Doped polar layers and semiconductor device incorporating same
The disclosed technology generally relates to ferroelectric materials and semiconductor devices, and more particularly to semiconductor memory devices incorporating doped polar materials. In one aspect, a semiconductor device comprises a capacitor which in turn comprises a polar layer comprising a base polar material doped with a dopant. The base polar material includes one or more metal elements and one or both of oxygen or nitrogen. The dopant comprises a metal element that is different from the one or more metal elements and is present at a concentration such that a ferroelectric switching voltage of the capacitor is different from that of the capacitor having the base polar material without being doped with the dopant by more than about 100 mV. The capacitor stack additionally comprises first and second crystalline conductive oxide electrodes on opposing sides of the polar layer. The capacitor stack further comprises first and second barrier metal layers on respective ones of the first and second crystalline conductive oxide electrodes on opposing sides of the polar layer.
1 . An integrated circuit device, comprising:
a capacitor comprising an alloyed ferroelectric oxide between first and second electrodes; and
the alloyed ferroelectric oxide having a perovskite crystal structure, wherein a lattice of the perovskite crystal structure comprises:
corner sites interchangeably occupied by base corner elements comprising Ba and Bi and one or more dopant corner elements, and
center sites interchangeably occupied by one or more base center elements.
2 . The integrated circuit device of claim 1 , wherein the dopant corner elements have the same oxidation state as Bi.
3 . The integrated circuit device of claim 1 , wherein the dopant corner elements comprise a metal selected from one of 4d series, 5d series, 4f series and 5f series that is different from the one or more base corner elements.
4 . The integrated circuit device of claim 1 , wherein the dopant corner elements comprise a lanthanide element.
5 . The integrated circuit device of claim 1 , wherein the base center elements comprise Fe and Ti.
6 . The integrated circuit device of claim 5 , wherein the center sites are further interchangeably occupied by one or more dopant center elements selected from the group consisting of Mn, Sc, V, Cr, Co, Ni, Cu and Zn.
7 . The integrated circuit device of claim 1 , wherein the alloyed ferroelectric oxide has a chemical formula represented by A (m−x) A′ x B (n−y) B′ y O z , wherein the A represents the base corner elements, the A′ represents the dopant corner elements, the B represents the base center elements and the B′ represents dopant center elements, wherein m, n and z are integers, and wherein both of x and y are greater than zero.
8 . The integrated circuit device of claim 7 , wherein the A′ comprises La.
9 . The integrated circuit device of claim 7 , wherein the B comprises Fe and Ti.
10 . The integrated circuit device of claim 7 , wherein the B′ comprises Mn.
11 . An integrated circuit device, comprising:
a capacitor comprising an alloyed ferroelectric oxide between first and second electrodes;
the alloyed ferroelectric oxide having a perovskite crystal structure, wherein a lattice of the perovskite crystal structure comprises:
corner sites interchangeably occupied by at least base corner elements comprising Ba and Bi, and
center sites interchangeably occupied by one or more base center elements and one or more dopant center elements.
12 . The integrated circuit device of claim 11 , wherein the base center elements comprise Fe and Ti.
13 . The integrated circuit device of claim 12 , wherein the alloyed ferroelectric oxide comprises an alloy of BiFeO 3 and BaTiO 3 .
14 . The integrated circuit device of claim 13 , wherein the one or more dopant center elements selected from the group consisting of Mn, Sc, V, Cr, Co, Ni, Cu and Zn.
15 . The integrated circuit device of claim 11 , wherein the corner sites are further interchangeably occupied by one or more dopant corner elements.
16 . The integrated circuit device of claim 15 , wherein the dopant corner elements comprise a metal selected from one of 4d series, 5d series, 4f series and 5f series that is different from the one or more base corner elements.
17 . An integrated circuit device, comprising:
a capacitor comprising an alloyed ferroelectric oxide between first and second electrodes;
the alloyed ferroelectric oxide having a perovskite crystal structure, wherein a lattice of the perovskite crystal structure comprises:
corner sites interchangeably occupied by one or more base corner elements, and
center sites interchangeably occupied by base center elements comprising Ti and Fe.
18 . The integrated circuit device of claim 17 , wherein the base corner elements comprise Ba and Bi.
19 . The integrated circuit device of claim 18 , wherein the corner sites are further interchangeably occupied by one or more dopant corner elements selected from one of 4d series, 5d series, 4f series and 5f series that is different from the one or more base corner elements.
20 . The integrated circuit device of claim 17 , wherein the center sites are further interchangeably occupied by one or more dopant center elements selected from the group consisting of Mn, Sc, V, Cr, Co, Ni, Cu and Zn.