Memory device for reducing timing parameters and power consumption for internal processing operation and method of implementing the same
A memory device for reducing timing parameters and power consumption for an internal processing operation and a method of implementing the same are provided. The memory device includes a memory cell array, a processing-in-memory (PIM) circuit configured to perform a processing operation and a control logic circuit configured to control a normal mode and an internal processing mode. The control logic circuit writes an operation result obtained by the processing operation of the PIM circuit in the internal processing mode in the memory cell array and provides read data read from the memory cell array to the PIM circuit.
1. A memory device comprising:
a memory cell array including a plurality of memory cells;
a processing-in-memory (PIM) circuit configured to perform a processing operation; and
a control logic circuit configured,
in response to a write command in a normal mode received from a memory controller to the memory device, to control the memory device to perform a write operation for write data provided by the memory controller,
in response to the write command in an internal processing mode received from the memory controller to the memory device, to control the memory device to perform a write operation for an operation result obtained by the processing operation,
to control the memory device so that a first time for the write operation in the internal processing mode being performed is less than a second time for the write operation in the normal mode being performed, and
to non-set a write data strobe signal related to the write operation in the internal processing mode so as not to toggle the write data strobe signal during the write operation of the operation result in the internal processing mode.
2. The memory device of claim 1 , wherein the control logic circuit is configured to receive the write data related to a write latency from the memory controller in the normal mode and not receive the write data from the memory controller in the internal processing mode.
3. The memory device of claim 1 , wherein
the control logic circuit is configured to set a first timing parameter as an operating condition for a read command received after the write operation based on the write command, and
the control logic circuit is further configured to set the first timing parameter in the internal processing mode to be shorter than the first timing parameter in the normal mode.
4. The memory device of claim 3 , wherein the first timing parameter includes a write-to-read delay (tWTR) parameter determined in a standard of the memory device.
5. A memory device comprising:
a memory cell array including a plurality of memory cells;
a processing-in-memory (PIM) circuit configured to perform a processing operation; and
a control logic circuit configured,
in response to a write command in a normal mode received from a memory controller to the memory device, to control the memory device to perform a write operation for write data provided by the memory controller,
in response to the write command in an internal processing mode received from the memory controller to the memory device, to control the memory device to perform a write operation for an operation result obtained by the processing operation, and
to control the memory device so that a first time for the write operation in the internal processing mode being performed is less than a second time for the write operation in the normal mode being performed,
wherein the control logic circuit comprises
a PIM command determination unit configured to determine whether the write command specifies the internal processing mode and to generate a PIM command signal,
a write register configured to generate and store a burst address based on a column address received with the write command, and
a first selector configured to transmit the column address as an internal column address in response to the PIM command signal being active and to transmit the burst address stored in the write register as the internal column address in response to the PIM command signal being inactive, wherein the write operation is performed based on the internal column address.
6. The memory device of claim 5 , wherein the control logic circuit further comprises a second selector configured to disable the write register in response to the PIM command signal being active, and provide the write command to the write register in response to the PIM command signal being inactive to enable the write register.
7. The memory device of claim 5 , wherein the control logic circuit further comprises a third selector configured to transmit a write data strobe signal received from an outside of the memory device as an internal write signal in response to the PIM command signal being inactive and to transmit the write command as the internal write signal in response to the PIM command signal being active, wherein the write operation is performed based on the internal write signal.
8. The memory device of claim 7 , wherein the write register is configured to provide the burst address to the first selector in response to the write data strobe signal.
9. A memory device comprising:
at least one logic die;
a plurality of memory dies stacked on the at least one logic die; and
through silicon vias (TSV) configuring buses electrically connecting the at least one logic die to the plurality of memory dies,
wherein each of the plurality of memory dies comprises
a memory cell array including a plurality of memory cells,
a processing-in-memory (PIM) circuit configured to perform a processing operation, and
a control logic circuit configured to
in response to a write command in a normal mode received from a memory controller to the memory device, control each of the plurality of memory dies to perform a write operation for write data provided by the memory controller,
in response to the write command in an internal processing mode received from the memory controller to the memory device, control each of the plurality of memory dies to perform a write operation for an operation result obtained by the processing operation, and
control the memory device so that a first time for the write operation in the internal processing mode being performed is less than a second time for the write operation in the normal mode being performed, and
wherein the control logic circuit comprises a selector configured to transmit a write data strobe signal received from outside of the memory device as an internal write signal in response to a PIM command signal being inactive, and transmit the write command as the internal write signal in response to the PIM command signal being active, wherein the write operation is performed based on the internal write signal.
10. The memory device of claim 9 , wherein the control logic circuit is configured to receive the write data related to a write latency from the memory controller in the normal mode and not receive the write data from the memory controller in the internal processing mode.
11. The memory device of claim 10 , wherein the control logic circuit is configured to receive the write data from the memory controller with a write data strobe signal in the normal mode and not receive the write data strobe signal from the memory controller in the internal processing mode.
12. The memory device of claim 9 , wherein
the control logic circuit is configured to set a first timing parameter as an operating condition for a read command received after the write operation based on the write command, and
the control logic circuit is further configured to set the first timing parameter in the internal processing mode to be shorter than that in the normal mode.
13. The memory device of claim 12 , wherein the first timing parameter includes a write-to-read delay (tWTR) parameter determined in a standard of the memory device.