IP Library Granted Patent US 12,370,627
Granted Patent B2
US 12,370,627 · App. 17/429,340 · Granted Jul 29, 2025

Laser machining apparatus, laser machining method, and processing program creation device

Inventors: Kazuhisa Nogi (Kanagawa, JP); Noboru Kikkawa (Kanagawa, JP)
Assignee: AMADA CO., LTD.
B23K26/10B23K26/38
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Quick Facts
Patent No.
US 12,370,627
App. No.
17/429,340
Granted
Jul 29, 2025
Kind
B2
Abstract

The laser machining apparatus of the present invention is configured to analyze and adjust a cutting order of opening forming regions in order to prevent a scrap rising from interfering with a laser head by determining a first opening forming region and a second opening forming region based on interfering conditions of the scrap rising with the laser head and processing the second opening forming region prior to the processing of the first opening forming region.

Claims (26)

1. A laser machining apparatus comprising:

a machining apparatus main body including a table on which a plurality of skids are arranged, and configured to irradiate a material mounted on the skids with a laser beam from a laser head and cut the material; and

a control device configured to control the machining apparatus main body to cut around an opening forming region set in the material and form an opening, wherein

the control device:

determines that the opening forming region where a scrap rising after processing is to be formed in a plurality of scraps formed by cutting around the opening forming region is a first opening forming region,

determines, in a case where the first opening forming region is processed and the scrap rises, whether or not the opening forming region is an opening forming region where the scrap rising reaches and interferes with the laser head and adds a predetermined interference width to an outer circumference of the opening forming region where the scrap rising is determined to interfere with the laser head, and

determines that the opening forming region where the laser head is moved to a position at which the laser head interferes with the scrap rising is a second opening forming region, and

controls the machining apparatus main body to perform processing in such a processing order that the second opening forming region is processed prior to the processing of the first opening forming region.

2. A laser machining method in a laser machining apparatus including a table on which a plurality of skids are arranged, and configured to irradiate a material mounted on the skids with a laser beam from a laser head and cut the material, the laser machining method comprising:

determining that an opening forming region where a scrap rising after processing is to be formed in a plurality of scraps formed by cutting around the opening forming region set in the material is a first opening forming region;

determining whether or not the opening forming region is an opening forming region where the scrap rising reaches and interferes with the laser head and adding a predetermined interference width to an outer circumference of the opening forming region where the scrap rising is determined to interfere with the laser head;

determining, in a case where the first opening forming region is processed and the scrap rises, that the opening forming region where the laser head is moved to a position at which the laser head interferes with the scrap rising is a second opening forming region;

in a case where the scrap of the opening forming region interfering with the interference width added region is determined not to rise, adopting such a processing order that the second opening forming region is processed prior to the processing of the first opening forming region; and

in a case where the scrap of the opening forming region interfering with the interference width added region is determined to rise, forming a joint in the opening forming region.

3. A non-transitory computer readable medium having a processing program stored thereon, the processing program, when executed by the control device of the laser machining apparatus of claim 1 , configured to:

in a case where the laser machining apparatus cuts around an opening forming region set in a material mounted on a table on which a plurality of skids are arranged to form an opening, determining that the opening forming region where a scrap rising after processing is to be formed in a plurality of scraps formed by cutting around the opening forming region is a first opening forming region;

determining whether or not the opening forming region is an opening forming region where the scrap rising reaches and interferes with a laser head and adding a predetermined interference width to an outer circumference of the opening forming region where the scrap rising is determined to interfere with the laser head;

determining, in a case where the laser machining apparatus processes the first opening forming region and the scrap rises, that the opening forming region where the laser head of the laser machining apparatus is moved to a position at which the laser head interferes with the scrap rising is a second opening forming region;

in a case where the scrap of the opening forming region interfering with the interference width added is determined not to rise, adopting such a processing order that the second opening forming region is processed prior to the processing of the first opening forming region; and

in a case where the scrap of the opening forming region interfering with the interference width added region is determined to rise, forming a joint in the opening forming region.

4. The pro non-transitory computer readable medium according to claim 3 , wherein the processing program creation device creates a processing program comprising determining, in a case where a size of the opening forming region in a predetermined direction is smaller than a predetermined maximum value, that the opening forming region is the first opening forming region.

5. The non-transitory computer readable medium according to claim 4 , wherein the processing program creation device creates a processing program comprising determining, in a case where the size of the opening forming region in the predetermined direction is smaller than the predetermined maximum value and larger than a predetermined minimum value, that the opening forming region is an opening forming region where a scrap interfering with the laser head is to be formed.

6. The non-transitory computer readable medium according to claim 5 , wherein the processing program creation device creates a processing program comprising:

setting an interference width added region where a predetermined interference width is added to the opening forming region where the size of the opening forming region in the predetermined direction is smaller than the predetermined maximum value and larger than the predetermined minimum value; and

determining that an opening forming region interfering with the interference width added region is the second opening forming region.

7. The non-transitory computer readable medium according to claim 6 , wherein the predetermined maximum value is set to a value at which a scrap generated when the opening forming region is processed does not drop down from the skids, and is stably mounted on the skids, and the predetermined minimum value is set to a value at which, even in a case where the scrap generated by the processing of the opening forming region rises, the scrap rising does not interfere with the laser head.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 9, 2021
From: NOGI, KAZUHISA; KIKKAWA, NOBORU
To: AMADA CO., LTD.
Reel/Frame 057116/0298 →
Priority Claims (1)
JP 2019-026324 · Feb 18, 2019 · national
Continuity (1)
Related Publication 20220143749A1 · May 12, 2022
References Cited (100)
US 4328411A · Haller · 1982 [cited by examiner]
US 4613269A · Wilder · 1986 [cited by examiner]
US 4618938A · Sandland · 1986 [cited by examiner]
US 4667113A · Nakajima · 1987 [cited by examiner]
US 4794222A · Funayama · 1988 [cited by examiner]
US 5387061A · Barkman · 1995 [cited by examiner]
US 5489758A · Nihei · 1996 [cited by examiner]
US 5624588A · Terawaki · 1997 [cited by examiner]
US 5751584A · Yuasa · 1998 [cited by examiner]
US 5864114A · Fukuda · 1999 [cited by examiner]
US 6008465A · Horn · 1999 [cited by examiner]
US 6084223A · Dietz · 2000 [cited by examiner]
US 6128546A · Basista · 2000 [cited by examiner]
US 6353203B1 · Hokodate · 2002 [cited by examiner]
US 6430472B1 · Boillot · 2002 [cited by examiner]
US 6563130B2 · Dworkowski · 2003 [cited by examiner]
US 6603136B1 · Wagner · 2003 [cited by examiner]
US 6617541B1 · Wadman · 2003 [cited by examiner]
US 6632053B2 · Koch · 2003 [cited by examiner]
US 6710294B2 · Lawson · 2004 [cited by examiner]
US 6974930B2 · Jense · 2005 [cited by examiner]
US 7005606B2 · Legge · 2006 [cited by examiner]
US 7038165B2 · Okuda · 2006 [cited by examiner]
US 7062351B2 · Wampler · 2006 [cited by examiner]
US 7283892B1 · Boillot · 2007 [cited by examiner]
US 7638731B2 · Kosmowski · 2009 [cited by examiner]
US 7764039B2 · Yamaguchi · 2010 [cited by examiner]
US 8175858B2 · Naganawa · 2012 [cited by examiner]
US 8367969B2 · Caristan · 2013 [cited by examiner]
US 8581144B2 · Furuta · 2013 [cited by examiner]
US 8624153B2 · Atsumi · 2014 [cited by examiner]
US 8987634B2 · Pieger · 2015 [cited by examiner]
US 9110459B2 · Matsumoto · 2015 [cited by examiner]
US 9122267B2 · Morita · 2015 [cited by examiner]
US 10507558B2 · Inaba · 2019 [cited by examiner]
US 11396057B2 · Boillot · 2022 [cited by examiner]
US 11583951B2 · Fahrni · 2023 [cited by examiner]
US 20030192865A1 · Cole, III · 2003 [cited by examiner]
US 20030209528A1 · Choo · 2003 [cited by examiner]
US 20040206735A1 · Okuda · 2004 [cited by examiner]
US 20050010324A1 · Kaever · 2005 [cited by examiner]
US 20050226377A1 · Wong · 2005 [cited by examiner]
US 20060081575A1 · Egawa · 2006 [cited by examiner]
US 20070075054A1 · Nakamura · 2007 [cited by examiner]
US 20070084837A1 · Kosmowski · 2007 [cited by examiner]
US 20070228025A1 · Horn · 2007 [cited by examiner]
US 20090127762A1 · Kilian · 2009 [cited by examiner]
US 20100133243A1 · Nomaru · 2010 [cited by examiner]
US 20100176099A1 · Hilderbrand · 2010 [cited by examiner]
US 20110089956A1 · Hermann · 2011 [cited by examiner]
US 20110100967A1 · Yoo · 2011 [cited by examiner]
US 20110210109A1 · Szelagowski · 2011 [cited by examiner]
US 20110278268A1 · Siman-Tov · 2011 [cited by examiner]
US 20110313561A1 · Lee · 2011 [cited by examiner]
US 20120111839A1 · Grassi · 2012 [cited by examiner]
US 20120267349A1 · Berndl · 2012 [cited by examiner]
US 20130200052A1 · Wittwer · 2013 [cited by examiner]
US 20130256285A1 · Baxter · 2013 [cited by examiner]
US 20140103019A1 · Galvagnini · 2014 [cited by examiner]
US 20140116997A1 · Inoue · 2014 [cited by examiner]
US 20140138363A1 · Hammann · 2014 [cited by examiner]
US 20140263211A1 · Hassan · 2014 [cited by examiner]
US 20150028007A1 · Pluss · 2015 [cited by examiner]
US 20150151381A1 · Kurosawa · 2015 [cited by examiner]
US 20150241868A1 · Matsumoto · 2015 [cited by examiner]
US 20150266133A1 · Tokito · 2015 [cited by examiner]
US 20150273626A1 · Tokito · 2015 [cited by examiner]
US 20150352679A1 · Yamamoto · 2015 [cited by examiner]
US 20160059347A1 · Kogel-Hollacher · 2016 [cited by examiner]
US 20160059350A1 · Schoenleber · 2016 [cited by examiner]
US 20160059351A1 · Miyashita · 2016 [cited by examiner]
US 20160096239A1 · Raichle · 2016 [cited by examiner]
US 20160114434A1 · Regaard · 2016 [cited by examiner]
US 20160158884A1 · Hagenlocher · 2016 [cited by examiner]
US 20160184923A1 · Tokito · 2016 [cited by examiner]
US 20160193692A1 · Regaard · 2016 [cited by examiner]
US 20170157702A1 · Takada · 2017 [cited by examiner]
US 20170232558A1 · Kano · 2017 [cited by examiner]
US 20170236738A1 · Van Lieshout · 2017 [cited by examiner]
US 20170334019A1 · Izumi · 2017 [cited by examiner]
US 20180076060A1 · Oh · 2018 [cited by examiner]
US 20180277435A1 · Fujita · 2018 [cited by examiner]
US 20180370058A1 · Fukada · 2018 [cited by examiner]
US 20190128857A1 · Hiramatsu · 2019 [cited by examiner]
US 20190247960A1 · Mienhardt · 2019 [cited by examiner]
US 20200041249A1 · Strebel · 2020 [cited by examiner]
US 20200047274A1 · Tani · 2020 [cited by examiner]
US 20210308799A1 · Funaoka · 2021 [cited by examiner]
US 20210402521A1 · Lin · 2021 [cited by examiner]
US 20220314370A1 · Mach · 2022 [cited by examiner]
US 20230054278A1 · Sepp · 2023 [cited by examiner]
EP 1647349A1 · 2006 [cited by examiner]
JP S6080086U · 1985 [cited by applicant]
JP 4361885A · 1992 [cited by applicant]
JP 201678063A · 2016 [cited by applicant]
WO WO2015104071A1 · 2015 [cited by examiner]
Extended European Search Report for corresponding EP Application No. 20759781.6 dated Mar. 14, 2022. [cited by applicant]
International Search Report for corresponding Application No. PCT/JP2020/004809, mailed Apr. 7, 2020. [cited by applicant]
Written Opinion for corresponding Application No. PCT/JP2020/004809, mailed Apr. 7, 2020. [cited by applicant]
Office Action for corresponding Japanese Application No. 2019-026324, dated Mar. 31, 2020. [cited by applicant]