), gallium (Ga), indium (In), iron (Fe), ruthenium (Ru), rhenium (Re), antimony (Sb), tungsten (W), molybdenum (Mo), and/or bismuth (Bi).
12. The method, as recited in claim 1 , where the plasma is formed at a pressure of 2-500 millitorr with a power of 30-500 Watts.
13. The method, as recited in claim 1 , further comprising providing an atomic layer etch of the at least one feature in the silicon oxide region after the simultaneously selectively etching the at least one feature in the silicon oxide region with respect to the lower oxygen containing region and forming the metalloid or metal containing hardmask over the lower oxygen containing region, wherein the atomic layer etch uses the metalloid or metal containing hardmask to reduce etching of the lower oxygen containing region.
14. The method, as recited in claim 1 , wherein the at least one feature has a width of less than 15 nm and a depth to width aspect ratio of at least 6:1.
15. The method, as recited in claim 1 , further comprising providing an additional etch of the at least one feature in the silicon oxide region after the simultaneously selectively etching the at least one feature in the silicon oxide region with respect to the lower oxygen containing region and forming the metalloid or metal containing hardmask over the lower oxygen containing region, wherein the additional etch uses the metalloid or metal containing hardmask as a mask for the lower oxygen containing region and without further depositing the metalloid or metal containing hardmask.
16. The method, as recited in claim 15 , further comprising removing the metalloid or metal containing hardmask after the additional etch of the at least one feature.
17. The method, as recited in claim 16 , wherein the removing the metalloid or metal containing hardmask comprises a wet clean.
18. The method, as recited in claim 1 , further comprising providing a temperature of at least 30° C.
19. The method, as recited in claim 1 , wherein the lower oxygen containing region is at least one of silicon nitride, silicon oxy-nitride, silicon oxy-carbo-nitride, silicon germanium, and germanium.