Integrated circuit assemblies with stacked compute logic and memory dies
Integrated circuit (IC) assemblies with stacked compute logic and memory dies, and associated systems and methods, are disclosed. One example IC assembly includes a compute logic die and a stack of memory dies provided above and coupled to the compute logic die, where one or more of the memory dies closest to the compute logic die include memory cells with transistors that are thin-film transistors (TFTs), while one or more of the memory dies further away from the compute logic die include memory cells with non-TFT transistors. Another example IC assembly includes a similar stack of compute logic die and memory dies where one or more of the memory dies closest to the compute logic die include static random-access memory (SRAM) cells, while one or more of the memory dies further away from the compute logic die include memory cells of other memory types.
1. An integrated circuit (IC) assembly, comprising:
a compute logic die; and
a die stack, coupled to the compute logic die, the die stack comprising a first memory die including first memory cells, and a second memory die including second memory cells,
wherein:
each of the first memory cells and the second memory cells includes a transistor and a storage element, coupled to the transistor,
the transistors of the first memory cells is a thin-film transistors (TFTs),
the transistors of the second memory cells is not a TFTs, and
the first memory die is between the compute logic die and the second memory die.
2. The IC assembly according to claim 1 , wherein the storage element is a capacitor, and wherein each of the first memory cells and the second memory cells is a dynamic random-access memory (DRAM) cell.
3. The IC assembly according to claim 1 , wherein channel regions of the transistors of the first memory cells include a semiconductor material with an average grain size smaller than 0.5 millimeter.
4. The IC assembly according to claim 1 , wherein channel regions of the transistors of the first memory cells include a semiconductor material with an average grain size between 0.5 millimeter and 1 millimeter.
5. The IC assembly according to claim 1 , wherein channel regions of the transistors of the second memory cells include a semiconductor material with an average grain size greater than 1 millimeter.
6. The IC assembly according to claim 1 , wherein:
channel regions of the transistors of the first memory cells include a first semiconductor material,
channel regions of the transistors of the second memory cells include a second semiconductor material, and
a bandgap of the first semiconductor material is larger than a bandgap of the second semiconductor material.
7. The IC assembly according to claim 1 , further comprising die-to-die interconnects between at least one of:
the compute logic die and the first memory die, and
the first memory die and the second memory die.
8. The IC assembly according to claim 1 , further comprising a hybrid bonding interface between at least one of:
the compute logic die and the first memory die, and
the first memory die and the second memory die.
9. The IC assembly according to claim 1 , wherein the compute logic die includes one or more logic transistors coupled to one or more of the first memory cells and the second memory cells.
10. The IC assembly according to claim 1 , wherein at least one of the first memory cells is a static random-access memory (SRAM) cell.
11. An integrated circuit (IC) assembly, comprising:
a compute logic die; and
a die stack, coupled to the compute logic die, the die stack comprising a first memory die including first memory cells, and a second memory die including second memory cells,
wherein:
the first memory cells include static random-access memory (SRAM) cells,
the second memory cells include magnetoresistive random-access memory (MRAM) cells or dynamic random-access memory (DRAM) cells, and
the first memory die is between the compute logic die and the second memory die.
12. The IC assembly according to claim 11 , further comprising die-to-die interconnects between at least one of:
the compute logic die and the first memory die, and
the first memory die and the second memory die.
13. The IC assembly according to claim 11 , further comprising a hybrid bonding interface between at least one of:
the compute logic die and the first memory die, and
the first memory die and the second memory die.
14. The IC assembly according to claim 11 , wherein the compute logic die includes one or more logic transistors coupled to one or more of the first memory cells and the second memory cells.
15. The IC assembly according to claim 11 , wherein:
the die stack further includes a third memory die including third memory cells,
the second memory die is between the first memory die and the third memory die,
the second memory cells include the MRAM cells, and
the third memory cells include the DRAM cells.
16. The IC assembly according to claim 11 , wherein at least one of the first memory cells includes a transistor and a storage element, coupled to the transistor, where the transistor is a thin-film transistor (TFT).
17. A method of fabricating an integrated circuit (IC) assembly, the method comprising:
providing a compute logic die; and
providing a die stack, coupled to the compute logic die, the die stack comprising a first memory die including first memory cells, and a second memory die including second memory cells,
wherein:
each of the first memory cells and the second memory cells includes a transistor and a storage element, coupled to the transistor,
the transistor of the first memory cells is a thin-film transistor (TFT),
the transistor of the second memory cells is not a TFT, and
the first memory die is between the compute logic die and the second memory die.
18. The method according to claim 17 , further comprising providing die-to-die interconnects between at least one of:
the compute logic die and the first memory die, and
the first memory die and the second memory die.
19. The method according to claim 17 , further comprising providing hybrid bonding interface between at least one of:
the compute logic die and the first memory die, and
the first memory die and the second memory die.
20. The method according to claim 17 , wherein:
the first memory cells are static random-access memory (SRAM) cells and the second memory cells are magnetoresistive random-access memory (MRAM) cells or dynamic random-access memory (DRAM) cells.