IP Library › Granted Patent US 12,398,269
Granted Patent B2
US 12,398,269 · App. 17/129,507 · Granted Aug 26, 2025

Method of manufacturing a mold that is resistant to hypochlorite

Inventors: Arda Alkan (Domat/Ems, CH); Thomas Wiedemann (Domat/Ems, CH); Andri Cadalbert (Bonaduz, CH); Manfred Hewel (Domat/Ems, CH); Botho Hoffmann (Domat/Ems, CH)
Assignee: EMS-CHEMIE AG
C08L77/08C08K5/134C08K7/14C08L2203/30
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Quick Facts
Patent No.
US 12,398,269
App. No.
17/129,507
Granted
Aug 26, 2025
Kind
B2
Abstract

The present invention relates to the use of a polyamide molding compound for application purposes in which a high resistance to hypochlorous acid is decisive. The molding compound is thus used in accordance with the invention for molds that are suitable for contact with aqueous solutions containing hypochlorous acid.

Claims (63)

1. A method of manufacturing a mold that is resistant to an aqueous solution containing hypochlorous acid and/or its salt,

the method comprising molding a copolyamide molding compound comprising at least one amorphous or microcrystalline copolyamide (A) that contains the following monomers:

(a) at least one cycloaliphatic diamine;

(b) 0.25 to 3.0 mol % of at least one dimer fatty acid;

(c) 12 to 49.75 mol % of at least one aromatic dicarboxylic acid selected from the group comprising isophthalic acid, terephthalic acid, and naphthalenedicarboxylic acid; and

(d) 0 to 37.75 mol % of at least one aliphatic dicarboxylic acid;

wherein the molar portion of isophthalic acid is at least equal to the molar portion of terephthalic acid; and

wherein the monomers (b), (c), and optionally (d) add up to 50 mol % and the molar portions of all monomers contained in the copolyamide (A) add up to 100 mol %;

wherein the mold is selected from the group consisting of components in swimming baths, whirlpools, heating systems, or in sauna or toilet, mixers, faucets, filter housings, water meters, water meter components, valves, valve components, distributors, cartridges, pumps, pump components inspection glasses, lines, and combinations thereof.

2. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) contains the following monomers having the following mol portions:

40 to 50 mol % cycloaliphatic diamine (a),

1 to 3.0 mol % dimer fatty acid (b), and

14 to 44 mol % aromatic dicarboxylic acid (c), and optionally

5 to 35 mol % aliphatic dicarboxylic acid (d),

wherein the portions of all the monomers contained in the copolyamide (A) add up to 100 mol %.

3. The method according to claim 2 , wherein the at least one amorphous or microcrystalline copolyamide (A) contains isophthalic acid as an aromatic dicarboxylic acid (c), optionally in combination with terephthalic acid, wherein:

the portion of isophthalic acid related to the sum of all the monomers in the copolyamide (A) amounts to 6 to 49.75 mol %, and/or

the portion of terephthalic acid related to the sum of all the monomers in the copolyamide (A) amounts to 0 to 24.875 mol %.

4. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) has

a light transmission measured according to ASTM D 1003-13 (2013) at a plate produced thereof having a thickness of 2 mm of at least 80%.

5. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) contains at least the following monomers:

(a) at least one cycloaliphatic diamine component selected from the group consisting of bis(4-amino-3-methylcyclohexyl) methane, bis-(4-aminocyclohexyl) methane, bis-(4-amino-3-ethylcyclohexyl) methane, bis-(4-amino-3,5-dimethylcyclohexyl) methane, 2,6-norbornane diamine or 2,6-bis-(aminomethyl)-norbornane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexanediamine, isophorone diamine, 1,3-bis-(aminomethyl)cyclohexane, 1,4-bis-(aminomethyl)cyclohexane, and 2,2-(4,4′-diamonodicyclohexyl)propane;

(b) at least one dimer fatty acid selected from the group consisting of dimer fatty acids having 36 or 44 C atoms;

(c) at least one aromatic dicarboxylic acid selected from the group consisting of isophthalic acid and terephthalic acid; and optionally

(d) at least one aliphatic dicarboxylic acid selected from the group consisting of 1,6-hexanedioic acid, 1,9-nonanedioic acid, 1,10-decanedioic acid, 1,11-undecanedioic acid, 1,12-dodecanedioic acid, 1,13-tridecanedioic acid, 1,14-tetradecanedioic acid, 1,18-octadecanedioic acid, 1,3-cyclohexanedicarboxylic acid, and 1,4-cyclohexanedicarboxylic acid.

6. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) contains at least the following monomers:

(a) at least one cycloaliphatic diamine component selected from the group consisting of bis-(4-amino-3-methyl-cyclohexyl)-methane, bis-(4-amino-cyclohexyl)-methane, and bis-(4-amino-3,5-dimethyl-cyclohexyl)-methane;

(b) at least one dimer fatty acid having 36 C atoms; and

(c) isophthalic acid and terephthalic acid; and optionally

(d) at least one aliphatic dicarboxylic acid selected from the group consisting of 1,12-dodecanedioic acid; 1,14-tetradecanedioic acid; and 1,18-octadecanedioic acid.

7. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) contains at least one aliphatic dicarboxylic acid having 6 to 22 carbon atoms as a further monomer (d).

8. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) is selected from the group consisting of MACMI/MACM12/MACM36, MACMI/MACM14/MACM36, MACMI/MACM9/MACM36, MACMI/MACMCHD/MACM36, MACMI/MACM11/MACM36, MACMI/MACM13/MACM36, MACMI/MACM18/MACM36, MACMI/MACMT/MACM36, MACMI/MACM36, MACMI/MACMT/MACM12/MACM36, MACMI/MACMT/MACM14/MACM36, MACMI/MACMT/MACM18/MACM36, MACMI/MACMT/MACM9/MACM36, MACMI/MACMT/MACMCHD/MACM36, and MACMI/MACMT/MACM12/MACMCHD/MACM36,

wherein MACM can wholly or partially be replaced with TMACM; and/or

wherein the dimer fatty acid having 36 carbon atoms can be wholly or partially replaced with a dimer fatty acid having 44 carbon atoms.

9. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) is selected from the group consisting of MACMI/MACM12/MACM36, MACMI/MACM14/MACM36, MACMI/MACM18/MACM36, MACMI/MACMT/MACM36, MACMI/MACM36, MACMI/MACMT/MACM12/MACM36, MACMI/MACMT/MACM14/MACM36, and MACMI/MACMT/MACM18/MACM36,

wherein MACM can wholly or partially be replaced with TMACM; and/or

wherein the dimer fatty acid having 36 carbon atoms can be wholly or partially replaced with a dimer fatty acid having 44 carbon atoms.

10. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) is selected from the group consisting of MACMI/MACM12/MACM36, MACMI/MACM14/MACM36, MACMI/MACMT/MACM36, MACMI/MACM36, MACMI/MACMT/MACM12/MACM36, MACMI/MACMT/MACM14/MACM36 MACMI/MACM12/MACM36, MACMI/MACM14/MACM36, MACMI/MACMT/MACM36, MACMI/MACM36, MACMI/MACMT/MACM12/MACM36, and MACMI/MACMT/MACM14/MACM36.

11. The method according to claim 1 , wherein the copolyamide molding compound contains at least one amorphous or microcrystalline copolyamide (A) and optionally at least one inorganic filler (B) and/or optionally at least one additive (C), and/or optionally at least one further polymer (D) that is different from the copolyamide (A) and from the additive (C).

12. The method according to claim 1 , wherein the copolymer molding compound has the following composition:

46 to 100 wt %, amorphous or microcrystalline copolyamide (A); and

0 to 50 wt % filler (B); and

0 to 4 wt % additive (C),

wherein components (A) to (C) add up to 100 wt %.

13. The method according to claim 1 , wherein the copolyamide molding compound does not contain any further polyamide and/or copolyamide.

14. The method according to claim 1 , wherein the copolymer molding compound has the following composition:

96 to 100 wt % amorphous or microcrystalline copolyamide (A); and

0 to 4 wt % additive (C),

wherein the components (A) to (C) add up to 100 wt %.

15. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) contains the following monomers having the following mol portions:

48 to 50 mol % cycloaliphatic diamine (a), and

1.5 to 3.0 mol % dimer fatty acid (b), and

23 to 38.5 mol % aromatic dicarboxylic acid (c), and optionally

10 to 25.5 mol % aliphatic dicarboxylic acid (d),

where the portions of all monomers contained in the copolyamide (A) add up to 100 mol %.

16. The method according to claim 1 , wherein the at least one amorphous or microcrystalline copolyamide (A) has

a glass transition temperature measured according to ISO 11537-2 (2013) of at least 170° C.; and/or

a light transmission measured according to ASTM D 1003-13 (2013) at a plate produced thereof having a thickness of 2 mm of at least 85%.

17. The method according to claim 1 , wherein the copolymer molding compound has the following composition:

57 to 99.99 wt % of amorphous or microcrystalline copolyamide (A);

0 to 40 wt % of filler (B); and

0.01 to 3 wt. % additive (C),

where components (A) to (C) add up to 100 wt %.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Feb 26, 2021
From: ALKAN, ARDA; WIEDEMANN, THOMAS; CADALBERT, ANDRI; HEWEL, MANFRED; HOFFMANN, BOTHO
To: EMS-CHEMIE AG
Reel/Frame 055424/0965 →
Priority Claims (1)
EP 19219338 · Dec 23, 2019 · regional
Continuity (1)
Related Publication 20210189125A1 · Jun 24, 2021
References Cited (202)
US 5177177A · Thullen · 1993 [cited by examiner]
US 5177178A · Thullen et al. · 1993 [cited by applicant]
US 6482889B1 · Kurz · 2002 [cited by applicant]
US 7723411B2 · Schneider · 2010 [cited by applicant]
US 7973191B2 · Doring et al. · 2011 [cited by applicant]
US 8022170B2 · Hoffman et al. · 2011 [cited by applicant]
US 8268956B2 · Bühler et al. · 2012 [cited by applicant]
US 8383244B2 · Bayer et al. · 2013 [cited by applicant]
US 8404323B2 · Pfleghar et al. · 2013 [cited by applicant]
US 8586662B2 · Harder et al. · 2013 [cited by applicant]
US 8604120B2 · Stöppelmann et al. · 2013 [cited by applicant]
US 8993662B2 · Kaplan · 2015 [cited by applicant]
US 9109115B2 · Buhler et al. · 2015 [cited by applicant]
US 9133322B2 · Roth et al. · 2015 [cited by applicant]
US 9359532B2 · Kaplan · 2016 [cited by applicant]
US 9453106B2 · Buhler et al. · 2016 [cited by applicant]
US 9644081B2 · Aepli et al. · 2017 [cited by applicant]
US 9663655B2 · Aepli · 2017 [cited by applicant]
US 9815967B2 · Harder et al. · 2017 [cited by applicant]
US 9963547B2 · Hoppe et al. · 2018 [cited by applicant]
US 9963591B2 · Bayer et al. · 2018 [cited by applicant]
US 9969882B2 · Thomas et al. · 2018 [cited by applicant]
US 10005268B2 · Jeltsch et al. · 2018 [cited by applicant]
US 10047054B2 · Kaplan · 2018 [cited by applicant]
US 10144805B2 · Bayer et al. · 2018 [cited by applicant]
US 10233326B2 · Koch et al. · 2019 [cited by applicant]
US 10544286B2 · Nakano et al. · 2020 [cited by applicant]
US 10577478B2 · Fujii et al. · 2020 [cited by applicant]
US 10683418B2 · Thomas et al. · 2020 [cited by applicant]
US 10717816B2 · Aepli et al. · 2020 [cited by applicant]
US 10751961B2 · Cheung · 2020 [cited by applicant]
US 10767047B2 · Aepli et al. · 2020 [cited by applicant]
US 10767048B2 · Aepli et al. · 2020 [cited by applicant]
US 10836905B2 · Wiedemann et al. · 2020 [cited by applicant]
US 10843389B2 · Weis et al. · 2020 [cited by applicant]
US 10882975B2 · Stöppelmann · 2021 [cited by applicant]
US 10889713B2 · Schubert et al. · 2021 [cited by applicant]
US 10899527B2 · Sütterlin et al. · 2021 [cited by applicant]
US 10927254B2 · Stöppelmann et al. · 2021 [cited by applicant]
US 11059950B2 · Holzschuh et al. · 2021 [cited by applicant]
US 11091590B2 · Hoffmann et al. · 2021 [cited by applicant]
US 11098194B2 · Aepli et al. · 2021 [cited by applicant]
US 11186716B2 · Sütterlin et al. · 2021 [cited by applicant]
US 11254083B2 · Caviezel · 2022 [cited by applicant]
US 11254794B2 · Holzschuh et al. · 2022 [cited by applicant]
US 11274204B2 · Wiedemann · 2022 [cited by applicant]
US 11359051B2 · Aepli et al. · 2022 [cited by applicant]
US 11359091B2 · Wiedermann et al. · 2022 [cited by applicant]
US 11453778B2 · Harder et al. · 2022 [cited by applicant]
US 11466153B2 · Wiedermann et al. · 2022 [cited by applicant]
US 11981813B2 · Alkan et al. · 2024 [cited by applicant]
US 20060235190A1 · Hoffman et al. · 2006 [cited by applicant]
US 20060264542A1 · Schneider · 2006 [cited by applicant]
US 20080135720A1 · Bühler et al. · 2008 [cited by applicant]
US 20080300347A1 · Kurz et al. · 2008 [cited by applicant]
US 20100069657A1 · Doring et al. · 2010 [cited by applicant]
US 20100168423A1 · Doring et al. · 2010 [cited by applicant]
US 20100279111A1 · Harder et al. · 2010 [cited by applicant]
US 20110220667A1 · Pfleghar et al. · 2011 [cited by applicant]
US 20120029133A1 · Stöppelmann et al. · 2012 [cited by applicant]
US 20120115993A1 · Kaplan · 2012 [cited by applicant]
US 20120237708A1 · Caviezel et al. · 2012 [cited by applicant]
US 20120321829A1 · Bayer et al. · 2012 [cited by applicant]
US 20130136911A1 · Bender et al. · 2013 [cited by applicant]
US 20130317168A1 · Buhler et al. · 2013 [cited by applicant]
US 20140094548A1 · Roth et al. · 2014 [cited by applicant]
US 20140135458A1 · Kaplan · 2014 [cited by applicant]
US 20140171573A1 · Bayer et al. · 2014 [cited by applicant]
US 20140272227A1 · Jeltsch et al. · 2014 [cited by applicant]
US 20140275392A1 · Buhler et al. · 2014 [cited by applicant]
US 20150051343A1 · Kaplan · 2015 [cited by applicant]
US 20150104638A1 · Jeltsch et al. · 2015 [cited by applicant]
US 20150126635A1 · Liedloff et al. · 2015 [cited by applicant]
US 20150126701A1 · Liedloff et al. · 2015 [cited by applicant]
US 20150218374A1 · Thomas et al. · 2015 [cited by applicant]
US 20150284531A1 · Aepli et al. · 2015 [cited by applicant]
US 20150291795A1 · Aepli · 2015 [cited by applicant]
US 20150352765A1 · Hoffmann et al. · 2015 [cited by applicant]
US 20150368398A1 · Hoppe et al. · 2015 [cited by applicant]
US 20160130439A1 · Koch et al. · 2016 [cited by applicant]
US 20160280914A1 · Thomas et al. · 2016 [cited by applicant]
US 20160297123A1 · Weis et al. · 2016 [cited by applicant]
US 20160376423A1 · Harder et al. · 2016 [cited by applicant]
US 20170058123A1 · Sütterlin et al. · 2017 [cited by applicant]
US 20170107326A1 · Bayer et al. · 2017 [cited by applicant]
US 20170137608A1 · Stöppelmann · 2017 [cited by applicant]
US 20170137609A1 · Stöppelmann · 2017 [cited by applicant]
US 20170183140A1 · Sütterlin et al. · 2017 [cited by applicant]
US 20170225414A1 · Cheung · 2017 [cited by applicant]
US 20170275459A1 · Hewel · 2017 [cited by examiner]
US 20180022900A1 · Nakano et al. · 2018 [cited by applicant]
US 20180100064A1 · Aepli et al. · 2018 [cited by applicant]
US 20180112059A1 · Fujii et al. · 2018 [cited by applicant]
US 20180155545A1 · Stöppelmann et al. · 2018 [cited by applicant]
US 20180171141A1 · Thomas et al. · 2018 [cited by applicant]
US 20180251599A1 · Aepli · 2018 [cited by examiner]
US 20180251600A1 · Hoffman et al. · 2018 [cited by applicant]
US 20180298191A1 · Schubert et al. · 2018 [cited by applicant]
US 20190055356A1 · Aepli et al. · 2019 [cited by applicant]
US 20190055404A1 · Aepli et al. · 2019 [cited by applicant]
US 20190055405A1 · Aepli et al. · 2019 [cited by applicant]
US 20190062554A1 · Wiedemann et al. · 2019 [cited by applicant]
US 20190136053A1 · Fujii et al. · 2019 [cited by applicant]
US 20200024415A1 · Holzschuh et al. · 2020 [cited by applicant]
US 20200024416A1 · Holzschuh et al. · 2020 [cited by applicant]
US 20200109284A1 · Wiedemann · 2020 [cited by applicant]
US 20200198203A1 · Cavieze · 2020 [cited by applicant]
US 20210032464A1 · Stöppelmann · 2021 [cited by applicant]
US 20210032465A1 · Wiedemann et al. · 2021 [cited by applicant]
US 20210032466A1 · Stöppelmann · 2021 [cited by applicant]
US 20210040264A1 · Harder et al. · 2021 [cited by applicant]
US 20210040317A1 · Harder et al. · 2021 [cited by applicant]
US 20210115250A1 · Wiedemann et al. · 2021 [cited by applicant]
US 20210189124A1 · Alkan et al. · 2021 [cited by applicant]
US 20210189125A1 · Alkan et al. · 2021 [cited by applicant]
US 20220195186A1 · Alkan et al. · 2022 [cited by applicant]
US 20220204764A1 · Alkan et al. · 2022 [cited by applicant]
US 20230312922A1 · Aepli et al. · 2023 [cited by applicant]
EP 0469435A1 · 1992 [cited by applicant]
EP 1291073A1 · 2003 [cited by applicant]
EP 3369760A1 · 2018 [cited by applicant]
EP 3369761A1 · 2018 [cited by applicant]
EP 3502188A1 · 2019 [cited by applicant]
JP H04233943A · 1992 [cited by applicant]
JP H04253727A · 1992 [cited by applicant]
JP 2018162445A · 2018 [cited by applicant]
JP 2018168353A · 2018 [cited by applicant]
JP 2019070110A · 2019 [cited by applicant]
TW 201839034A · 2018 [cited by applicant]
US 10,875,999 B2, 12/2020, Stöppelmann et al. (withdrawn) [cited by applicant]
US 11,332,575 B2, 05/2022, Aepli et al. (withdrawn) [cited by applicant]
U.S. Appl. No. 09/533,280, filed Mar. 22, 2000, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 10/536,494, filed May 24, 2005, Patented. [cited by applicant]
U.S. Appl. No. 10/553,259, filed Oct. 11, 2005, Patented. [cited by applicant]
U.S. Appl. No. 11/950,964, filed Dec. 5, 2007, Patented. [cited by applicant]
U.S. Appl. No. 12/091,024, filed Apr. 21, 2008, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 12/539,972, filed Aug. 12, 2009, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 12/540,007, filed Aug. 12, 2009, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 12/743,097, filed May 14, 2010, Patented. [cited by applicant]
U.S. Appl. No. 13/045,682, filed Mar. 11, 2011, Patented. [cited by applicant]
U.S. Appl. No. 13/186,785, filed Jul. 20, 2011, Patented. [cited by applicant]
U.S. Appl. No. 13/290,718, filed Nov. 7, 2011, Patented. [cited by applicant]
U.S. Appl. No. 13/421,541, filed Mar. 15, 2012, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 13/481,451, filed May 25, 2012, Patented. [cited by applicant]
U.S. Appl. No. 13/674,395, filed Nov. 12, 2012, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 13/800,102, filed Mar. 13, 2013, Patented. [cited by applicant]
U.S. Appl. No. 13/898,099, filed May 20, 2013, Patented. [cited by applicant]
U.S. Appl. No. 13/971,376, filed Aug. 20, 2013, Patented. [cited by applicant]
U.S. Appl. No. 14/078,134, filed Nov. 12, 2013, Patented. [cited by applicant]
U.S. Appl. No. 14/204,404, filed Mar. 11, 2014, Patented. [cited by applicant]
U.S. Appl. No. 14/205,667, filed Mar. 12, 2014, Patented. [cited by applicant]
U.S. Appl. No. 14/221,930, filed Mar. 21, 2014, Patented. [cited by applicant]
U.S. Appl. No. 14/397,529, filed Oct. 28, 2014, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 14/397,534, filed Oct. 28, 2014, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 14/504,651, filed Oct. 2, 2014, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 14/607,676, filed Jan. 28, 2015, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 14/663,105, filed Mar. 19, 2015, Patented. [cited by applicant]
U.S. Appl. No. 14/681,669, filed Apr. 8, 2015, Patented. [cited by applicant]
U.S. Appl. No. 14/729,277, filed Jun. 3, 2015, Never Issued: Abandoned/Expired. [cited by applicant]
U.S. Appl. No. 14/740,736, filed Jun. 16, 2015, Patented. [cited by applicant]
U.S. Appl. No. 14/915,031, filed Feb. 26, 2016, Patented. [cited by applicant]
U.S. Appl. No. 14/935,642, filed Nov. 9, 2015, Patented. [cited by applicant]
U.S. Appl. No. 15/090,881, filed Apr. 5, 2016, Patented. [cited by applicant]
U.S. Appl. No. 15/105,011, filed Sep. 6, 2016, Patented. [cited by applicant]
U.S. Appl. No. 15/253,506, filed Aug. 31, 2016, Pending. [cited by applicant]
U.S. Appl. No. 15/285,947, filed Oct. 5, 2016, Patented. [cited by applicant]
U.S. Appl. No. 15/349,636, filed Nov. 11, 2016, Patented. [cited by applicant]
U.S. Appl. No. 15/349,729, filed Nov. 11, 2016, Pending. [cited by applicant]
U.S. Appl. No. 15/385,432, filed Dec. 20, 2016, Patented. [cited by applicant]
U.S. Appl. No. 15/385,519, filed Dec. 20, 2016, Patented. [cited by applicant]
U.S. Appl. No. 15/546,373, filed Jul. 26, 2017, Patented. [cited by applicant]
U.S. Appl. No. 15/729,321, filed Oct. 10, 2017, Pending. [cited by applicant]
U.S. Appl. No. 15/789,069, filed Oct. 20, 2017, Patented. [cited by applicant]
U.S. Appl. No. 15/826,177, filed Nov. 29, 2017, Patented. [cited by applicant]
U.S. Appl. No. 15/895,537, filed Feb. 13, 2018, Patented. [cited by applicant]
U.S. Appl. No. 15/910,891, filed Mar. 2, 2018, Pending. [cited by applicant]
U.S. Appl. No. 15/955,737, filed Apr. 18, 2018, Patented. [cited by applicant]
U.S. Appl. No. 16/094,198, filed Oct. 16, 2018, Pending. [cited by applicant]
U.S. Appl. No. 16/104,028, filed Aug. 16, 2018, Patented. [cited by applicant]
U.S. Appl. No. 16/104,035, filed Aug. 16, 2018, Patented. [cited by applicant]
U.S. Appl. No. 16/104,043, filed Aug. 16, 2018, Patented. [cited by applicant]
U.S. Appl. No. 16/115,055, filed Aug. 28, 2018, Patented. [cited by applicant]
U.S. Appl. No. 16/515,119, filed Jul. 18, 2019, Pending. [cited by applicant]
U.S. Appl. No. 16/515,151, filed Jul. 18, 2019, Pending. [cited by applicant]
U.S. Appl. No. 16/595,559, filed Oct. 8, 2019, Pending. [cited by applicant]
U.S. Appl. No. 16/717,369, filed Dec. 17, 2019, Pending. [cited by applicant]
U.S. Appl. No. 16/956,564, filed Jun. 20, 2020, Pending. [cited by applicant]
U.S. Appl. No. 16/956,576, filed Jun. 20, 2020, Pending. [cited by applicant]
U.S. Appl. No. 16/956,579, filed Jun. 20, 2020, Pending. [cited by applicant]
U.S. Appl. No. 16/956,580, filed Jun. 20, 2020, Pending. [cited by applicant]
U.S. Appl. No. 16/987,913, filed Aug. 7, 2020, Pending. [cited by applicant]
U.S. Appl. No. 16/988,011, filed Aug. 7, 20020, Pending. [cited by applicant]
U.S. Appl. No. 17/129,606, filed Dec. 21, 2020, Pending. [cited by applicant]
Schlosser, “Binding kinetics of water disinfection by-products,” Dissertation, Heidelberg University, 2018, pp. 36-37. [cited by applicant]
Mexican Institute of Industrial Property, Office Action in Mexican Patent Application No. MX/a/2020/014211 (May 6, 2024). [cited by applicant]
Taiwan Intellectual Property Office, Office Action in Taiwan Patent Application No. 109145567 (Jun. 11, 2024). [cited by applicant]
Japan Patent Office, Notification of Reasons for Refusal in Japanese Patent Application No. 2020-213765 (Dec. 11, 2024). [cited by applicant]
U.S. Appl. No. 17/551,371, Alkan et al., filed Dec. 15, 2021, Pending. [cited by applicant]
U.S. Appl. No. 17/551,547, Alkan et al., filed Dec. 15, 2021, Pending. [cited by applicant]
U.S. Appl. No. 18/191,076, Aepil et al., Mar. 28, 2023, Pending. [cited by applicant]
Mexican Institute of Industrial Property, Second Office Action in Mexican Patent Application No. MX/a/2020/014211 (Oct. 28, 2024). [cited by applicant]
Japan Patent Office, Notifice of Reasons for Refusal in Japanese Patent Application No. 2020-213765 (Jun. 4, 2025). [cited by applicant]