Alloy metal plate and deposition mask including alloy metal plate
In an alloy metal plate according to an embodiment, diffraction intensity of a (111) plane of the alloy metal plate is defined as I (111), diffraction intensity of a (200) plane of the alloy metal plate is defined as I (200), diffraction intensity of a (220) plane of the alloy metal plate is defined as I (220), a diffraction intensity ratio of I (200) is defined by the following Equation 1, and a diffraction intensity ratio of I (220) is defined by the following Equation 2. At this time, the A is 0.5 to 0.6, the B is 0.3 to 0.5, and the value A may be larger than a value B. A = I ( 200 ) / { I ( 200 ) + I ( 220 ) + I ( 111 ) } [ Equation 1 ] The diffraction intensity ratio of I (220) is defined by the following Equation 2. B = I ( 220 ) / { I ( 200 ) + I ( 220 ) + I ( 111 ) } [ Equation 2 ] In addition, in an iron (Fe)-nickel (Ni) alloy metal plate of a deposition mask for OLED pixel deposition according to an embodiment, the metal plate is formed of a plurality of crystal grains, and the maximum area of the crystal grains measured over the entire area of the metal plate is 700 μm 2 or less.
1. A deposition mask including an iron (Fe) and a nickel (Ni) of metal materials for OLED pixel deposition,
wherein the deposition mask comprises a metal plate including an iron (Fe)-nickel (Ni) alloy,
wherein the metal plate comprises a deposition region and a non-deposition region other than the deposition region for forming a deposition pattern,
wherein the deposition region includes at least one effective portion and at least one ineffective portion other than the at least one effective portion,
wherein the at least one effective portion includes:
at least one small surface hole on a first surface of the deposition mask;
at least one large surface hole on a second surface opposite to the first surface;
a through-hole communicating the at least one small surface hole and the at least one large surface hole of the deposition mask; and
at least one island portion on the second surface of the deposition mask, and disposed between a plurality of through-holes,
wherein the metal plate comprises a plurality of crystal grains, and
wherein a maximum particle diameter of the crystal grains measured in an entire area of the metal plate is 30 μm or less.
2. The deposition mask of claim 1 , wherein the maximum particle diameter of the crystal grains measured in the entire area of the metal plate is from 25 μm to 30 μm.
3. The deposition mask of claim 2 , wherein when measuring from small crystal grains in all crystal grains measured over the entire area of the metal plate, a maximum particle diameter of 95% of the small crystal grains is 9 μm or less.
4. The deposition mask of claim 1 , wherein a maximum area of the crystal grains measured over an entire area of the metal plate is 700 μm 2 or less.
5. The deposition mask of claim 4 , wherein the maximum particle diameter of the crystal grains measured in the entire area of the metal plate is from 26 μm to 29 μm.
6. The deposition mask of claim 1 , wherein when measuring from small crystal grains in all crystal grains measured over the entire area of the metal plate, the maximum area of 95% of the small crystal grains is 60 μm 2 or less.
7. The deposition mask of claim 1 , wherein the particle diameter of the crystal grain is measured by the following Formula.
area
/
π
2
*
.
8. The deposition mask of claim 1 , wherein when measuring from small crystal grains in all crystal grains measured over the entire area of the metal plate, a maximum particle diameter of 95% of the small crystal grains is 9 μm or less.
9. The deposition mask of claim 1 , wherein a quantity per unit area of the plurality of crystal grains is 0.20 ea/μm 2 to 0.25 ea/μm 2 .
10. The deposition mask of claim 9 , wherein for the quantity of crystal grains per unit area, an area of 1 μm*1 μm was defined as the unit area after measuring a number of entire crystal grains in an area of 300 μm*300 μm out of the surface of the entire metal plate, and the quantity of crystal grains per unit area was measured.
11. A deposition mask including an iron (Fe) and a nickel (Ni) of metal materials for OLED pixel deposition,
wherein the deposition mask comprises a metal plate including an iron (Fe)-nickel (Ni) alloy,
wherein the metal plate comprises a deposition region and a non-deposition region other than the deposition region for forming a deposition pattern,
wherein the deposition region includes at least one effective portion and at least one ineffective portion other than the at least one effective portion,
wherein the at least one effective portion includes:
at least one small surface hole on a first surface of the deposition mask;
at least one large surface hole on a second surface opposite to the first surface;
a through-hole communicating the at least one small surface hole and the at least one large surface hole of the deposition mask; and
at least one island portion on the second surface of the deposition mask, and disposed between a plurality of through-holes,
wherein the metal plate comprises a plurality of crystal grains, and
wherein when measuring from small crystal grains in all crystal grains measured over the entire area of the metal plate, the maximum area of 95% of the small crystal grains is 60 μm 2 or less.
12. The deposition mask of claim 11 , wherein a maximum particle diameter of the crystal grains measured in an entire area of the metal plate is 30 μm or less.
13. The deposition mask of claim 12 , wherein the maximum particle diameter of the crystal grains measured in the entire area of the metal plate is from 25 μm to 30 μm.
14. The deposition mask of claim 13 , wherein the maximum particle diameter of the crystal grains measured in the entire area of the metal plate is from 26 μm to 29 μm.
15. The deposition mask of claim 12 , wherein a maximum area of the crystal grains measured over an entire area of the metal plate is 700 μm 2 or less.
16. The deposition mask of claim 12 , wherein when measuring from small crystal grains in all crystal grains measured over the entire area of the metal plate, a maximum particle diameter of 95% of the small crystal grains is 9 μm or less.
17. The deposition mask of claim 11 , wherein the particle diameter of the crystal grain is measured by the following Formula.
area
/
π
2
*
.
18. The deposition mask of claim 11 , wherein when measuring from small crystal grains in all crystal grains measured over the entire area of the metal plate, a maximum particle diameter of 95% of the small crystal grains is 9 μm or less.
19. The deposition mask of claim 11 , wherein a quantity per unit area of the plurality of crystal grains is 0.20 ea/μm 2 to 0.25 ea/μm 2 .
20. The deposition mask of claim 19 , wherein for the quantity of crystal grains per unit area, an area of 1 μm*1 μm was defined as the unit area after measuring a number of entire crystal grains in an area of 300 μm*300 μm out of the surface of the entire metal plate, and the quantity of crystal grains per unit area was measured.