IP Library Granted Patent US 12,347,754
Granted Patent B2
US 12,347,754 · App. 17/502,156 · Granted Jul 1, 2025

Package with load terminals on which coupled power component and logic component are mounted

Inventor: Ralf Otremba (Kaufbeuren, DE)
Assignee: Infineon Technologies AG
H01L23/49575H01L23/49562H01L24/32H01L24/48H01L24/73H01L2224/32245H01L2224/48137H01L2224/48177H01L2224/73265
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Quick Facts
Patent No.
US 12,347,754
App. No.
17/502,156
Granted
Jul 1, 2025
Kind
B2
Abstract

A package is disclosed. In one example, the package comprises a first load terminal, a second load terminal, a power component mounted on the first load terminal, and a logic component electrically conductively mounted on one of the first load terminal. The logic component is the second load terminal and electrically connected with the power component for controlling the power component.

Claims (7)

1. A package, which comprises:

a leadless first load terminal;

a second load terminal smaller than the first load terminal;

a power component mounted on the first load terminal;

a logic component electrically conductively mounted on one of the first load terminal and the second load terminal and electrically connected with the power component for controlling the power component; and

least one electrically conductive connection element which electrically couples the logic component with the second load terminal;

wherein the logic component is configured for sensing a signal which is indicative for a temperature.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 18, 2021
From: OTREMBA, RALF
To: INFINEON TECHNOLOGIES AG
Reel/Frame 057813/0708 →
Priority Claims (1)
DE 10 2020 131 470.1 · Nov 27, 2020 · national
Continuity (1)
Related Publication 20220173023A1 · Jun 2, 2022
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