Doped polar layers and semiconductor device incorporating same
The disclosed technology generally relates to ferroelectric materials and semiconductor devices, and more particularly to semiconductor memory devices incorporating doped polar materials. In one aspect, a semiconductor device comprises a capacitor, which in turn comprises a polar layer comprising a crystalline base polar material doped with a dopant. The base polar material includes one or more metal elements and one or both of oxygen or nitrogen, wherein the dopant comprises a metal element that is different from the one or more metal elements and is present at a concentration such that a ferroelectric switching voltage of the capacitor is different from that of the capacitor having the base polar material without being doped with the dopant by more than about 100 mV. The capacitor additionally comprises first and second crystalline conductive or semiconductive oxide electrodes on opposing sides of the polar layer, wherein the polar layer has a lattice constant that is matched within about 20% of a lattice constant of one or both of the first and second crystalline conductive or semiconductive oxide electrodes. The first crystalline conductive or semiconductive oxide electrode serves as a template for growing the polar layer thereon, such that at least a portion of the polar layer is pseudomorphically formed on the first crystalline conductive or semiconductive oxide electrode.
1. A semiconductor device, comprising:
a capacitor stack comprising:
a crystalline polar layer comprising a base polar material substitutionally doped with a dopant, wherein the base polar material comprises a metal oxide having a perovskite crystal structure and wherein the metal oxide comprises one or more metal elements;
wherein the dopant occupies a corner site of a unit cell of the perovskite crystal structure and is present at a concentration such that a ferroelectric switching voltage of the capacitor is lower than a ferroelectric switching voltage of a reference capacitor, the reference capacitor being the same as the capacitor except for being doped with the dopant, by more than about 100 mV;
first and second crystalline conductive or semiconductive oxide electrodes formed on opposing sides of the crystalline polar layer; and
a further electrode formed on one or both of the first and second crystalline conductive or semiconductive oxide electrodes on a side facing away from the crystalline polar layer and comprising a conductive binary metallic oxide selected from the group consisting of an iridium (Ir) oxide, a ruthenium (Ru) oxide, a palladium (Pd) oxide, an osmium (Os) oxide, and a rhenium (Re) oxide.
2. The semiconductor device of claim 1 , wherein the dopant comprises a metal element of one of 4d series, 5d series, 4f series, or 5f series that is different from the one or more metal elements of the metal oxide.
3. The semiconductor device of claim 1 , further comprising:
a transistor having a drain contact, wherein the further electrode is electrically connected to the drain contact.
4. The semiconductor device of claim 3 , wherein the further electrode is positioned between the drain contact and one of the first and second crystalline conductive or semiconductor oxide electrodes.
5. The semiconductor device of claim 1 , wherein the crystalline polar layer directly contacts one or both of the first and second crystalline conductive or semiconductive oxide electrodes, and wherein the crystalline polar layer has a lattice constant that is matched within about 20% of a lattice constant of one or both of the first and second crystalline conductive or semiconductive oxide electrodes.
6. The semiconductor device of claim 1 , wherein the further electrode comprises a first further electrode, the semiconductor device further comprising:
a second further electrode, wherein the first further electrode is formed on the first crystalline conductive or semiconductive oxide electrode and wherein the second further electrode is formed on the second crystalline conductive or semiconductive oxide electrode.
7. The semiconductor device of claim 6 , wherein the conductive binary metallic oxide comprises a first conductive binary metallic oxide, and wherein the second further electrode comprises a second conductive binary metallic oxide.
8. The semiconductor device of claim 7 , wherein the first and second conductive binary metallic oxides are formed of the same conductive binary metallic oxide.
9. The semiconductor device of claim 6 , wherein the crystalline polar layer is positioned between the first and second further electrodes.
10. The semiconductor device of claim 1 , wherein the crystalline polar layer comprises a ferroelectric oxide having a perovskite structure selected from the group consisting of BaTiO 3 , PbTiO 3 , KNbO 3 , NaTaO 3 , BiFeO 3 PbZrTiO 3 , Pb(Mg,Nb)O 3 , Pb(Mg,Nb)O 3 —PbTiO 3 , PbLaZrTiO 3 , Pb(Sc,Nb)O 3 , BaTiO 3 —Bi(Zn(Nb,Ta))O 3 , BaTiO 3 —BaSrTiO 3 , LiNbO 3 , LiTaO 3 , LiFeTaOF, SrBaNbO, BaNaNbO, KnaSrBaNbO, Bi 1-x La x FeO 3 , Bi 1-x Ce x FeO 3 , and BiFe 1-y Co y O 3 .
11. A semiconductor device, comprising:
a capacitor stack comprising:
a crystalline polar layer comprising a base polar material substitutionally doped with a dopant, wherein the base polar material comprises a metal oxide having one of a perovskite crystal structure or a hexagonal crystal structure, wherein the metal oxide comprises one or more metal elements, and wherein the dopant comprises a metal element of one of 4d series, 5d series, 4f series or 5f series that is different from the one or more metal elements of the metal oxide and is present at a concentration such that a ferroelectric switching voltage of the capacitor stack is lower than about 600 mV;
first and second crystalline conductive or semiconductive oxide electrodes formed on opposing sides of the crystalline polar layer; and
a further electrode formed on one or both of the first and second crystalline conductive or semiconductive oxide electrodes on a side facing away from the crystalline polar layer and comprising a conductive binary metallic oxide.
12. The semiconductor device of claim 11 , wherein the conductive binary metallic oxide is selected from the group consisting of an iridium (Ir) oxide, a ruthenium (Ru) oxide, a palladium (Pd) oxide, an osmium (Os) oxide, and a rhenium (Re) oxide.
13. The semiconductor device of claim 11 , wherein the crystalline polar layer has a same crystal structure as one or both of the first and second crystalline conductive or semiconductive oxide electrodes.
14. The semiconductor device of claim 11 , wherein the crystalline polar layer directly contacts one or both of the first and second crystalline conductive or semiconductive oxide electrodes.
15. The semiconductor device of claim 11 , further comprising:
a transistor having a drain contact, wherein the further electrode is electrically connected to the drain contact.
16. The semiconductor device of claim 15 , wherein the further electrode is positioned between the drain contact and one of the first and second crystalline conductive or semiconductor oxide electrodes.
17. The semiconductor device of claim 11 , wherein the crystalline polar layer comprises a ferroelectric oxide having the perovskite crystal structure and a chemical formula represented by A (m-x) A′ x B (n-y) B′ y O z , wherein A and A′ occupy interchangeable atomic positions in the perovskite crystal structure, wherein B and B′ occupy interchangeable atomic positions in the perovskite crystal structure, wherein one or both of the A′ and the B′ are dopants, wherein m, n, and z are integers, and wherein one or both of x and y are greater than zero.
18. A semiconductor device, comprising:
a capacitor stack comprising:
a crystalline polar layer comprising a base polar material substitutionally doped with a dopant, wherein the base polar material comprises a metal oxide having one of a perovskite crystal structure or a hexagonal crystal structure and wherein the metal oxide comprises one or more metal elements;
wherein the dopant is present at a concentration such that a remnant polarization of the polar layer is less than that of the base polar material without the dopant by more than about 5 μC/cm 2 ;
first and second crystalline conductive or semiconductive oxide electrodes formed on opposing sides of the crystalline polar layer; and
a further electrode formed on one or both of the first and second crystalline conductive or semiconductive oxide electrodes on a side facing away from the crystalline polar layer and comprising a conductive binary metallic oxide, wherein the at least one of the first and second crystalline conductive or semiconductive oxide electrodes is positioned between the further electrode and the crystalline polar layer.
19. The semiconductor device of claim 18 , wherein the conductive binary metallic oxide is selected from the group consisting of an iridium (Ir) oxide, a ruthenium (Ru) oxide, a palladium (Pd) oxide, an osmium (Os) oxide, and a rhenium (Re) oxide.
20. The semiconductor device of claim 18 , wherein the dopant comprises a metal element of one of 4d series, 5d series, 4f series, or 5f series that is different from the one or more metal elements of the metal oxide.
21. The semiconductor device of claim 18 , wherein the crystalline polar layer comprises a ferroelectric oxide having a perovskite crystal structure and a having a chemical formula represented by A (m-x) A′ x B (n-y) B′ y O z , wherein A and A′ occupy interchangeable atomic positions in the perovskite crystal structure, wherein B and B′ occupy interchangeable atomic positions in the perovskite crystal structure, wherein one or both of the A′ and the B′ are dopants, wherein m, n, and z are integers, and wherein one or both of x and y are greater than zero.
22. The semiconductor device of claim 1 , wherein the dopant is present at a concentration greater than 5% and less than 25%.